Zeitschriftenartikel: „Electronic device testing“

1

Deaves, M. „On test [electronic device testing]“. Manufacturing Engineer 82, Nr. 5 (01.10.2003): 40–41. http://dx.doi.org/10.1049/me:20030508.

Der volle Inhalt der Quelle

APA, Harvard, Vancouver, ISO und andere Zitierweisen

2

Pan, Feng, Ruimin Chen, Yong Xiao und Weiming Sun. „Electronic Voltage and Current Transformers Testing Device“. Sensors 12, Nr. 1 (18.01.2012): 1042–51. http://dx.doi.org/10.3390/s120101042.

Der volle Inhalt der Quelle

APA, Harvard, Vancouver, ISO und andere Zitierweisen

3

Fiala, Thomas G. S., David M. Wrightson und Michael J. Yaremchuk. „An Electronic Device for Surgical Glove Testing“. Plastic and Reconstructive Surgery 92, Nr. 6 (November 1993): 1192–94. http://dx.doi.org/10.1097/00006534-199311000-00033.

Der volle Inhalt der Quelle

APA, Harvard, Vancouver, ISO und andere Zitierweisen

4

Tada, Tetsuo, und Keiichi Sawada. „4720671 Semiconductor device testing device“. Microelectronics Reliability 28, Nr. 4 (Januar 1988): 669. http://dx.doi.org/10.1016/0026-2714(88)90273-9.

Der volle Inhalt der Quelle

APA, Harvard, Vancouver, ISO und andere Zitierweisen

5

Simakov, A. V., V. V. Kharlamov und V. I. Skorokhodov. „The overcurrent protection characteristics testing digital substation intelligent electric devices“. Omsk Scientific Bulletin, Nr. 176 (2021): 46–51. http://dx.doi.org/10.25206/1813-8225-2021-176-46-51.

Der volle Inhalt der Quelle

Annotation:

The electric power industry digital transformation features and the intelligent electronic devices (IEDs) introduction in the low-voltage circuits of power stations and substations are considered. The analysis of normative documents and standards is carried out. The features of scheduled maintenance of relay protection and automation devices are determined, the possibilities and prospects of organizing condition-based maintenance are considered. The mandatory steps required for any type of maintenance are defined. A method for checking the electrical and time characteristics of the overcurrent protection of an intelligent electronic device is proposed. The device is designed in accordance with the IEC-61850 standard and operates in the local area network of a digital substation of architecture III

APA, Harvard, Vancouver, ISO und andere Zitierweisen

6

Paunovic, Nemanja, Jelena Kovacevic und Ivan Resetar. „A methodology for testing complex professional electronic systems“. Serbian Journal of Electrical Engineering 9, Nr. 1 (2012): 71–80. http://dx.doi.org/10.2298/sjee1201071p.

Der volle Inhalt der Quelle

Annotation:

This paper presents a testing methodology for complex professional electronic systems, based on automation and black box testing, divided into 4 testing phases. The goal is full automation of the testing process, making the process of testing as reliable as possible, and cutting testing time and human interference to a minimum. Testing is performed during production, with an emphasis on the functionality of the device. All verifications must be executed before the device is launched on the market.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

7

Gary, Sarah T., Antonio V. Otero, Kenneth G. Faulkner und Nadeeka R. Dias. „Validation and equivalency of electronic clinical outcomes assessment systems“. International Journal of Clinical Trials 7, Nr. 4 (20.10.2020): 271. http://dx.doi.org/10.18203/2349-3259.ijct20204485.

