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Zeitschriftenartikel zum Thema „Embedded component“

Autor: Grafiati

Veröffentlicht am 8. Februar 2025

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1

Sun, Ruiqin, Guanzhong Yang, Dafang Zhang und Bowen Yang. „ECM: An Formal Embedded Component Model for Embedded System“. International Journal of Control and Automation 8, Nr. 6 (30.06.2015): 293–306. http://dx.doi.org/10.14257/ijca.2015.8.6.29.

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2

CAI, XIA, MICHAEL R. LYU und KAM-FAI WONG. „COMPONENT-BASED EMBEDDED SOFTWARE ENGINEERING: DEVELOPMENT FRAMEWORK, QUALITY ASSURANCE AND A GENERIC ASSESSMENT ENVIRONMENT“. International Journal of Software Engineering and Knowledge Engineering 12, Nr. 02 (April 2002): 107–33. http://dx.doi.org/10.1142/s0218194002000846.

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Embedded software is used to control the functions of mechanical and physical devices by dedicated digital signal processor and computers. Nowadays, heterogeneous and collaborative embedded software systems are widely adopted to engage the physical world. To make such software extremely reliable, very efficient and highly flexible, component-based embedded software development can be employed for the complex embedded systems, especially those based on object-oriented (OO) approaches. In this paper, we introduce a component-based embedded software framework and the features it inherits. We propose a quality assurance (QA) model for component-based embedded software development, which covers both the component QA and the system QA as well as their interactions. Furthermore, we propose a generic quality assessment environment for component-based embedded systems: ComPARE. ComPARE can be used to assess real-life off-the-shelf components and to evaluate and validate the models selected for their evaluation. The overall component-based embedded systems can then be composed and analyzed seamlessly.

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GAO, TONG, HUI MA, I.-LING YEN, LATIFUR KHAN und FAROKH BASTANI. „A REPOSITORY FOR COMPONENT-BASED EMBEDDED SOFTWARE DEVELOPMENT“. International Journal of Software Engineering and Knowledge Engineering 16, Nr. 04 (August 2006): 523–52. http://dx.doi.org/10.1142/s0218194006002872.

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The rapid growth in the demand for embedded systems and the increased complexity of embedded software pose an urgent need for advanced embedded software development techniques. Software technology is shifting toward semi-automated code generation and integration of systems from components. Component-based development (CBD) techniques can significantly reduce the time and cost for developing software systems. Furthermore, effective component retrieval is a fundamental issue in CBD. In this paper, we address the issues in designing software repositories for embedded software components. We develop an On-line Repository for Embedded Software (ORES) to facilitate component management and retrieval. ORES uses an ontology-based approach to facilitate repository browsing and effective search. To allow easy browsing of ORES, we analyze the typical ontology relations for software components and develop a Merging and Echoing technique to convert the ontology into a hierarchy suitable for browsing, but without the loss of any critical semantic information contained in the ontology. We also develop an algorithm for grouping search results based on the ontology. Thus, we can display search result groups to avoid having to display a large number of search results or having to prune the results and risk reducing the recall factor. Another important aspect in embedded software is the set of nonfunctional requirements and properties. In ORES, we develop an XML-based specification method to capture nonfunctional properties as well as functional characteristics of components and enable retrieval of relevant components based on these specifications.

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Campeanu, Gabriel, und Mehrdad Saadatmand. „A Two-Layer Component-Based Allocation for Embedded Systems with GPUs“. Designs 3, Nr. 1 (19.01.2019): 6. http://dx.doi.org/10.3390/designs3010006.

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Component-based development is a software engineering paradigm that can facilitate the construction of embedded systems and tackle its complexities. The modern embedded systems have more and more demanding requirements. One way to cope with such a versatile and growing set of requirements is to employ heterogeneous processing power, i.e., CPU–GPU architectures. The new CPU–GPU embedded boards deliver an increased performance but also introduce additional complexity and challenges. In this work, we address the component-to-hardware allocation for CPU–GPU embedded systems. The allocation for such systems is much complex due to the increased amount of GPU-related information. For example, while in traditional embedded systems the allocation mechanism may consider only the CPU memory usage of components to find an appropriate allocation scheme, in heterogeneous systems, the GPU memory usage needs also to be taken into account in the allocation process. This paper aims at decreasing the component-to-hardware allocation complexity by introducing a two-layer component-based architecture for heterogeneous embedded systems. The detailed CPU–GPU information of the system is abstracted at a high-layer by compacting connected components into single units that behave as regular components. The allocator, based on the compacted information received from the high-level layer, computes, with a decreased complexity, feasible allocation schemes. In the last part of the paper, the two-layer allocation method is evaluated using an existing embedded system demonstrator; namely, an underwater robot.

