Dissertationen zum Thema „Electronic interface circuits“
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So, Biu 1959. „THE METHODOLOGY AND IMPLEMENTATION OF RELAXATION METHOD TO INVESTIGATE ELECTRO-THERMAL INTERACTIONS IN SOLID-STATE INTEGRATED CIRCUITS“. Thesis, The University of Arizona, 1987. http://hdl.handle.net/10150/276384.
Der volle Inhalt der QuelleHonghao, Tang. „A Study on Interface Circuits for Piezoelectric Energy Harvesting“. Thesis, Linköpings universitet, Elektroniska Kretsar och System, 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-144497.
Der volle Inhalt der QuelleRahim, Md Sayed Kaysar Jaeger Richard C. Suhling J. C. „Die stress characterization and interface delamination study in flip chip on laminate assemblies“. Auburn, Ala., 2005. http://repo.lib.auburn.edu/2005%20Summer/doctoral/RAHIM_MD_37.pdf.
Der volle Inhalt der QuelleCHáVEZ, YZQUIERDO Jhordan. „Semi-passive conditionning circuits for efficient electrostatic energy harvesting“. Electronic Thesis or Diss., université Paris-Saclay, 2024. http://www.theses.fr/2024UPAST185.
Der volle Inhalt der QuelleThe thesis explores small-scale energy harvesting, focusing on electrostatic energy harvesting circuits. It aims to convert ambient energy into electricity to sustainably power electronic devices and sensors, especially in remote or inaccessible locations.This technology could replace traditional batteries, which suffer from leaks, limited capacity, and sensitivity to temperature fluctuations. It extends the lifespan of devices and reduces the need for frequent recharges, which is crucial for the Internet of Things (IoT). Energy harvesting technologies support the autonomy and flexibility of IoT deployments, reducing maintenance costs and enabling real-time monitoring and predictive maintenance.The thesis analyzes the state of the art in electrostatic energy harvesting circuits, focusing on their efficiency and practical implementation through QV (charge-voltage) diagrams. Rectangular QV cycle circuits, although simple, are less efficient, while triangular QV cycle circuits offer better performance but are more complex to implement.An innovative approach combines the advantages of both types of circuits, proposing a semi-passive technique where the transducer's charge and discharge are synchronized with structural movement, using controllable switches to maintain triangular cycles. This balance between simplicity and efficiency is a key contribution of this research.The thesis also explores various types of transducers for electrostatic energy harvesting. MEMS transducers offer high precision and miniaturization but they face efficiency issues at high frequencies. Polymer-based capacitors achieve high capacitance but they have lot of energy loss on the transducer itself. Flapping capacitors efficiently convert vibrational energy but require precise mechanical design. Adjustable Metal Capacitors, used in resonant circuits, are simple to implement and they have moderate energy loss (on the transducer itself), making them a reliable option for the developed circuits. Thus, the Adjustable Metal Capacitor is chosen to validate the developed circuits.A particular aspect of the thesis is the exploration of the photocapacitive element, using light-sensitive materials to convert light energy into electricity. Initially designed as a variable capacitor, experiments showed that this element functions primarily as a current generator when exposed to light. Tests with the Bennet doubler circuit revealed that the transducer generates current without an applied bias voltage, suggesting a different operating mode that could be further explored.The research introduces the SCDI method (Synchronized Charge and Discharge on Inductance), balancing simplicity and efficiency in energy conversion. This method synchronizes charge and discharge cycles through an inductance, improving the conversion of mechanical vibrations into electrical energy. Tests showed that the SCDI method could convert about 1 µJ of energy per cycle (with a 60V storage component), requiring low-loss transducers for efficient energy transfer.Building on the SCDI method, the thesis presents the SCDIP technique (Synchronized Charge and Discharge on Inductance with Positive Cycle), using only a positive QV cycle to further improve efficiency. This method reduces energy losses in the transducer, significantly enhancing energy harvesting performance compared to the SCDI method
DOMIENIKAN, CLAUDIO. „interface eletronica para aquisicao de 12 espectros de coincidencias gama-gama atrasadas“. reponame:Repositório Institucional do IPEN, 2001. http://repositorio.ipen.br:8080/xmlui/handle/123456789/10889.
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Dissertacao (Mestrado)
IPEN/D
Instituto de Pesquisas Energeticas e Nucleares - IPEN/CNEN-SP
Yamamoto, Silas Demmy. „Integração de sistema transceptor de 60 GHz para aplicações sem fio de interface multimídia de alta definição“. [s.n.], 2011. http://repositorio.unicamp.br/jspui/handle/REPOSIP/259229.
Der volle Inhalt der QuelleDissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Engenharia Elétrica e de Computação
Made available in DSpace on 2018-08-18T12:44:03Z (GMT). No. of bitstreams: 1 Yamamoto_SilasDemmy_M.pdf: 5306597 bytes, checksum: 9dd3930c43415f31bf913b4d374c25eb (MD5) Previous issue date: 2011
Resumo: O trabalho intitulado Integração de Sistema Transceptor de 60 GHz para Aplicações Sem Fio de Interface Multimídia de Alta Definição (Wireless HDMI) foi realizado na empresa STMicroelectronics (França), no departamento de P&D de Tecnologia / CAD Central e Soluções, como requisito para a obtenção do título de mestre. O objetivo deste trabalho foi de pesquisar e propor uma integração de sistema do tipo Sistema no Empacotamento (SiP ou System in Package) a nível industrial, com o desenvolvimento de um Módulo de Múltiplos Chips (MCM ou Multi-Chip Module) de camadas cerâmicas com tecnologia Cerâmica Cossinterizada sob Alta Temperatura (HTCC), integrando componentes de diferentes tecnologias - um circuito integrado CMOS 65 nm, um circuito integrado monolítico de micro-ondas (MMIC) de Arseneto de Gálio (GaAs) comercial e antenas IPD (Dispositivo de Integração Passiva) de vidro. Além disso foram desenvolvidas técnicas de projeto de integração na tecnologia HTCC, atendendo-se às regras para fabricação e montagem industrial. Utilizaram-se no projeto ferramentas software de projeto de simulação elétrica e eletromagnética, resultando no módulo com área de 13 x 8 mm2 e 1,12 mm de espessura incluindo os componentes. Nas linhas de transmissão do sinal a 60 GHz e de banda base foram medidas perdas de inserção de 1,0 dB/mm e 0,6 dB respectivamente. A antena integrada no módulo apresentou um ganho mínimo de 6 dBi (de 53,5 a 59,5 GHz), com perda de retorno maior que 10 dB (de 51 a 63 GHz) e um pequeno deslocamento em relação à banda especificada. Os resultados de medição de algumas amostras demonstraram que a tecnologia HTCC, para integração do sistema, é viável tanto em termos de desempenho, quanto nos aspectos industrial e comercial, mesmo antes da análise da montagem e desempenho do MMIC HPA e do sistema
Abstract: This Master's degree work, entitled System-in-Package (SiP) Integration of 60 GHz Transceiver for Wireless High Definition Multimedia Interface Application, was executed at STMicroelectronics Company (France), Minatec site in the department of Research and Technological Development/Central CAD and Solutions Department, under the guidance of PhD. Andreia Cathelin. The objective was to research and propose a SiP integration for industrial production. The Multi-Chip Module with ceramic materials (MCM-C) of High Temperature Cofired Ceramic technology (HTCC) was developed. Components and devices of different technologies - an RF 65 nm CMOS Integrated Circuit (IC), a commercial Gallium Arsenide (GaAs) monolithic microwave IC (MMIC), and IPD (Integrated Passive Device) antennas with glass substrate - were integrated into the same module. Further design techniques were developed complying with techniques for industrial assembly and the design rules of Kyocera, the company which provides HTCC technology and module manufacturing. The complete system integration was designed with electronic design automation (EDA) software tools with electrical and electromagnetic simulation resulting in a 13 x 8 mm2 area and 1.12 mm thickness module including its components. The 60 GHz and the base band transmission lines presented an insertion loss of 1.0 dB/mm and 0.6 dB respectively. The IPD antenna integrated in the module presented a 6 dBi minimum gain (53.5 to 59.5 GHz band) with return loss above 10 dB (51 to 63 GHz band) and a small shift of the frequency band. The measurement results of some assembled samples showed that HTCC technology is viable in terms of performance and industrial production for the 60 GHz application, even before the analysis of MMIC HPA and the system evaluation
Mestrado
Eletrônica, Microeletrônica e Optoeletrônica
Mestre em Engenharia Elétrica
Masoud, Khalid Hasan. „Circuits and controls for grid-connected inverters“. Thesis, Queensland University of Technology, 2002.