Der volle Inhalt der Quelle

Annotation:

<p>The US food and drug administration (FDA) has long called for clinical outcomes assessments (COA), such as patient-reported outcomes (PRO), to be ‘fit-for-purpose’ meaning the COA has been validated to support the context of use. The FDA’s recent patient-focused drug development guidance series has renewed the importance of ensuring that COA is ‘fit-for-purpose’ and valid. In addition, the FDA has recommended that COA be collected electronically and that the electronic (eCOA) system and devices also be validated. Advancing technology requires eCOA systems and devices to evolve; eCOA devices may change over time. As bring your own device (BYOD) models gain popularity and acceptance, devices may also be mixed within trials. Changes in eCOA devices or mixing devices may require equivalence testing to prove validity across platforms. The aim of this article is to provide an overview of the different types of validation at both the assessment level and the eCOA system (device) level to help clinical trial sponsors determine the appropriate level of validation or equivalence testing required for COA used in their clinical trials. </p>

APA, Harvard, Vancouver, ISO und andere Zitierweisen

8

Sherf, Z., A. Katz, P. Hopstone, A. Edelstein, I. Yogev und D. Peleg. „Aspects of the Acoustic Testing of an Electronic System: Acoustic Versus Vibration Testing“. Journal of the IEST 47, Nr. 1 (14.09.2004): 57–66. http://dx.doi.org/10.17764/jiet.47.1.b81113pn56114774.

Der volle Inhalt der Quelle

Annotation:

In this paper, the vibratory responses excited in an electronic device during a vibration test and an acoustic test are compared. It was found that the responses differ significantly for items mounted on vibration isolators. Under certain circumstances (stiff mounting of the elements in the device and for a certain vibration axis), a higher similarity can be noted between the vibration and acoustic tests. Due to the lack of excitation above 2000 Hz during the vibration testing, failures caused by excitation in this range are not detected, which is significant for small components. The higher responses in the low frequency range during the vibration test can induce unrealistic failures. Application of the vibration test separately for individual axes as opposed to the distributed loading applied during the acoustic test can also result in undetected failures.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

9

Cheng, Ze, Zhao Long Xuan, Wei Wang und Mao Sen Hao. „Test Method for Electronic Device on Condition of Small Sampling“. Applied Mechanics and Materials 347-350 (August 2013): 525–28. http://dx.doi.org/10.4028/www.scientific.net/amm.347-350.525.

Der volle Inhalt der Quelle

Annotation:

The traditional quality testing method does not apply for the new electronic device which have characters that high-value and small-count, take advantage of the small sampling theory, we can reduce the number of test sample significantly by using the Bayes method. In the processing of the experimental data, we can improve the accuracy of the quality assessment of electronic devices by using of the Bayes method and make full use the prior information.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

10

Burnell, P. K. P., A. Malton, K. Reavill und M. H. E. Ball. „Design, validation and initial testing of the Electronic LungTM device“. Journal of Aerosol Science 29, Nr. 8 (September 1998): 1011–25. http://dx.doi.org/10.1016/s0021-8502(97)10039-8.

Der volle Inhalt der Quelle

APA, Harvard, Vancouver, ISO und andere Zitierweisen

11

Stensrud, Linda, Bendik Ohrn, Rannveig S. J. Loken, Nargis Hurzuk und Alex Apostolov. „Testing of Intelligent Electronic Device (IED) in a digital substation“. Journal of Engineering 2018, Nr. 15 (01.10.2018): 900–903. http://dx.doi.org/10.1049/joe.2018.0172.

Der volle Inhalt der Quelle

APA, Harvard, Vancouver, ISO und andere Zitierweisen

12

Soelkner, G. „Optical beam testing and its potential for electronic device characterization“. Microelectronic Engineering 24, Nr. 1-4 (März 1994): 341–53. http://dx.doi.org/10.1016/0167-9317(94)90086-8.

Der volle Inhalt der Quelle

APA, Harvard, Vancouver, ISO und andere Zitierweisen

13

Bolufawi, Omonayo, Annadanesh Shellikeri und Jim P. Zheng. „Lithium-Ion Capacitor Safety Testing for Commercial Application“. Batteries 5, Nr. 4 (07.12.2019): 74. http://dx.doi.org/10.3390/batteries5040074.