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Fillion, Ray. „Embedded Actives and Its Industry Effects“. International Symposium on Microelectronics 2011, Nr. 1 (01.01.2011): 000382–87. http://dx.doi.org/10.4071/isom-2011-tp5-paper5.

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Over the 60 plus year history of microelectronics packaging, electronic devices have been mounted onto an interconnect structure to form a microelectronics circuit. The devices could be bare chips, CSPs or packaged components such as SMT or thru-hole carriers. The interconnect structures could be circuit boards, ceramic substrates or flex circuits. This methodology has enabled a clear divide between the fabrication, assembly and test of the semiconductor device, the fabrication and test of the interconnect structure and the assembly and test of the component/substrate assembly. Over the past decade a new packaging methodology, embedded actives (chips), has been developed that changes all of these industry norms. In an embedded actives packaging approach, one or more bare or chip scale semiconductor devices are embedded within the interconnect structure. Although these approaches have significant electrical performance, size and cost benefits, the normal barriers between chip packaging, substrate fabrication and component assembly are removed. The interconnect structure is not completed prior to component embedding and the embedded component cannot be tested at packaged part level without the interconnect structure. This complicates electrical testing and makes it virtually impossible to differentiate between a defective component, a defective interconnect or a defective component to substrate contact. This paper will look at the history of embedded active developments and go into the various processes and structures being used. It will cover their electrical, reliability and size advantages and will address the revolutionary changes that the microelectronics industry must make to effectively utilize these technologies.

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Progonov, Dmytro. „Detection of Stego Images with Adaptively Embedded Data by Component Analysis Methods“. Advances in Cyber-Physical Systems 6, Nr. 2 (17.12.2021): 146–54. http://dx.doi.org/10.23939/acps2021.02.146.

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Ensuring the effective protection of personal and corporate sensitive data is topical task today. The special interest is taken at sensitive data leakage prevention during files transmission in communication systems. In most cases, these leakages are conducted by usage of advance adaptive steganographic methods. These methods are aimed at minimizing distortions of cover files, such as digital images, during data hiding that negatively impact on detection accuracy of formed stego images. For overcoming this shortcoming, it was proposed to pre-process (calibrate) analyzed images for increasing stego- to-cover ratio. The modern paradigm of image calibration is based on usage of enormous set of high-pass filters. However, selection of filter(s) that maximizes the probability of stego images detection is non-trivial task, especially in case of limited a prior knowledge about embedding methods. For solving this task, we proposed to use component analysis methods for image calibration, namely principal components analysis. Results of comparative analysis of novel maxSRMd2 cover rich model and proposed solution showed that principal component analysis allows increasing detection accuracy up to 1.5% even in the most difficult cases (low cover image payload and absence of cover- stego images pairs in training set).

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Kim, Hyunho. „Passive device embedded substrate for application of RF module“. Circuit World 42, Nr. 2 (03.05.2016): 84–88. http://dx.doi.org/10.1108/cw-07-2015-0033.

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Purpose The purpose of this study is to form fabrication and electrical characteristics of passive device embedded substrate that is embedded chip bead inductor and chip capacitor inside substrate for the application of radio frequency (RF) modules. Design/methodology/approach Passive device embedded substrate was fabricated using embedding process that consists of lamination process, laser drilling at the electrode Cu pads of passive components, electro-less Cu plating formation process such as photolithography, electrolytic Cu plating and etching. Impedance and capacitance characteristics of the fabricated passive device embedded substrate were evaluated. Findings By checking what embedded components are placed in the appropriate place using failure analysis via connection performance between copper plane and embedded components was verified. For measuring electrical characteristics of the fabricated passive device embedded substrate, the evaluation was done using test methods like continuity test for checking interconnections which are not connected to any embedded components and in-circuit test for checking interconnections which are connected to any embedded component. From in-circuit testing for embedding passive components with series and parallel circuits, the authors verified how to test passive device embedded substrate by using capacitance and impedance measurement with the comparison of measured results between good samples and bad samples. Originality/value Ultra miniaturized and low-profile mobile products are driving the need for embedded passive component integration technologies using a novel manufacturing-compatible organic substrate and interconnect technologies. Fabrication and test methods for passive device embedded substrate described in this paper are expected to lead to be developed to make quality measurable for the application of RF modules.

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Qi, Feng, Jie Ying Jiang, Hiroshi Oyama, Hiroaki Nagashima und Takuya Azumi. „ECHONET Lite Framework Based on Embedded Component Systems“. ECTI Transactions on Computer and Information Technology (ECTI-CIT) 16, Nr. 1 (12.03.2022): 74–83. http://dx.doi.org/10.37936/ecti-cit.2022161.245976.