Den vollen Inhalt der Quelle findenForbes, Mark Graham. „Electronic design issues in high-bandwidth parallel optical interfaces to VLSI circuits“. Thesis, Heriot-Watt University, 1999. http://hdl.handle.net/10399/598.
Der volle Inhalt der QuelleSilay, Kanber Mithat. „High Performance Cmos Capacitive Interface Circuits For Mems Gyroscopes“. Master's thesis, METU, 2006. http://etd.lib.metu.edu.tr/upload/2/12607518/index.pdf.
Der volle Inhalt der Quellem CMOS process. Fabricated interfaces are characterized by measuring their ac responses, noise response and transient characteristics for a sinusoidal input. It is observed that, biasing impedances up to 60 gigaohms can be obtained with subthreshold transistors. Self biasing architecture eliminates the need for biasing the source of the subthreshold transistor to set the output dc point to 0 V. Single ended SOG gyroscopes are characterized with the single ended capacitive interfaces, and a 45 dB gain improvement is observed with the addition of capacitive interface to the drive mode. Minimum resolvable capacitance change and displacement that can be measured are found to be 58.31 zF and 38.87 Fermi, respectively. The scale factor of the gyroscope is found to be 1.97 mV/(°
/sec) with a nonlinearity of only 0.001% in ±
100 °
/sec measurement range. The bias instability and angle random walk of the gyroscope are determined using Allan variance method as 2.158 °
/&
#8730
hr and 124.7 °
/hr, respectively.
Finn, Steven Ernest. „Interface circuit designs for extreme environments using SiGe BiCMOS technology“. Thesis, Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/22679.
Der volle Inhalt der QuelleSmith, O'neil Lohanica. „Design and use of surface modifiers as tools for understanding and controlling interfaces in organic electronics“. Diss., Georgia Institute of Technology, 2014. http://hdl.handle.net/1853/51838.
Der volle Inhalt der QuelleTaghvaei, Mohammad. „Interface circuitry design for a MEMS resonator-based vacuum measurement system“. Thesis, McGill University, 2012. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=106505.
Der volle Inhalt der QuelleCe travail présente la conception de circuits d'interface, pour la mesure de pression sous vide à l'aide de résonateurs MEMS. Deux nouvelles structures de systèmes de mesure sont proposées. Les spécifications requises, ainsi que la conception des blocs composants pour chaque structure, sont étudiées en détail. Par la suite, l'opération adéquate et les spécifications de performance pour les deux architectures - conçues par la technologie CMOS de IBM à 0.13 μm - sont présentées par une combinaison de simulations post-layout et de résultats mesurés. De plus, les avantages et inconvénients de chaque structure sont évalués en détail, suivis d'une comparaison avec des systèmes commerciaux similaires présentement disponibles sur le marché. Finalement, pour s'approcher du but ultime de construire le meilleur système intégré et monolithique de mesure de pression sous vide, à faible consommation de puissance et avec compensation pour les variations thermiques, les possibilités d'améliorations futures et d'extension sont discutées.
Kepenek, Reha. „Capacitive Cmos Readout Circuits For High Performance Mems Accelerometers“. Master's thesis, METU, 2008. http://etd.lib.metu.edu.tr/upload/12609310/index.pdf.
Der volle Inhalt der Quellem CMOS process. Readout circuit is combined with Silicon-On-Glass (SOG) and Dissolved Wafer Process (DWP) accelerometers. Both open loop and closed loop tests of the accelerometer system are performed. Open loop test results showed high sensitivity up to 8.1 V/g and low noise level of 4.8 µ
g/&
#61654
Hz. Closed loop circuit is implemented on a PCB together with the external filtering and decimation electronics, providing 16-bit digital output at 800 Hz sampling rate. High acceleration tests showed ±
18.5 g of linear acceleration range with high linearity, using DWP accelerometers. The noise tests in closed loop mode are performed using Allan variance technique, by acquiring the digital data. Allan variance tests provided 86 µ
g/&
#61654
Hz of noise level and 74 µ
g of bias drift. Temperature sensitivity tests of the readout circuit in closed loop mode is also performed, which resulted in 44 mg/º
C of temperature dependency. Two different types of new adaptive sigma-delta readout circuits are designed in order to improve the resolution of the systems by higher frequency operation. The two circuits both change the acceleration range of operation of the system, according to the level of acceleration. One of the adaptive circuits uses variation of feedback time, while the other circuit uses multi-bit feedback method. The simulation results showed micro-g level noise in closed loop mode without the addition of the mechanical noise of the sensor.
Davis, Joseph P. „Electronic Interface for an Inductive Wear Debris Sensor for Detection of Ferrous and Non-Ferrous Particles“. University of Akron / OhioLINK, 2013. http://rave.ohiolink.edu/etdc/view?acc_num=akron1380998832.
Der volle Inhalt der QuelleButler, Nickolas Andrew. „Development of a Myoelectric Detection Circuit Platform for Computer Interface Applications“. DigitalCommons@CalPoly, 2019. https://digitalcommons.calpoly.edu/theses/1981.
Der volle Inhalt der QuelleGoksugur, Gokhan. „Design And Implementation Of A Microprocessor Based Data Collection And Interpretation System With Onboard Graphical Interface“. Master's thesis, METU, 2005. http://etd.lib.metu.edu.tr/upload/2/12605629/index.pdf.
Der volle Inhalt der Quelleksü
gü
r, Gö
khan M.S., Department of Electric and Electronics Engineering Supervisor : Prof. Dr. Hasan Cengiz Gü
ran December 2004, 103 pages This thesis reports the design and implementation of a microprocessor based interface unit of a navigation system. The interface unit is composed of a TFT display screen for graphical interface, a Controller Circuit for system control, a keypad interface for external data entrance to the system and a power interface circuit to provide interface between the battery of the navigation system and the Controller Circuit. This thesis reports high speed design of the Controller Circuit and generation of system functions. Main functions of the interface unit are communicating with navigation computer and providing a graphical interface to the driver of the vehicle containing the navigation system. Communication and graphical data preparation functions are implemented through the use of a microprocessor. Driver function of TFT display is implemented through the use of a Field Programmable Gate Array, which is programmed using the Very High Speed IC Description Language (VHDL). Keywords: Navigation System, Interface Unit, Controller Circuit, Image Generation
Narasimhan, Seetharam. „Ultralow-Power and Robust Implantable Neural Interfaces: An Algorithm-Architecture-Circuit Co-Design Approach“. Case Western Reserve University School of Graduate Studies / OhioLINK, 2012. http://rave.ohiolink.edu/etdc/view?acc_num=case1333743306.
Der volle Inhalt der QuelleTemiz, Yuksel. „Advanced Readout And Control Electronics For Mems Gyroscopes“. Master's thesis, METU, 2007. http://etd.lib.metu.edu.tr/upload/2/12608664/index.pdf.