Der volle Inhalt der Quelle

Annotation:

The lithium-ion capacitor (LIC) is a recent innovation in the area of electrochemical energy storage that hybridizes lithium-ion battery anode material and an electrochemical double layer capacitor cathode material as its electrodes. The high power compared to batteries and higher energy compared to capacitors has made it a promising energy-storage device for powering hand-held and portable electronic systems/consumer electronics, hybrid electric vehicles, and electric vehicles. The swelling and gassing of the LIC when subjected to abuse conditions is still a critical issue concerning the safe application in power electronics and commercial devices. However, it is imperative to carry out a thorough investigation that characterizes the safe operation of LICs. We investigated and studied the safety of LIC for commercial applications, by conducting a comprehensive abuse tests on LIC 200 F pouch cells with voltage range from 3.8 V to 2.2 V manufactured by General Capacitors LLC. The abuse tests include overcharge, external short circuit, crush (flat metal plate and blunt indentation), nail penetration test, and external heat test.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

14

Deffenbaugh, Paul I., Danielle M. Stramel und Kenneth H. Church. „Increasing the Reliability of 3D Printing a Wi-Fi Sensor Device“. International Symposium on Microelectronics 2016, Nr. 1 (01.10.2016): 000240–44. http://dx.doi.org/10.4071/isom-2016-wp11.

Der volle Inhalt der Quelle

Annotation:

Abstract Printed electronics and 3D printing have proved their viability for manufacturing functional devices. The state of the art is now at a crossroads where yield, reliability, survivability, and longevity improvements will govern its continued success in manufacturing. Currently, 3D printed electronics demonstration parts are either grossly oversized or are meticulously fabricated and involve significant human interaction and repair and ultimately have low manufacturing yield. Presented here are techniques for improving manufacturing yield. Coefficient of thermal expansion (CTE) mismatch problems frequently occur in devices with heterogeneous materials such as bulk metals, thermoplastics, thermosets, conductive pastes and inks, and pourable dielectrics. Controlling the interfaces between these materials in new and creative ways is key to solving these problems during manufacturing and lifecycle. Selecting materials with good properties such as adhesion, surface energy, flexibility, conductivity, and dielectric properties is the path forward to excellence in this field. Certain improvements in the design of 3D printed electronic devices (demonstrated here) show improved ruggedness. A long-lasting 3D printed electronic device that has been operating 24/7 for 21,000 hours is shown, and the techniques of its design and fabrication are described in detail. Several testing procedures evaluate the performance of the devices. Microscope photos show key problem areas, solutions are implemented, and material selections are presented. Overall device function is monitored wirelessly before, during, and after temperature changes.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

15

Ilzhöfer, A., H. Schneider und C. Tsakmakis. „Tensile testing device for microstructured specimens“. Microsystem Technologies 4, Nr. 1 (Dezember 1997): 46–50. http://dx.doi.org/10.1007/s005420050091.

Der volle Inhalt der Quelle

APA, Harvard, Vancouver, ISO und andere Zitierweisen

16

Horiuchi, Akinor, Toshio Binnaka und Shigeyuki Maruyama. „4604572 Device for testing semiconductor devices at a high temperature“. Microelectronics Reliability 27, Nr. 2 (Januar 1987): 395. http://dx.doi.org/10.1016/0026-2714(87)90310-6.

Der volle Inhalt der Quelle

APA, Harvard, Vancouver, ISO und andere Zitierweisen

17

Kharitonov, Anton S., und Gennadiy L. Shtrapenin. „Hardware and software complex for development and testing of electronic devices for transport industry“. Innotrans, Nr. 3 (2020): 33–36. http://dx.doi.org/10.20291/2311-164x-2020-3-33-36.

Der volle Inhalt der Quelle

Annotation:

The article focuses on creating an experimental option of hardware and software complex for development and testing of electrical and electronic devices for transport industry. The complex combines software support for modeling, analysis and optimization of circuits as well as hardware module with possibility to import data for installing its parameters, intended for assembly of the layout of the device, measurements and subsequent analysis of the obtained data.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

18

Nicoletto, G., A. Pirondi und P. Cova. „Accelerated life testing and thermomechanical simulation in power electronic device development“. Journal of Strain Analysis for Engineering Design 34, Nr. 6 (August 1999): 455–62. http://dx.doi.org/10.1243/0309324991513885.