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The large number and many types of electrical equipment in modern house-holds pose major challenges to developers. To increase the breadth of smart homes, improving the development e°ciency of electrical equipment in smart homes is essential. The present research proposes a development method based on embedded components for devices in smart homes. Besides improving the development e°ciency, this method of development reduces the developmental complexity and increases the scalability of elec-trical equipment. The smart home devices are developed and controlled in TOPPERS Embedded-Component System (TECS), a component description language that automatically generates template C ˝les when expand-ing new components or functions. Using the ECHONET Lite plugin, TECS then reads the parameters of the electrical device in the device description ˝le (JSON ˝), and outputs the function parameters for implementation by the developer. The evaluation shows that the code automatically gen-rated by the plugin slows down the software execution time by only 2%compared with the default, thus improving the software development efficiency.

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Sanz, Ricardo, Carlos Martínez, Manuel Rodríguez und Adolfo Hernando. „Embedded Component Technology for Complex Control Systems“. IFAC Proceedings Volumes 41, Nr. 2 (2008): 6897–902. http://dx.doi.org/10.3182/20080706-5-kr-1001.01169.

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10

Silva Filho, Antonio Mendes da, und Ivanilton Polato. „Component behavior-based adaptation in embedded software“. Innovations in Systems and Software Engineering 2, Nr. 3-4 (22.09.2006): 113–19. http://dx.doi.org/10.1007/s11334-006-0005-9.

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11

Angelov, Christo, Wei Guan, Nicolae Marian, Feng Zhou, Krzysztof Sierszecki und Søren Top. „Component-based analysis of embedded control applications“. Innovations in Systems and Software Engineering 8, Nr. 1 (31.08.2011): 79–92. http://dx.doi.org/10.1007/s11334-011-0156-1.

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12

Lenzini, Gabriele, Andrew Tokmakoff und Johan Muskens. „Managing Trustworthiness in Component-based Embedded Systems“. Electronic Notes in Theoretical Computer Science 179 (Juli 2007): 143–55. http://dx.doi.org/10.1016/j.entcs.2006.08.038.

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13

Dyakov, Oleg N. „Special embedded software of trusted electronic component“. Bezopasnost informacionnyh tehnology 31, Nr. 4 (November 2024): 67–86. http://dx.doi.org/10.26583/bit.2024.4.04.

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14

Diessner, Rhett, Nellie Frost und Titus Smith. „DESCRIBING THE NEOCLASSICAL PSYCHE EMBEDDED IN STERNBERG'S TRIANGULAR THEORY OF LOVE“. Social Behavior and Personality: an international journal 32, Nr. 7 (01.01.2004): 683–90. http://dx.doi.org/10.2224/sbp.2004.32.7.683.

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sternberg's Triangular Theory of Love was examined to identify the structure of the psyche implied in that theory. Sternberg's theory posits three components of human functioning to explain the phenomenon of love in close relationships: intimacy, passion, and commitment. Analysis of these three components indicates that they align with a neoclassical model of the human psyche. A neoclassical psyche consists of at least three fundamental, irreducible capacities: cognition, affect, and conation. Sternberg's commitment component relies on the capacity for cognition (and conation), the passion component is derived from conation (and affect), and the intimacy component is derived from emotional investment or the capacity for affect (and cognition). Therefore, Sternberg's overall Triangular Theory of Love ontologically presupposes a neoclassical structure to the psyche.

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Li, Ding, Xie Jing-zhu und Pu Yao. „Research on Technology of Low-cost Flight Control Components for Intelligent Ammunition“. Journal of Physics: Conference Series 2460, Nr. 1 (01.04.2023): 012165. http://dx.doi.org/10.1088/1742-6596/2460/1/012165.

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Abstract The flight control component is a complex embedded computer system integrating navigation solution, control calculation and rudder control calculation, which is the core component of intelligent ammunition flight control system. Through the analysis and comparison of the hardware interface and operational capability requirements of flight control components of different guidance systems, the results show that the guidance system is the key factor affecting the overall structure of flight control components, then summarize the typical embedded processor type and peripheral interface mode in product performance and cost, and propose the design process and design principle of low-cost flight control components of intelligent ammunition.

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Jawawi, Dayang N. A., Rosbi Mamat und Safaai Deris. „A Component-Oriented Programming for Embedded Mobile Robot Software“. International Journal of Advanced Robotic Systems 4, Nr. 3 (01.09.2007): 40. http://dx.doi.org/10.5772/5678.