Der volle Inhalt der Quelle/hr and 0.126 º
/&
#8730
hr, respectively. The scale factor of the system is found as 22.2 mV/(º
/sec) with a nonlinearity of 0.01%, and a zero rate output of 0.1 º
/sec, in ±
50 º
/sec measurement range. CMOS unity gain buffer (UGB) and transimpedance amplifier (TIA) type resistive and capacitive interfaces are characterized through AC, transient, and noise tests. It is observed that on chip biasing mechanisms properly DC-bias the high impedance nodes to 0 V potential. UGB type capacitive interfaces demonstrate superior performance than TIA counterparts due to stability problems associated with TIA interfaces. CMOS differential drive mode control and sense mode demodulation electronics give promising results for the future performance tests.
Yu, Xinyu. „High-temperature Bulk CMOS Integrated Circuits for Data Acquisition“. Case Western Reserve University School of Graduate Studies / OhioLINK, 2006. http://rave.ohiolink.edu/etdc/view?acc_num=case1144420886.
Der volle Inhalt der QuelleSahin, Emre. „High Performance Readout And Control Electronics For Mems Gyroscopes“. Master's thesis, METU, 2009. http://etd.lib.metu.edu.tr/upload/2/12610386/index.pdf.
Der volle Inhalt der Quelle#730
/hr, an angle random walk (ARW) 0.080 &
#730
/&
#8730
hr, and a scale factor of 22.6 mV/(&
#730
/sec). For the 30 Hz bandwidth, the OLS_SquD system shows a bias instability of 5.12 &
#730
/hr, an ARW better than 0.017 &
#730
/&
#8730
hr, and a scale factor of 49.8 mV/(&
#730
/sec). For the 100 Hz bandwidth, the OLS_SineD system shows a bias instability of 6.92 &
#730
/hr, an ARW of 0.049 &
#730
/&
#8730
hr, and a scale factor of 17.97 mV/(&
#730
/sec). For the 30 Hz bandwidth, the OLS_SineD system shows a bias instability of 4.51 &
#730
/hr, an ARW of 0.030 &
#730
/&
#8730
hr, and a scale factor of 43.24 mV/(&
#730
/sec). For the 100 Hz bandwidth, the OLS_OffD system shows a bias instability of 8.43 &
#730
/hr, an ARW of 0.086 &
#730
/&
#8730
hr, and a scale factor of 20.97 mV/(&
#730
/sec). For the 30 Hz bandwidth, the OLS_OffD system shows a bias instability of 5.72 &
#730
/hr, an ARW of 0.046 &
#730
/&
#8730
hr, and a scale factor of 47.26 mV/(&
#730
/sec). For the 100 Hz bandwidth, the CLS_SquD system shows a bias instability of 6.32 &
#730
/hr, an ARW of 0.055 &
#730
/&
#8730
hr, and a scale factor of 1.79 mV/(&
#730
/sec). For the 30 Hz bandwidth, the CLS_SquD system shows a bias instability of 5.42 &
#730
/hr, an ARW of 0.057 &
#730
/&
#8730
hr, and a scale factor of 1.98 mV/(&
#730
/sec). For the 100 Hz bandwidth, the R2 nonlinearities of the measured scale factors of all systems are between 0.0001% and 0.0003% in the ±
100 &
#730
/sec measurement range, while for the 30 Hz bandwidth the R2 nonlinearities are between 0.0002% and 0.0062% in the ±
80&
#730
/sec measurement range. These performance results are the best results obtained at METU, satisfying the tactical-grade performances, and the measured bias instabilities and ARWs are comparable to the best results in the literature for a silicon micromachined vibratory gyroscope.
U, Seng-Pan. „Tecnicas de interpolacao em filtros multiritmo com condensadores comutados para Interfaces Analogicas com filtragem de alta-frequencia = Multirate Switched-Capacitor interpolation techniques for very high-frequency Analog Front-End filtering“. Thesis, University of Macau, 2002. http://umaclib3.umac.mo/record=b1873496.
Der volle Inhalt der QuelleZhang, Rongwei. „Novel conductive adhesives for electronic packaging applications: a way towards economical, highly conductive, low temperature and flexible interconnects“. Diss., Georgia Institute of Technology, 2011. http://hdl.handle.net/1853/39548.
Der volle Inhalt der QuelleLiang, Tao. „Atomic-scale calculations of interfacial structures and their properties in electronic materials“. Connect to resource, 2005. http://rave.ohiolink.edu/etdc/view?acc%5Fnum=osu1127163029.
Der volle Inhalt der QuelleTitle from first page of PDF file. Document formatted into pages; contains xvi, 136 p.; also includes graphics (some col.). Includes bibliographical references (p. 125-136). Available online via OhioLINK's ETD Center
Alper, Said Emre. „Mems Gyroscopes For Tactical-grade Inertial Measurement Applications“. Phd thesis, METU, 2005. http://etd.lib.metu.edu.tr/upload/12606483/index.pdf.
Der volle Inhalt der Quellewhile the decoupled drive and sense modes minimizes mechanical cross-coupling for low-noise and stable operation. Three different and new symmetric and decoupled gyroscope structures with unique features are presented. These structures are fabricated in four different micromachining processes: nickel electroforming (NE), dissolved-wafer silicon micromachining (DWSM), silicon-on-insulator (SOI) micromachining, and silicon-on-glass (SOG) micromachining. The fabricated gyroscopes have capacitive gaps from 1.5µ
m to 5.5µ
m and structural layer thicknesses from 12µ
m to 100µ
m, yielding aspect ratios up to 20 depending on the fabrication process. The size of fabricated gyroscope chips varies from 1x1mm2 up to 4.2x4.6mm2. Fabricated gyroscopes are hybrid-connected to a designed capacitive interface circuit, fabricated in a standard 0.6µ
m CMOS process. They have resonance frequencies as small as 2kHz and as large as 40kHz
sense-mode resonance frequencies can be electrostatically tuned to the drive-mode frequency by DC voltages less than 16V. The quality factors reach to 500 at atmospheric pressure and exceed 10,000 for the silicon gyroscopes at vacuum. The parasitic capacitance of the gyroscopes on glass substrates is measured to be as small as 120fF. The gyroscope and interface assemblies are then combined with electronic control and feedback circuits constructed with off-the-shelf IC components to perform angular rate measurements. Measured angular rate sensitivities are in the range from 12µ
V/(deg/sec) to 180µ
V/(deg/sec), at atmospheric pressure. The SOI gyroscope demonstrates the best performance at atmospheric pressure, with noise equivalent rate (NER) of 0.025(deg/sec)/Hz1/2, whereas the remaining gyroscopes has an NER better than 0.1(deg/sec)/Hz1/2, limited by either the small sensor size or by small quality factors. Gyroscopes have scale-factor nonlinearities better than 1.1% with the best value of 0.06%, and their bias drifts are dominated by the phase errors in the demodulation electronics and are over 1deg/sec. The characterization of the SOI and SOG gyroscopes at below 50mTorr vacuum ambient yield angular rate sensitivities as high as 1.6mV/(deg/sec) and 0.9mV/(deg/sec), respectively. The NER values of these gyroscopes at vacuum are smaller than 50(deg/hr)/Hz1/2 and 36(deg/hr)/Hz1/2, respectively, being close to the tactical-grade application limits. Gyroscope structures are expected to provide a performance better than 10 deg/hr in a practical measurement bandwidth such as 50Hz, provided that capacitive gaps are minimized while preserving the aspect ratio, and the demodulation electronics are improved.
Dassapa, Chandrasekar. „Couches minces de tungstène déposées par le procédé C. V. D. Pour la métallisation des circuits intégrés“. Grenoble 1, 1987. http://www.theses.fr/1987GRE10117.