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Applying software reuse to many Embedded Real-Time (ERT) systems poses significant challenges to industrial software processes due to the resource-constrained and real-time requirements of the systems. Autonomous Mobile Robot (AMR) system is a class of ERT systems, hence, inherits the challenge of applying software reuse in general ERT systems. Furthermore, software reuse in AMR systems is challenged by the diversities in terms of robot physical size and shape, environmental interaction and implementation platform. Thus, it is envisioned that component-based software engineering will be the suitable way to promote software reuse in AMR systems with consideration to general requirements to be self-contained, platform-independent and real-time predictable. A framework for component-oriented programming for AMR software development using PECOS component model is proposed in this paper. The main features of this framework are: (1) use graphical representation for components definition and composition; (2) target C language for optimal code generation with resource-constrained micro-controller; and (3) minimal requirement for run-time support. Real-time implementation indicates that, the PECOS component model together with the proposed framework is suitable for resource constrained embedded AMR systems software development.

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YANG, STEPHEN J. H., JEFFREY J. P. TSAI und IRENE CHEN. „DEVELOPMENT OF WIRELESS EMBEDDED SYSTEMS USING COMPONENT BASED SOFTWARE“. International Journal of Software Engineering and Knowledge Engineering 12, Nr. 02 (April 2002): 135–53. http://dx.doi.org/10.1142/s0218194002000871.

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Many mobile and wireless devices are connecting to the Internet nowadays, among them, mobile phones and PDAs are the most popular ones. Thus, in this paper, we will focus on how to develop embedded software running on the two devices by using design patterns and Java based software components. Notably, some components may be used directly in an embedded software system, whereas most components must be specialized prior to reuse. Developers have to identify the variation points on these components. In order to develop a reusable embedded software system, we will identify several variation points with some variants, and introduce some useful design patterns for implementing variation points. Consequently, we can customize an embedded software system just through attaching variants on corresponding variation point in our system. The design patterns we are using are property container, strategy, decorator, and model-view-controller. The component technology we are using is J2ME. J2ME is a specification focused on the development of mobile applications. It provides a similar environment as standard Java environment. J2ME's components programming includes the Spotlet programming for PDA, and the MIDlet programming for Java phone. In addition, along with the XML, J2ME can also provide the XMIDlet programming for dynamic downloading and execution of XML-based applications for PDA and Java phones.

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Kimmet, James S. „Auto-Generated Coherent Data Store for ConcurrentModular Embedded Systems“. ACM SIGAda Ada Letters 41, Nr. 1 (28.10.2022): 74–77. http://dx.doi.org/10.1145/3570315.3570321.

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A thread-safe data store has been developed to enforce interface consistency and shared data coherency in a concurrent modular embedded real-time system. Typical messaging techniques may not provide optimal data transfer between software components in all embedded systems, especially if there is a high degree of data interdependency as the number of components increases. The data store paradigm reduces the overall communication load by providing finer data item granularity, and eliminating the copy and transfer of unused message content. The data store described in this paper is implemented with code auto-generation and provides compile-time error checking, ensuring effortless data integrity by automatically rebuilding when software component interfaces are changed. The data store has been successfully employed to rehost a highly-coupled legacy software application into a more modularized component architecture.

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Xu, Xiaoxu, Jiafeng Lyu und Shen Yan. „A Component Method for Full-Range Behaviour of Embedded Steel Column Bases“. Buildings 14, Nr. 8 (28.07.2024): 2337. http://dx.doi.org/10.3390/buildings14082337.

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This paper introduces a component model for analysing embedded column bases to predict rotational stiffness, moment resistance, and the full-range moment–rotation response. The key components identified include the embedded column, concrete in compression on the column side, concrete in compression beneath the base plate, concrete in punching shear above the base plate, and anchor bolts. The embedded column is modelled as a Timoshenko beam, considering both shear and flexural deformations, while other components are represented by springs. Methods are provided for determining their uniaxial constitutive behaviour. A simplified iterative solution method is proposed, where the embedded column is further simplified into three rigid segments to specifically address shear and bending deformations. A corresponding simplified finite element model is developed for accurate numerical solutions. The validity of the component model is confirmed through comparisons with the results of existing tests and refined solid finite element analysis for H-steel column bases. The simplified iterative solution method effectively predicts strength but underestimates the stiffness of deeply embedded column bases. This is due to the trilinear deformation pattern simplification, which concentrates flexural deformation at the upper bearing stress resultant force point, leading to an overestimation of steel column rotation on the foundation surface.

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Xu, Min, und XingHua Lu. „Software fault location technology under terminal embedded component“. Journal of Physics: Conference Series 1885, Nr. 2 (01.04.2021): 022046. http://dx.doi.org/10.1088/1742-6596/1885/2/022046.