Der volle Inhalt der QuelleUzelac, Lawrence Stevan. „A Multiple Coupled Microstrip Transmission Line Model for High-Speed VLSI Interconnect Simulation“. PDXScholar, 1991. https://pdxscholar.library.pdx.edu/open_access_etds/4526.
Der volle Inhalt der QuelleHjertberg, Tommy. „Fault energy implications of distributed converter interfaced generation : A case study of an underground mine grid“. Thesis, KTH, Skolan för elektroteknik och datavetenskap (EECS), 2021. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-300903.
Der volle Inhalt der QuelleAnvändningen av nätansluten omformardriven generering ökar alltmer i takt med att bättre omformare utvecklas och intresset för ett effektivare nyttjande av energiresurser ökar. Små och utspridda energiresurser som tidigare inte var värda att ta vara på tillgängliggörs alltmer, och fördelar som bättre spänningsreglering och lastutjämning driver på utvecklingen. Men med de fördelar som kommer av omformarnas reglerbarhet så kommer också risker beroende av deras olinjäritet, eftersom existerande skyddssystem är anpassade till det linjära beteendet hos traditionella synkrongeneratorer. Den här avhandlingen behandlar säregenheterna i kortslutningsbeteendet hos effektelektroniska omformare och hur det påverkar kortslutningsenergin i bemärkelsen I2t, händelseenergin vid ljusbågar samt kortslutningsströmmen. Via dynamisk simulering så visas att händelseenergin i vissa fall kan öka avsevärt och att detta behöver övervägas vid installation av omformardriven generering.
García, Narbón José Vicente. „Improved characterization systems for quartz crystal microbalance sensors: parallel capacitance compensation for variable damping conditions and integrated platform for high frequency sensors in high resolution applications“. Doctoral thesis, Universitat Politècnica de València, 2016. http://hdl.handle.net/10251/63249.
Der volle Inhalt der Quelle[ES] Durante las dos últimas décadas se han propuesto diferentes interfaces electrónicos para medir los parámetros más importantes de caracterización de los cristales de microbalanza de cuarzo (QCM). La medida de los parámetros adecuados del sensor para una aplicación específica es muy importante, ya que un error en la medida de dichos parámetros puede resultar en un error en la interpretación de los resultados. Los requerimientos del sistema de caracterización dependen de la aplicación. En esta tesis se proponen dos sistemas de caracterización para dos ámbitos de aplicación que comprenden la mayoría de las aplicaciones con sensores QCM: 1) Caracterización de materiales bajo condiciones de amortiguamiento variable y 2) detección de sustancias con alta resolución de medida. Los sistemas propuestos tratan de resolver la problemática detectada en los ya existentes. Para aplicaciones en las que el amortiguamiento del sensor varía durante el experimento, se propone un sistema basado en una nueva configuración de la técnica de compensación automática de capacidad (ACC). La nueva configuración proporciona la medida de la frecuencia de resonancia serie, la resistencia dinámica y la capacidad paralelo del sensor. Además, permite una fácil calibración del sistema que mejora la precisión en la medida. Se presentan resultados experimentales para cristales de 9 y 10MHz en medios fluidos, con diferentes capacidades en paralelo, demostrando la efectividad de la compensación de capacidad. El sistema presenta alguna desviación en frecuencia con respecto a la frecuencia resonancia serie, medida con un analizador de impedancias. Estas desviaciones son explicadas convenientemente, debidas al comportamiento no ideal específico de algunoscomponentes del circuito. Una nueva propuesta de circuito se presenta como posible solución a este problema. Para aplicaciones de alta resolución se propone una plataforma integrada para caracterizar sensores acústicos de alta frecuencia. El sistema propuesto se basa en un nuevo concepto en el que el sensor es interrogado, mediante una fuente externa muy estable y de muy bajo ruido, a una frecuencia constante mientras se monitorizan los cambios producidos por la carga en la fase del sensor. El uso de sensores de alta frecuencia aumenta la sensibilidad de la medida, por otro lado, el sistema de caracterización diseñado reduce el ruido en la misma. El resultado es una mejora del límite de detección (LOD). Se consigue con ello uno de los retos pendientes en los dispositivos acústicos de alta frecuencia. La validación de la plataforma desarrollada se realiza con una aplicación de un inmunosensor basado en cristales QCM de alta frecuencia fundamental (HFF-QCM) para la detección de dos pesticidas: carbaryl y tiabendazol. Los resultados obtenidos para el Carbaryl se comparan con los obtenidos con otra tecnología acústica de alta frecuencia basada en sensores Love, con la técnica óptica basada resonancia superficial de plasmones (SPR) y con la técnica de referencia Enzyme Linked Immuno Assay (ELISA). El LOD obtenido con los sensores acústicos HFFQCM y Love es similar al obtenido con las técnicas ELISA y mejora en un orden de magnitud al obtenido con SPR. La sencillez conceptual del sistema propuesto junto con su bajo coste, así como la capacidad de miniaturización del resonador de cuarzo hace posible la caracterización de múltiples sensores integrados en una configuración en array, esto permitirá en un futuro alcanzar el reto de la detección multianalito para aplicaciones High-Throughput Screening (HTS).
[CAT] Durant les dues últimes dècades s'han proposat diferents interfases electrònics per a mesurar els paràmetres més importants de caracterització dels cristalls de microbalança de quars (QCM). La mesura dels paràmetres adequats del sensor per a una aplicació específica és molt important, perquè un error en la interpretació dels resultats pot resultar en un error en la interpretació dels resultats. Els requeriments del sistema de caracterització depenen de l'aplicació. En aquesta tesi, es proposen dos sistemes de caracterització per a dos àmbits d'aplicació que comprenen la majoria de les aplicacions amb sensors QCM: 1) Caracterització de materials sota condicions d'amortiment variable i 2) detecció de substàncies amb alta resolució de mesura. Els sistemes proposats tracten de resoldre la problemàtica detectada en els ja existents. Per a aplicacions en les quals l'amortiment del sensor varia durant l'experiment, es proposa un sistema basat en una nova configuració de la tècnica de compensació automàtica de capacitat (ACC). La nova configuració proporciona la mesura de la freqüència de ressonància sèrie, la resistència dinàmica i la capacitat paral¿lel del sensor. A més, permet un calibratge fàcil del sistema que millora la precisió de la mesura. Es presenten els resultats experimentals per a cristalls de 9 i 10 MHz en mitjans fluids, amb diferents capacitats en paral¿lel, demostrant l'efectivitat de la compensació de capacitat. El sistema presenta alguna desviació en freqüència respecte a la freqüència ressonància sèrie, mesurada amb un analitzador d'impedàncies. Aquestes desviacions són explicades convenientment, degudes al comportament no ideal específic d'alguns components del circuit. Una nova proposta de circuit es presenta com a possible solució a aquest problema. Per a aplicacions d'alta resolució es proposa una plataforma integrada per a caracteritzar sensors acústics d'alta freqüència. El sistema proposat es basa en un nou concepte en el qual el sensor és interrogat mitjançant una font externa molt estable i de molt baix soroll, a una freqüència constant mentre es monitoritzen els canvis produïts per la càrrega en la fase del sensor. L'ús de sensors d'alta freqüència augmenta la sensibilitat de la mesura, per altra banda, el sistema de caracterització dissenyat redueix el soroll en la mateixa. El resultat és una millora en el límit de detecció (LOD). S'aconsegueix amb això un dels reptes pendents en els dispositius acústics d'alta freqüència. La validació de la plataforma desenvolupada es realitza amb una aplicació d'un immunosensor basat en cristalls QCM d'alta freqüència fonamental (HFF-QCM) per a la detecció de dos pesticides: carbaryl i tiabendazol. Els resultats obtinguts per al carbaryl es comparen amb els obtinguts amb altra tecnologia acústica d'alta freqüència basada en sensors Love, amb la tècnica òptica basada en ressonància superficial de plasmons (SPR) i amb la tècnica de referència Enzyme Linked Immuno Assay (ELISA). El LOD obtingut amb els sensors acústics HFF-QCM i Love és similar al obtingut amb les tècniques ELISA i millora en un ordre de magnitud el obtingut amb SPR. La senzillesa conceptual del sistema proposat junt amb el seu baix cost, així com la capacitat de miniaturització del ressonador de quars fa possible la caracterització de múltiples sensors integrats en una configuració en array, el que permetrà en un futur assolir el repte de la detecció multianalit per a aplicacions High-Throughput Screening (HTS).
García Narbón, JV. (2016). Improved characterization systems for quartz crystal microbalance sensors: parallel capacitance compensation for variable damping conditions and integrated platform for high frequency sensors in high resolution applications [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/63249
TESIS
Huguet, Thomas. „Vers une meilleure exploitation des dispositifs de récupération d’énergie vibratoire bistables : Analyse et utilisation de comportements originaux pour améliorer la bande passante“. Thesis, Lyon, 2018. http://www.theses.fr/2018LYSEI113/document.
Der volle Inhalt der QuelleThis thesis concerns vibratory energy harvesting in order to propose an alternative to conventional batteries for the power supply of autonomous wireless systems. This would improve their compactness (less stored energy), their resistance to harsh environments (high temperature) and reduce their need for maintenance. This study focuses in particular on bistable oscillating generators, which are interesting for their large useful frequency range compared to that offered by linear generators (limited to the resonance zone). This thesis is divided into four main parts. The first presents the construction of the mathematical model to predict the different behaviors of the bistable generator (these behaviors can coexist over certain frequency ranges) including the study of stability to small disturbances. This model highlights original behaviors for energy recovery: subharmonic behaviors whose frequency range allows increasing the overall generator bandwidth. In order to improve the accuracy of the model, a semi-analytical criterion is then added: the stability robustness criterion which characterizes the sensitivity of the different behaviors to external disturbances (the more robust a behavior, the easier to maintain over time). The model obtained and the experimental prototype show a wide frequency range on which the interesting behaviors (high orbits) and the undesirable behaviors (low orbits) coexist. The third part of this thesis therefore presents different strategies for jumping from low to high orbits by playing directly on the generator parameters. Finally, the fourth and last part focuses on the influence of the AC-DC interface circuit between the bistable generator and the load for future integration
Penny, Melissa. „Mathematical modelling of dye-sensitised solar cells“. Thesis, Queensland University of Technology, 2006. https://eprints.qut.edu.au/16270/1/Melissa_Penny_Thesis.pdf.
Der volle Inhalt der QuelleLago, Nicolò. „Characterization and modelling of organic devices for simultaneous stimulation and recording of cellular electrical activity with Reference-Less Electrolyte-Gated Organic Field-Effect Transistors“. Doctoral thesis, Università degli studi di Padova, 2018. http://hdl.handle.net/11577/3426781.
Der volle Inhalt der QuelleLo studio delle malattie neuronali e neuro-degenerative richiede lo sviluppo di nuovi strumenti e tecnologie per creare dispositivi neuro-elettronici funzionali che consentano sia la stimolazione che la registrazione dell'attività elettrica cellulare. Nell'ultimo decennio l'elettronica organica sta emergendo nel campo della bioelettronica e diversi gruppi di ricerca hanno iniziato a sviluppare interfacce neurali basate su semiconduttori organici. L'interesse per tali tecnologie deriva dalle proprietà intrinseche dei materiali organici quali basso costo, trasparenza, morbidezza e flessibilità, nonché la biocompatibilità e l'idoneità nella realizzazione di sistemi stampati completamente organici. In particolare, i biosensori basati sulla tecnologia a transistor ad effetto campo organico (OFET) integrano il sensing e l'amplificazione del segnale in un singolo dispositivo, aprendo la strada a nuove interfacce neurali impiantabili per applicazioni in vivo. Per padroneggiare le proprietà di rilevamento e amplificazione dei sensori basati su OFET, è obbligatorio acquisire una conoscenza approfondita dei singoli transistor (senza la presenza di analiti e/o cellule) che vadano oltre le caratterizzazioni di base o modelli generali. Inoltre, i transistor organici sono caratterizzati da diversi principi di funzionamento e diverse proprietà rispetto alla loro controparte inorganica. In questo lavoro abbiamo svolto caratterizzazioni impulsate e transienti su diversi OFET (sia di tipo p che di tipo n) mostrando che, anche se i transistor possono accendersi e spegnersi molto velocemente, l'accumulo e/o lo svuotamento del canale conduttivo continua per tempi che possono superare le decine di secondi. Tale fenomeno deve essere attentamente considerato nella realizzazione di un biosensore e nelle sue applicazioni, poiché il punto operativo DC del dispositivo può andare alla deriva durante la registrazione dei segnali cellulari, alterando così i dati raccolti. Questo fenomeno viene ulteriormente approfondito caratterizzano i dispositivi a diverse temperature e per mezzo della tecnica DLTS. Abbiamo dimostrato che il lento accumulo (e svuotamento) del canale è dovuto alla densità di stati del semiconduttore organico che devono poter essere occupati per portare il livello energetico di Fermi vicino alla banda di conduzione. Questo è un fenomeno che può richiedere diversi secondi che possiamo descrivere introducendo una mobilità dipendente dal tempo. Per comprendere i processi di trasduzione elettrochimica tra cellule viventi ed il biosensore organico, abbiamo realizzato una struttura a due elettrodi (STACK) in cui una goccia di soluzione salina viene messa direttamente a contatto con il semiconduttore organico. Su questi dispositivi, abbiamo eseguito la spettroscopia di impedenza elettrochimica a diverse polarizzazioni DC e abbiamo sviluppato un modello circuitale equivalente per le strutture metallo/semiconduttore organico/soluzione che vengono tipicamente utilizzate per la realizzazione di bio-trasduttori. Il nostro approccio prevede di estendere il range standard delle tensioni operative per questo genere di dispositivi. Ciò ha permesso di investigare e distinguere i diversi fenomeni che si verificano nei diversi strati e interfacce: adsorbimento di ioni nel semiconduttore; accumulo e scambio di cariche di portanti all'interfaccia semiconduttore/elettrolita; percolazione delle specie ioniche attraverso il semiconduttore organico; diffusione di ioni attraverso l'elettrolita; adsorbimento di ioni e scambio di carica all'interfaccia col metallo. Abbiamo evidenziato la presenza di percolazione ionica attraverso lo strato di semiconduttore organico, che è descritto nel modello circuitale per mezzo di un'impedenza di de Levie. La presenza di percolazione è stata dimostrata mediante microscopia elettronica a scansione ambientale e analisi profilometrica. Sebbene la percolazione sia molto più evidente a valori di bias negativi elevati, risulta presente anche a basse condizioni di bias. L'ottimo accordo tra il modello e i dati sperimentali rende il modello un valido strumento per studiare i meccanismi di trasduzione tra film organici e l'ambiente fisiologico. Quindi questo modello può essere uno strumento utile non solo per la caratterizzazione e l'analisi dei guasti dei dispositivi elettronici, come water-gated transistor, interfacce elettrofisiologiche, celle a combustibile e altri sistemi elettrochimici, ma anche nel caso in cui una soluzione è in intimo contatto con un altro materiale per determinare e/o quantificare se si verificano meccanismi indesiderati come percolazione e/o processi corrosivi. Infine, il bagaglio di conoscenze ottenuto studiando i dispositivi OFET e STACK è stato messo utillizato per realizzare dispositivi EGOFET. Abbiamo quindi sviluppato un modello per descrivere gli EGOFET come interfacce neurali. Abbiamo dimostrato che il nostro modello può essere applicato con successo per comprendere il comportamento di una classe più generale di dispositivi, compresi i transistor sia organici che inorganici. Abbiamo introdotto l'RL-EGOFET (reference-less EGOFET) e abbiamo dimostrato che questa struttura può essere utilizzata con successo come interfaccia neurale flessibile per il recording extracellulare in vivo senza la necessità di un elettrodo di riferimento, rendendo l'impianto meno invasivo e più facile da usare. I nostri risultati aprono la strada all'utilizzo e all'ottimizzazione di EGOFET e RL-EGOFET come interfacce neurali.