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21

Gharbi, Atef, Mohamed Khalgui und Hans-Michael Hanisch. „Functional Safety of Component-based Embedded Control Systems“. IFAC Proceedings Volumes 42, Nr. 5 (Juni 2009): 281–86. http://dx.doi.org/10.3182/20090610-3-it-4004.00053.

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22

Hasegawa, Ryo, Naofumi Yawata, Noriaki Ando, Nobuhiko Nishio und Takuya Azumi. „Embedded Component-based Framework for Robot Technology Middleware“. Journal of Information Processing 25 (2017): 811–19. http://dx.doi.org/10.2197/ipsjjip.25.811.

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23

Campeanu, Gabriel, Jan Carlson und Séverine Sentilles. „Component-based development of embedded systems with GPUs“. Journal of Systems and Software 161 (März 2020): 110488. http://dx.doi.org/10.1016/j.jss.2019.110488.

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24

Lingfeng Wang. „Component-based performance-sensitive real-time embedded software“. IEEE Aerospace and Electronic Systems Magazine 23, Nr. 1 (Januar 2008): 28–34. http://dx.doi.org/10.1109/aes-m.2008.4444486.

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25

Costa, Paolo, Geoff Coulson, Cecilia Mascolo, Luca Mottola, Gian Pietro Picco und Stefanos Zachariadis. „Reconfigurable Component-based Middleware for Networked Embedded Systems“. International Journal of Wireless Information Networks 14, Nr. 2 (21.02.2007): 149–62. http://dx.doi.org/10.1007/s10776-007-0057-2.

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26

Polato, Ivanilton, und Antonio M. Silva Filho. „A Component-based Approach to Embedded Software Design“. Electronic Notes in Theoretical Computer Science 160 (August 2006): 255–73. http://dx.doi.org/10.1016/j.entcs.2006.05.027.

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27

Ma, Huaicheng, Jingran Li, Jinfeng Huang, Ruijian Wang, Rui Ge und Feibin Zhang. „Adaptive Embedded Flexible Tensor Singular Spectrum Decomposition“. Electronics 14, Nr. 1 (25.12.2024): 21. https://doi.org/10.3390/electronics14010021.

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To address the difficulty in extracting fault features from dual-channel signals, this work proposes a multichannel signal fusion processing method based on Flexible Tensor Singular Spectrum Decomposition (FTSSD) with adaptive embedding dimension selection. Firstly, the optimal embedding dimension of the trajectory tensor is adaptively determined using the proposed Trajectory Dimension Ratio (TDR) index. Once the optimal embedding dimension is obtained, the multichannel signals are represented as an optimal trajectory tensor. Then, FTSSD is employed to decompose the tensor and extract feature component signals. Moreover, by setting a residual threshold or maximum number of components to control the iterative process, the precision and rationality of the decomposition are ensured. Finally, all component signals are reconstructed, and their waveforms and spectra are comprehensively analyzed. The experimental results demonstrate that the proposed adaptive embedding FTSSD algorithm achieves a high accuracy and robustness in multichannel signal decomposition and feature extraction, making it suitable for the multicomponent analysis of complex dynamic signals such as mechanical fault diagnosis and vibration analysis.

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Hong, Soon Jik, S. Patil, Chang Kyu Rhee und S. Seal. „Consolidation and Mechanical Properties of Near-Net-Shape Al-21 wt.% Si Component Fabricated by Plasma Spray Forming“. Solid State Phenomena 119 (Januar 2007): 183–86. http://dx.doi.org/10.4028/www.scientific.net/ssp.119.183.

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The microstructure and mechanical properties of Al-21 wt% Si components fabricated by plasma spray forming are analyzed. The microstructure of the plasma spry formed component showed a homogeneous distribution of fine Si particles embedded in the Al matrix. The grain size of α-Al varied between 200 to 500 nm and the size of the Si particles was about 50 to 100 nm in the plasma spray formed component. The room temperature tensile strength of the plasma spray formed component was 215 MPa with 0.5 % elongation, while for cast material, it was 130 MPa. Despite the porosities, the ultra-fine microstructure and homogeneous distribution of Si particles embedded in matrix are the foundation of the increased strength of the plasma spry formed component.

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Shin, Youngsoo, Kiyoung Choi und Takayasu Sakurai. „Power-conscious Scheduling for Real-time Embedded Systems Design“. VLSI Design 12, Nr. 2 (01.01.2001): 139–50. http://dx.doi.org/10.1155/2001/23925.

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Power efficient design of real-time embedded systems based on programmable processors becomes more important as system functionality is increasingly realized through software. We address a power optimization method for real-time embedded applications on a variable speed processor. The method combines off-line and on-line components. The off-line component determines the lowest possible maximum processor speed while guaranteeing deadlines of all tasks. The on-line component dynamically varies the processor speed or bring a processor into a power-down mode to exploit execution time variations and idle intervals. Experimental results show that the proposed method obtains a significant power reduction across several kinds of applications.