Penny, Melissa. „Mathematical modelling of dye-sensitised solar cells“. Queensland University of Technology, 2006. http://eprints.qut.edu.au/16270/.
Der volle Inhalt der QuelleMichálek, Libor. „Komplexní zabezpečení objektů“. Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2011. http://www.nusl.cz/ntk/nusl-218836.
Der volle Inhalt der QuelleRoss, Nick. „Interfacial Electrochemistry of Cu/Al Alloys for IC Packaging and Chemical Bonding Characterization of Boron Doped Hydrogenated Amorphous Silicon Films for Infrared Cameras“. Thesis, University of North Texas, 2016. https://digital.library.unt.edu/ark:/67531/metadc849696/.
Der volle Inhalt der QuelleChang, Chia-Lin, und 張佳琳. „Adaptive Interface Circuits of Chemiresistive Gas Sensors for an Electronic Nose System“. Thesis, 2013. http://ndltd.ncl.edu.tw/handle/10918564993598900464.
Der volle Inhalt der Quelle國立清華大學
電機工程學系
102
Many odors are not suitable for human to smell, such as poisonous and exhausted gases. In addition, olfaction is different from person to person. Compare to the traditional gas detection instrument, an electronic nose (E-nose) system has various advantages including small size, low cost, low power, quantization of olfaction, and the capability of being exposed to dangerous gases. Therefore, it can be applied to quality control of foods, environmental monitoring, pollution measurement and disease diagnosis, etc. E-nose system is composed of a gas sensor array, a signal acquisition circuit and a pattern recognition system. Conducting polymer sensor is one of the chemiresistive gas sensors. It has the advantages of working at room temperature, high sensitivity (about a few ppm), and its readout circuit is simple, which would be suitable for portable devices. However, the sensor resistance could be easily affected by temperature, humidity, and background odors. In addition, the resistances of each sensor in the sensor array are not the same after the deposition of different sensing materials. Therefore, an adaptive interface circuit is required to cancel the baseline drift and read the sensor signal. Three types of adaptive interface circuits fabricated by TSMC 0.18μm CMOS 1P6M processes would be introduced in this paper: semi-digital type, digital type and analog type. Simulation and measurement result of these three interface circuits would be presented and be compared. Lastly, an external conductive polymer gas sensor array connected with adaptive interface circuit was exposed to different odors, and the results were presented. Gas sensors were respectively integrated with the semi-digital type and digital type interface circuits on the same chip.
Li, Cheng-Han, und 李承漢. „Interface Circuits for a Portable Electronic Nose Based on Surface Acoustic Wave Sensor Array“. Thesis, 2010. http://ndltd.ncl.edu.tw/handle/57137278871938393873.
Der volle Inhalt der Quelle國立清華大學
電機工程學系
98
Electronic nose system is the world's popular field of studies, it can be widely applied to various industries and daily life. This thesis hopes to increase the convenience of the electronic nose system, the applicable site of electronic nose system can’t be constraints, and low cost. Surface Acoustic Wave sensors with high sensitivity, fast response, etc., is very suitable for as gas sensors. Use of non-continuous surface acoustic wave gas sensor array measured power consumed by the lower, extend the operating hours of portable devices. It realization of SAW sensor interface circuits by using 0.18μm CMOS process in this work. The three types of circuits are digital, analog and mixed-mode SAW array interface circuit, the performance of the mixed-mode circuits is the best one, the power consumption is only 1.48mW, the resolution is 10Hz, suitable for the SAW output frequency of about 100MHz sensor array. The interface can be combined with wireless transmission to send data to the receiver storage and analysis.
Qin, Yajie. „Low Power Analog Interface Circuits toward Software Defined Sensors“. Doctoral thesis, 2016. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-179671.
Der volle Inhalt der QuelleQC 20151221
Velmathi, G. „Integrated Gas Sensor - Studies On Sensing Film Deposition, Microheater Design And Fabrication, Interface Electronics Design And Testing“. Thesis, 2012. https://etd.iisc.ac.in/handle/2005/2457.
Der volle Inhalt der QuelleVelmathi, G. „Integrated Gas Sensor - Studies On Sensing Film Deposition, Microheater Design And Fabrication, Interface Electronics Design And Testing“. Thesis, 2012. http://etd.iisc.ernet.in/handle/2005/2457.
Der volle Inhalt der QuelleTsai, Yen-Cheng, und 蔡彥呈. „High-Speed Interface Pin Electronics Circuit Design“. Thesis, 2004. http://ndltd.ncl.edu.tw/handle/81647026223864566639.
Der volle Inhalt der Quelle國立交通大學
電機與控制工程系所
92
Traditionally, the pin electronics (PE) card circuits of a tester consists of several components, such as reference voltage IC, driver/receiver IC and etc on a print circuit board (PCB). It uses the bus to connect all the components. Hence, the operation speed of PE is limited and the area of complete architecture is large. In this thesis, we target CMOS chip for our device under test circuit to design the PE card circuits. Owing to the operating frequency is more and more fast, we must use the high-speed interface to transmit or receive the data, such as low-voltage positive-reference emitter-coupled-logic (LVPECL) interface standard and low voltage differential signals (LVDS) interface standard. For driver part, we use tri-state buffer with parasitic inductance to achieve the speed requirement and the driving capabilities as the spec. We use the window comparator to receive the signal from the device under test (DUT). It will be divided into three voltage level ranges to compare whether the signal is valid or not. For dynamic load, due to the switching speed, we will still use the diode-bridge structure to be the voltage-comparison circuit. As for the current source, we use 6-bit digital signals to control how much current we need. And the all the reference voltages of this chip are provided by a 6-bit DAC and some decoders. Finally, the complete circuits have been designed and implemented by TSMC 0.18um Mixed Signal 1p6m 1.8V/3.3V process technology. Pre- and post-simulation will verify the feasibility of the design.
Negrão, Luís Filipe Moreira Simões de Oliveira. „Silver-based Soft Electronic Systems: Materials and Fabrication Methods“. Master's thesis, 2018. http://hdl.handle.net/10316/86185.
Der volle Inhalt der QuelleEste trabalho incide sobre sistemas eletrónicos extensíveis (\textit{Stretchable}) fabricados com compostos condutores constituídos por micropartículas/microflocos de prata dispersos numa matriz de Polidimetilsiloxano.Num primeiro passo, vários tipos de compostos baseados em prata serão testados e comparados. Isto inclui partículas com diferentes geometrias, nomeadamente micropartículas e microflocos de prata, bem como micropartículas de níquel e ferrite revestidas com prata. Do composto resultante, designado AgPDMS, espera-se que seja um bom condutor e, mais, que mantenha esta característica mesmo quando elongado. O limiar de percolação para cada um destes tipos de partículas será obtido experimentalmente, e a estabilidade das propriedades elétricas do tipo de partícula selecionado será avaliada. De seguida, três métodos de padronização serão avaliados, nomeadamente impressão por \textit{stencil}, serigrafia e moldagem. O objetivo seguinte será reduzir a área dos circuitos desenvolvidos, quer reduzindo a dimensão dos elementos do circuito quer fabricando circuitos com várias camadas. Para fabricar circuitos de várias camadas será usado um método baseado em ablação com laser para criar vias que ligam electricamente camadas adjacentes. Em seguida, métodos para integrar componentes rígidas em circuitos extensíveis serão testados. Será ainda realizada caracterização eletromecânica de amostras fabricadas usando os materias e métodos selecionados no decorrer deste trabalho.Para terminar, serão apresentados dois sistemas electrónicos extensíveis fabricados no ISR, como prova de conceito. O primeiro é um \textit{touchpad} capacitivo extensível, e o segundo um sensor ECG sem fios extensível.
This work focuses on stretchable electronics systems, composed of silver-based conductive composites as the conductive material and Polydimethylsiloxane (PDMS) as the stretchable substrate material.First, as a filler for PDMS-based conductive composites, various types of silver particles will be evaluated. This includes silver particles and silver flakes with different geometries, as well as silver-coated nickel/ferrite particles. The resulting composite, called AgPDMS, should be conductive and also tolerate strain without losing conductivity. The percolation threshold for each of these particle types is obtained experimentally, and the stability over time of conductivity for the selected particle type is evaluated. After this, three patterning methods are evaluated, namely stencil printing, screen printing and moulding.The second goal of this work is to reduce the circuit footprint by both reducing feature dimensions and fabricating multilayer AgPDMS stretchable circuits. To fabricate multilayer circuits, a method based on laser ablation is used for creating vias between layers.After this, methods for integrating flexible and rigid components into soft circuits will be assessed.Thorough electromechanical characterisation of samples fabricated using the selected materials and methods will be performed.To conclude, two stretchable electronics systems fabricated at ISR will be presented as proof-of-concept. This includes a multilayer capacitive stretchable touchpad and an ECG sensor.
FCT
Li, Yan. „Power management of power electronics interfaced low-voltage microgrid in islanding operation“. Master's thesis, 2010. http://hdl.handle.net/10048/951.
Der volle Inhalt der QuelleA thesis submitted to the Faculty of Graduate Studies and Research in partial fulfillment of the requirements for the degree of Master of Science in Power Engineering and Power Electronics, Department of Electrical and Computer Engineering. Title from pdf file main screen (viewed on June 13, 2010). Includes bibliographical references.
Wu, Ching-Yi, und 吳景怡. „An Integrated Conducting Polymer Gas Sensor Array and Its Adaptive Interface Circuit Compatible with Standard CMOS Processes for an Electronic Nose Chip“. Thesis, 2010. http://ndltd.ncl.edu.tw/handle/59228711747974679105.
Der volle Inhalt der Quelle國立清華大學
電機工程學系
98
Many applications use the electronic nose (Enose) system, such as environmental monitoring, food processing, pollution measurement and medical diagnosis. The ability to monitor and identify various chemical gases is also valuable. Although the sensing capabilities of our noses are well beyond that achievable by any existing instrument, many applications require non-human odor detecting ability. Compared with a traditional gas chromatograph-mass spectrometer (GC-MS), electronic nose systems have the advantage of being smaller, more portable, and cost economic. The research focuses on an integrated conducting polymer gas sensor array and its adaptive interface circuit compatible with standard CMOS processes for an electronic nose chip. The sensors use polymer-carbon black composites, which swell reversibly and create resistance change upon exposure to chemical vapors. The initial resistances of sensors are influenced by temperature or humidity. Therefore, an adaptive interface circuit is proposed to cancel the baseline signal drift. With the progress of MEMS process, there are many researches about miniature conducting polymer gas sensors. But most of the researches could not compatible with standard CMOS processes. We proposed the conducting polymer gas sensor array that compatible with standard CMOS processes. It is very important for the portable electronic nose system. Using standard CMOS process to integrate sensors and circuits can achieve small size, low-power, low noise and low cost.
Raghuraman, Mathangi. „Threshold Voltage Shift Compensating Circuits in Non-Crystalline Semiconductors for Large Area Sensor Actuator Interface“. Thesis, 2014. http://etd.iisc.ac.in/handle/2005/3176.
Der volle Inhalt der QuelleRaghuraman, Mathangi. „Threshold Voltage Shift Compensating Circuits in Non-Crystalline Semiconductors for Large Area Sensor Actuator Interface“. Thesis, 2014. http://hdl.handle.net/2005/3176.
Der volle Inhalt der QuelleSantos, Bruno Alexandre Coutinho dos. „Interfacing Silicon Chips with Printed Inks for Ultra-Stretchable Circuits“. Master's thesis, 2020. http://hdl.handle.net/10316/92098.
Der volle Inhalt der QuelleCircuitos eletrónicos convencionais são compostos por materiais rígidos e quebradiços. No entanto, orgãos biológicos são fundamentalmente moles (soft). Este desfasamento evidente despertou interesse no campo da electrónica deformável, que se foca no desenvolvimento de materiais e métodos de fabrico para circuitos cujas propriedades mecânicas se assemelham às dos tecidos biológicos. Estes esforços têm sido direcionados para a introdução de novos métodos e técnicas de fabrico de formas deformáveis de elétrodos, conectores e sensores. Porém, a funcionalidade de circuitos deformáveis ainda está dependente da utilização de tecnologias de estado sólido (SST), tais como díodos emissores de luz (LEDs) e circuitos integrados (ICs), para aquisição, processamento e comunicação de dados. A integração de SST em circuitos extensíveis introduz uma incompatibilidade mecânica no sistema, o que leva à falha prematura e/ou perda de funcionalidade do circuito quando é aplicada uma deformação. Apesar deste ser o maior obstáculo contra o fabrico escalável de circuitos extensíveis, poucos esforços têm sido direcionados para o combater de forma eficiente, já que as soluções apresentadas são geralmente complexas e trabalhosas. Este trabalho propõe um novo método de interface de componentes rígidos com circuitos deformáveis que lhes permite resistir a um distensão máxima recorde de >600%, 3x superior a qualquer outra técnica publicada. Os circuitos são fabricados através de deposição de uma tinta bifásica inovadora composta por Ag-EGaIn-SIS sobre um copolímero de bloco de estireno-isopreno (SIS). Em seguida, microchips SMD são colocados sobre as conexões utilizando uma máquina pick and place. Uma técnica inovadora de exposição de vapor de tolueno é depois utilizada para causar uma transição duro-mole tanto no substrato de SIS, como na tinta composta por SIS. O microchip consegue então penetrar e aderir à tinta e a estrutura do componente é envolvida na íntegra pelo substrato adesivo. Além de possibilitar a integração de microchips, o tratamento de vapor de tolueno melhora a percolação do compósito condutivo, o que resulta num aumento de 2x na condutividade das pistas do circuito. Exposição ao vapor permite ainda eliminar defeitos como micro-fendas presentes no substrato, possibilitando assim atingir distensões superiores. Para caracterizar a técnica analisou-se um conjunto de parâmetros como a tolerância máxima de distensão e resistência à fadiga. Recorreu-se ainda à microscopia eletrónica de varredura e microscopia ótica para investigar e compreender os mecanismos subjacentes à integração dos components rígidos. Além destas vantagens face ao estado de arte, o método descrito é consideravelmente mais simples que outras técnicas previamente publicadas, constituindo assim um passo importante no fabrico automático e escalável de circuitos deformáveis com integração de microchips. O método foi desenvolvido e demonstrado com sucesso através de um case-study que consistiu em desenvolver um circuito extensível para medição da temperatura da pele. Este circuito foi depois transferido para um tecido de modo a formar um máscara wearable para medição de temperatura do utilizador.