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Murugan, Muthuvel, Michael Walock, Anindya Ghoshal, Robert Knapp und Roger Caesley. „Embedded Temperature Sensor Evaluations for Turbomachinery Component Health Monitoring“. Energies 14, Nr. 4 (06.02.2021): 852. http://dx.doi.org/10.3390/en14040852.

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Current rotorcraft gas turbine engines typically use titanium alloys and steel for the compressor section and single-crystal nickel superalloys for the hot-section turbine stator vanes and rotor blades. However, these material selections are rapidly changing due to increased requirements of power-density and efficiency. Future U.S. Army gas turbine engines will be using ceramic matrix composites for many high temperature engine components due to their low density and improved durability in high temperature environments. The gas turbine industry is also actively developing adaptive concept technologies for production and assembly of modular gas turbine engine components with integrated sensing. In order to actively monitor engine components for extended seamless operation and improved reliability, it is essential to have intelligent embedded sensing to monitor the health of critical components in engines. Under this U.S. Army Foreign Technology Assessment Support (FTAS) program funded research project, embedded fiber-optic temperature sensors from U.K.-based company, Epsilon Optics Ltd (Fordingbridge, UK)., were experimentally evaluated to measure temperature responses on typical turbomachinery component material coupons. The temperature responses from this foreign technology sensor were assessed using a thermomechanical fatigue tester with a built-in furnace to conduct thermal cycling durability experiments. The experimental results obtained from the durability performance of this embedded fiber Bragg sensor are reported in this paper. This sensor technology, upon maturation to higher TRL (technology readiness level), can greatly reduce the lifecycle cost of future U.S. Army gas turbine engines.

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Lin, Zhen Xian, Yuan Sheng Li und Jian Tao Li. „An Improved QIM Watermarking Algorithm“. Applied Mechanics and Materials 644-650 (September 2014): 4641–44. http://dx.doi.org/10.4028/www.scientific.net/amm.644-650.4641.

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Put forward an improved QIM watermark embedding algorithm. The carrier image is transformed into YCbCr space, lifting wavelet transform the three components, then using the QIM quantization method embeds watermark into high frequency coefficients of Cb and Cr component, and Y component of low frequency coefficients. The experimental results show that embedded watermark which using improved algorithm has good invisibility. Anti attack test results show that after using common attack method attack the image embedded watermark, it can still extract the watermark completely. The anti-attack performance of improved QIM algorithm is much better than texture watermarking algorithm based on DCT.

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Wegert, Zachary J., Anthony P. Roberts, Tirthankar Bandyopadhyay und Vivien J. Challis. „Optimisation of a Multi-Functional Piezoelectric Component for a Climbing Robot“. Materials 16, Nr. 14 (18.07.2023): 5076. http://dx.doi.org/10.3390/ma16145076.

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Force sensors on climbing robots give important information to the robot control system, however, off-the-shelf sensors can be both heavy and bulky. We investigate the optimisation of a lightweight integrated force sensor made of piezoelectric material for the multi-limbed climbing robot MAGNETO. We focus on three design objectives for this piezoelectric component. The first is to develop a lightweight component with minimal compliance that can be embedded in the foot of the climbing robot. The second objective is to ensure that the component has sensing capability to replace the off-the-shelf force sensor. Finally, the component should be robust for a range of climbing configurations. To this end, we focus on a compliance minimisation problem with constrained voltage and volume fraction. We present structurally optimised designs that satisfy the three main design criteria and improve upon baseline results from a reference component. Our computational study demonstrates that the optimisation of embedded robotic components with piezoelectric sensing is worthy of future investigation.

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Dai, Hong-jun, Tian-zhou Chen und Chun Chen. „CCPA: Component-Based Communication Protocol Architecture for embedded systems“. Journal of Zhejiang University-SCIENCE A 6, S1 (August 2005): 79–86. http://dx.doi.org/10.1631/jzus.2005.as0079.

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ANDO, Noriaki, Ken'ichi OHARA, Takashi SUZUKI und Kohtaro OHBA. „RTC-Lite: Lightweight RT-Component for Distributed Embedded Systems“. SICE Journal of Control, Measurement, and System Integration 2, Nr. 6 (2009): 328–33. http://dx.doi.org/10.9746/jcmsi.2.328.

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Sukmana, Husni Teja, Jeong-Bae Lee, Kee-Wook Rim, Young-Sup Hwang, Young-Jin Kim und Sung-Soon Ahn. „Embedded System Integrated Prototyping Mechanism Based on Reusable Component“. KIPS Transactions:PartA 16A, Nr. 3 (30.06.2009): 199–208. http://dx.doi.org/10.3745/kipsta.2009.16-a.3.199.

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Spagnolo, Fanny, Fabio Frustaci, Stefania Perri und Pasquale Corsonello. „An Efficient Connected Component Labeling Architecture for Embedded Systems“. Journal of Low Power Electronics and Applications 8, Nr. 1 (06.03.2018): 7. http://dx.doi.org/10.3390/jlpea8010007.

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37

Cue, R. I. „Variance-covariance component estimation for uni-variate embedded traits“. Journal of Animal Breeding and Genetics 103, Nr. 1-5 (12.01.1986): 334–41. http://dx.doi.org/10.1111/j.1439-0388.1986.tb00095.x.

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Santos, Julio Cesar dos, Luiz Eduardo Schardong Spalding und Marcelo Trindade Rebonatto. „Hardware analysis for upgrading the embedded component of Protegemed“. IEEE Latin America Transactions 18, Nr. 01 (Januar 2020): 171–77. http://dx.doi.org/10.1109/tla.2020.9049475.

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Jahnke, Jens H. „Engineering component-based net-centric systems for embedded applications“. ACM SIGSOFT Software Engineering Notes 26, Nr. 5 (September 2001): 218–28. http://dx.doi.org/10.1145/503271.503239.

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Cimatti, Alessandro, und Stefano Tonetta. „Contracts-refinement proof system for component-based embedded systems“. Science of Computer Programming 97 (Januar 2015): 333–48. http://dx.doi.org/10.1016/j.scico.2014.06.011.

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Suresh, Rupali, Swee Chuan Tjin und S. Bhalla. „Multi-component force measurement using embedded fiber Bragg grating“. Optics & Laser Technology 41, Nr. 4 (Juni 2009): 431–40. http://dx.doi.org/10.1016/j.optlastec.2008.08.004.

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42

Jeong, Hwa Young, und Yoon Ho Kim. „A Quality Model of Lightweight Component for Embedded System“. Applied Mechanics and Materials 121-126 (Oktober 2011): 4907–11. http://dx.doi.org/10.4028/www.scientific.net/amm.121-126.4907.

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There are many researches about quality model for general system or information system. That is, it has necessary to know what the important criterion to system benefit is. However, it has lack to research of quality model in the area of embedded system. This article aimed to address quality model for embedded system. For this purpose, we construct each criteria from exist quality model, DeLone and McLean quality model for success information system. And we also depicted quality model network to consider the relation with influence between them.

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Lam, David C. C. „Embedded Passives: 3-D Integrated Component Printed Circuit Boards“. HKIE Transactions 10, Nr. 4 (Januar 2003): 42–49. http://dx.doi.org/10.1080/1023697x.2003.10667929.

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Pop, Tomáš, Petr Hnětynka, Petr Hošek, Michal Malohlava und Tomáš Bureš. „Comparison of component frameworks for real-time embedded systems“. Knowledge and Information Systems 40, Nr. 1 (02.04.2013): 127–70. http://dx.doi.org/10.1007/s10115-013-0627-9.

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45

Chen, Jin, Long Li Bao, Ya Yun Yu und Fang Ding. „Design of the Embedded RLC Measurement Module“. Applied Mechanics and Materials 716-717 (Dezember 2014): 898–901. http://dx.doi.org/10.4028/www.scientific.net/amm.716-717.898.

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Based on the frequency measurement principle, an embedded RLC measurement module was designed in this paper. By the RC oscillator circuit and LC three-point oscillator circuit, the R, L, C analog parameters can be converted into a digital frequency for single-chip computer processing, according to the relationship between a function of frequency and component parameters, the RLC components corresponding parameter values is calculated. Experimental results showed that the RLC module has an automatic conversion range, high precision, enabling network connections and so on. It can be applied to management and fault monitoring and forecasting power transmission lines, oil and gas pipelines and submarine cables and other important public facilities.

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Kaderavek, Joan N., und Laura M. Justice. „Embedded-Explicit Emergent Literacy Intervention II“. Language, Speech, and Hearing Services in Schools 35, Nr. 3 (Juli 2004): 212–28. http://dx.doi.org/10.1044/0161-1461(2004/021).

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This article, the second in a two-part series, provides guidance to speech-language pathologists (SLPs) for implementing the explicit component of the embedded-explicit emergent literacy intervention model for at risk preschool and kindergarten children. The explicit component refers to the provision of regular structured therapeutic interactions that intentionally target critical emergent literacy goals. This article describes fundamental principles of explicit literacy instruction, identifies literacy domains targeted as part of explicit literacy instruction, and presents examples of how early childhood classrooms can be organized to implement the embedded-explicit model.