Conventional electronic systems are composed of rigid and brittle materials. Biological organs however are mostly made of soft materials. This conspicuous mismatch sparked interest in the field of stretchable electronics, which focuses on materials and methods for fabrication of thin, soft, and stretchable circuits that can interface a host surface, for instance the human epidermis, and keep their functionality despite the dynamic morphology of the host system. Such efforts mostly focused on the introduction of materials and methods for patterning of stretchable electrodes, interconnects, and sensors. However, the ultimate functionality of these systems remains dependent of solid-state technology (SST), from simple light emitting diodes (LEDs), to packaged integrated circuits (ICs) for data acquisition, processing and communication. Integration of SST into these circuits induces a drastic mechanical mismatch, resulting in premature failure and/or loss of the circuit functionality when strain is applied to the systems. Even though this problem is the main bottleneck against scalable fabrication of stretchable electronics, very few works tried to address it. In addition, the previously presented solutions are complex, labor-intensive and require many fabrication steps. In this work, we proposed a novel method for interfacing SST components into stretchable circuits that can withstand a record-breaking maximum strain tolerance of >600% of strain, 3x higher than any previously reported technique. Circuits are fabricated by printing a novel biphasic Ag-EGaIn-SIS ink over a Styrene-isoprene block copolymers (SIS) substrate. Then, SMD microchips are placed over the interconnects using a pick and place machine. This is followed by an innovative technique of toluene vapor exposure that provokes a hard-soft transition both in the SIS substrate, and in the SIS-containing ink. Then, the microchip penetrates and adheres to the ink, and the body of the component gets surrounded by the adhesive substrate entirely on all of its perimeter. In addition to the microchip integration, the vapor treatment improves the percolation of the conductive composite, resulting in a 2x increment in the conductivity of the printed traces. Furthermore, vapor exposure eliminates defects and micro-cracks present in the substrate, allowing for a higher strain tolerance. To characterize the technique, we analyzed a set of parameters, including maximum strain tolerance and fatigue tolerance. SEM and optical microscopy were as well used to inspect the underlying mechanisms that lead to the integration of the rigid components. In addition to these advantages over state-of-the-art, this method is considerably simpler than previously reported methods, thus paving an important step toward scalable and automated fabrication of microchip-integrated stretchable circuits. An example of application was demonstrated through fabrication of a microchip-integrated stretchable circuit that could measure the skin temperature, or that can be transferred to a textile mask for acquisition and display of the temperature.
Outro - Projeto "CMU-Portugal WoW" (Referência: 45913) com o apoio do Fundo Europeu de Desenvolvimento Regional (ERDF) e do Estado Português através do Portugal2020 e COMPETE 2020.
Outro - Projeto “Add.Additive” (Referência: 59563), financiado pelo Fundo Europeu de Desenvolvimento Regional (ERDF), através do “Programa Operacional Competitividade e Internacionalizacão” (POCI-01-0247-FEDER-024533)
Outro - Projeto Dermotronics” (Reference: 31784), financiado pelos ”Fundos Europeus Estruturais e de Investimento” (FEEI), através do ”Programa Operacional Regional do Centro”.
„Design automation of customer specific microcontroller based on VHDL“. Chinese University of Hong Kong, 1994. http://library.cuhk.edu.hk/record=b5888236.
Der volle Inhalt der QuelleThesis (M.Phil.)--Chinese University of Hong Kong, 1994.
Includes bibliographical references (leaves 87-88).
Abstract --- p.ii
Acknowledgments --- p.iii
Chapter 1 --- Introduction --- p.1-1
Chapter 1.1 --- Introduction --- p.1-1
Chapter 1.2 --- Background --- p.1-2
Chapter 1.3 --- Thesis Organization --- p.1-4
Chapter 2 --- Synthesis of Common Structures in a Microcontroller --- p.2-1
Chapter 2.1 --- Limitation of Synthesis Tools --- p.2-1
Chapter 2.2 --- Synthesizable VHDL for Common Structures --- p.2-2
Chapter 2.2.1 --- Counter --- p.2-3
Chapter 2.2.2 --- Set-Reset Latch --- p.2-6
Chapter 2.2.3 --- D Latch --- p.2-9
Chapter 2.2.4 --- D Flip-flop --- p.2-12
Chapter 2.2.5 --- Multiplexor --- p.2-13
Chapter 2.2.6 --- Shift Register --- p.2-15
Chapter 2.2.7 --- Signal Affected by Two Signal Edges --- p.2-18
Chapter 2.2.8 --- Combinational Feedback --- p.2-19
Chapter 2.2.9 --- Short Pulses --- p.2-21
Chapter 2.2.10 --- Register Transfer Logic --- p.2-22
Chapter 2.2.11 --- Status Flag --- p.2-26
Chapter 2.2.12 --- Register Access --- p.2-30
Chapter 2.2.13 --- Clock Divider --- p.2-34
Chapter 2.2.14 --- Communication among Processes --- p.2-36
Chapter 3 --- Synthesis of Components of a Microcontroller --- p.3-1
Chapter 3.1 --- Timer --- p.3-1
Chapter 3.2 --- Serial Peripheral Interface (SPI) --- p.3-9
Chapter 3.3 --- Serial Communication Interface (SCI) --- p.3-16
Chapter 3.4 --- Parallel I/O Port --- p.3-21
Chapter 3.5 --- 6805CPU --- p.3-22
Chapter 3.5.1 --- State Counter --- p.3-23
Chapter 3.5.2 --- Instruction Decoding and Execution Unit --- p.3-24
Chapter 3.5.3 --- Interrupt Logic --- p.3-25
Chapter 3.5.4 --- Instruction Register --- p.3-27
Chapter 4 --- VHDL Coding and Synthesis --- p.4-1
Chapter 4.1 --- Controlling Synthesis by VHDL Coding --- p.4-1
Chapter 4.1.1 --- Structure Control --- p.4-2
Chapter 4.1.2 --- Feedback Path Control --- p.4-2
Chapter 4.1.3 --- Control of Use of Storage --- p.4-2
Chapter 4.1.4 --- Timing Control --- p.4-3
Chapter 4.2 --- Consequences of the Writing Guidelines --- p.4-5
Chapter 5 --- Interface Tool for Generation of VHDL for a Microcontroller --- p.5-1
Chapter 5.1 --- Features --- p.5-1
Chapter 5.2 --- Construction --- p.5-1
Chapter 5.3 --- Illustration --- p.5-3
Chapter 5.4 --- Data Structure --- p.5-5
Chapter 5.4.1 --- Design List --- p.5-6
Chapter 5.4.2 --- Instance Data --- p.5-6
Chapter 5.4.3 --- Instance List --- p.5-8
Chapter 5.4.4 --- Register Data --- p.5-9
Chapter 5.4.5 --- Dialogs and Functions --- p.5-10
Chapter 5.5 --- VHDL Generator for Individual Component --- p.5-11
Chapter 5.6 --- VHDL Generator for the Whole Microcontroller --- p.5-14
Chapter 6 --- Conclusion --- p.6-1
Bibliography --- p.B-1
Appendix --- p.A-1
Bhat, Shriram N. „Studies In Micro Interconnections In Printed Wiring Board“. Thesis, 2008. https://etd.iisc.ac.in/handle/2005/846.
Der volle Inhalt der QuelleBhat, Shriram N. „Studies In Micro Interconnections In Printed Wiring Board“. Thesis, 2008. http://hdl.handle.net/2005/846.
Der volle Inhalt der Quelle(11191893), Jose Alejandro Solorio Cervantes. „Smart Sensing System for a Lateral Micro Drilling Robot“. Thesis, 2021.
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