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Gharbi, Atef, Hamza Gharsellaoui und Mohamed Khalgui. „Real-Time Reconfigurations of Embedded Control Systems“. International Journal of System Dynamics Applications 5, Nr. 3 (Juli 2016): 71–93. http://dx.doi.org/10.4018/ijsda.2016070104.

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This paper deals with the study of the reconfiguration of embedded control systems with safety following component-based approaches from the functional level to the operational level. The authors define the architecture of the Reconfiguration Agent which is modelled by nested state machines to apply local reconfigurations. They propose in this journal paper technical solutions to implement the whole agent-based architecture, by defining UML meta-models for both Control Components and also agents. To guarantee safety reconfigurations of tasks at run-time, they define service and reconfiguration processes for tasks and use the semaphore concept to ensure safety mutual exclusions. As a method to ensure the scheduling between periodic tasks with precedence and mutual exclusion constraints, the authors apply the priority ceiling protocol.

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Dirker, J., J. D. van Wyk und J. P. Meyer. „Cooling of Power Electronics by Embedded Solids“. Journal of Electronic Packaging 128, Nr. 4 (21.12.2005): 388–97. http://dx.doi.org/10.1115/1.2351903.

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Thermal issues have become a major consideration in the design and development of electronic components. In power electronics, thermal limitations have been identified as a barrier to future developments such as three-dimensional integration. This paper proposes internal embedded cooling of high-density integrated power electronic modules that consist of materials with low thermal conductivity and evaluates it in terms of dimensional, material property, and thermal interfacial resistance ranges. Enhanced component conductivity was identified as a possible economically viable internal cooling option. Thermal performance calculations were performed numerically for conductive cooling of internal component/module regions via parallel-running embedded solids. Thermal advantage per volume usage by the embedded solids was furthermore optimized in terms of a wide range of geometric, material, and thermal parameters. In the dimensional and material property range commonly found in passive power electronic modules, parallel-running cooling layers were identified as an efficient cooling configuration. Numerically based thermal performance models were subsequently developed for parallel-running cooling inserts. A multifunctional experimental setup was constructed to study the cooling of ferrite (operated as a magnetic core) by means of embedded aluminium nitride layers and to verify the thermal model. Results corresponded well with theoretically anticipated performance increases. However, interfacial thermal resistance constituted a major limitation to the cooling performance and future power density increases. With the thermal model developed, functional optimization in terms of magnetic flux density for parallel-running cooling layer configurations was performed for a wide range of material and geometric conditions.

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Xu, Shu Ping, Jun Li und Yu Feng Zhao. „The Remote PLC Control System Based on the Embedded Web Server“. Applied Mechanics and Materials 556-562 (Mai 2014): 2321–24. http://dx.doi.org/10.4028/www.scientific.net/amm.556-562.2321.

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Since the resource of the sever in embedded remote control system is limited, an approach is presented which use CGI and XML technology to realize remote monitoring computer and embedded Web server for dynamic interaction. Combined with the basic requirements of embedded remote control system, the idea of component design is proposed, the major components of system functions are defined. According to the system functional requirement, the software is designed and realized. The practice prove , the scheme realize the remote control of the transmitter by the small cost . And the system is convenient and safe. The definite reference value is offered to the offspring complex remote control system.

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Chen, Ming, Shangguan Li und Jianhua Lyu. „Effects of selected joint parameters on tensile strength of steel bolt-nut connections in Cupressus funebris wood“. BioResources 14, Nr. 3 (13.05.2019): 5188–211. http://dx.doi.org/10.15376/biores.14.3.5188-5211.

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The influences of various factors on the tensile strength loading caused by steel bolt-nut connections on Cupressus funebris wood components in directions perpendicular and parallel to the grain were studied. The focus was the interference fit parameter between the nut and the pre-drilling hole, the nut embedded depth, and the embedded nut diameter using the single factor method. The optimum parameters for bolt-nut connections with C. funebris wood components both perpendicular and parallel to the grain component structures were obtained via a single factor experiment and verified by simulation using ANSYS finite element analysis software. The experimental and simulation-based results revealed that the optimum parameters with maximum tensile strength for the bolt-nut connections with C. funebris wood components were an interference fit of -0.80 mm, a nut embedded depth of 25 mm, and an embedded nut diameter of 15.5 mm. Considering the needs of practical applications, the optimum interference fit parameter between the nut and pre-drilling hole was -0.80 mm, increasing the length of the nut within the allowable range of part size was beneficial, and it was not suitable to increase the diameter of the embedded nut to improve the part’s performance.

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