Der volle Inhalt der Quelle

APA, Harvard, Vancouver, ISO und andere Zitierweisen

19

Feng, Ke, Ben Sheng Lu, Huan Liang Li und Jun Han. „Portable Fault Testing Device of Electronic Instrument Based on PC 104 Bus“. Applied Mechanics and Materials 128-129 (Oktober 2011): 661–64. http://dx.doi.org/10.4028/www.scientific.net/amm.128-129.661.

Der volle Inhalt der Quelle

Annotation:

A fault testing device for the electronic instrument of certain type military equipment is developed in this paper. The PC104 bus, modular instrumentation and signal processing technology are integrated in the device. It consists of PC104 bus peripheral system, signal condition circuit, electric distribution cabinet, interface unit, connection cables and peripheral dedicated signal fixture. Based on Windows CE embedded operation system, the application program is implemented with Visual C++ programming language. The device could detect and locate the fault on replaceable unit of modular board and functional block, and could also assist serviceman and technical support personnel in performing quick fault testing and equipment maintenance.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

20

Bannatyne, R., D. Gifford, K. Klein, K. McCarville, C. Merritt und S. Neddermeyer. „Creation of an ARM® Cortex®-M0 microcontroller for high temperature embedded systems“. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, HiTEN (01.07.2017): 000031–35. http://dx.doi.org/10.4071/2380-4491.2017.hiten.31.

Der volle Inhalt der Quelle

Annotation:

Abstract This paper will describe the development and testing of a new ARM© Cortex©-M based microcontroller for high temperature electronic systems. High temperature and electrical overstresses can cause latch-up in CMOS devices that will interfere with normal device operation or destroy the device. For reliable operation in the downhole drilling environment it was necessary to immunize this device against latch-up using an innovation processing technique. HARDSIL® technology that allows reliable latch-up free operation at extreme temperatures will be described. Details on the qualification and testing of the product to ensure that it meets the challenging environment will also be discussed. This includes electrical testing and temperature cycling testing to ensure that the different package options for the silicon device are mechanically sound in a high temperature environment that exposes the silicon and packaging materials to thermal cycling. The ecosystem for the microcontroller will also be discussed – hardware and software development tools are required to optimize the use of the device in extreme temperature embedded systems. An ecosystem of components is also required to operate with the microcontroller in the high temperature harsh environment.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

21

Bibbo, Daniele, Tomas Klinkovsky, Marek Penhaker, Petr Kudrna, Lukas Peter, Martin Augustynek, Vladimír Kašík et al. „A New Approach for Testing Fetal Heart Rate Monitors“. Sensors 20, Nr. 15 (25.07.2020): 4139. http://dx.doi.org/10.3390/s20154139.

Der volle Inhalt der Quelle

Annotation:

In this paper, a new approach for the periodical testing and the functionality evaluation of a fetal heart rate monitor device based on ultrasound principle is proposed. The design and realization of the device are presented, together with the description of its features and functioning tests. In the designed device, a relay element, driven by an electric signal that allows switching at two specific frequencies, is used to simulate the fetus and the mother’s heartbeat. The simulator was designed to be compliant with the standard requirements for accurate assessment and measurement of medical devices. The accuracy of the simulated signals was evaluated, and it resulted to be stable and reliable. The generated frequencies show an error of about 0.5% with respect to the nominal one while the accuracy of the test equipment was within ±3% of the test signal set frequency. This value complies with the technical standard for the accuracy of fetal heart rate monitor devices. Moreover, the performed tests and measurements show the correct functionality of the developed simulator. The proposed equipment and testing respect the technical requirements for medical devices. The features of the proposed device make it simple and quick in testing a fetal heart rate monitor, thus providing an efficient way to evaluate and test the correlation capabilities of commercial apparatuses.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

22

Hardy, Dorothy Anne, Zahra Rahemtulla, Achala Satharasinghe, Arash Shahidi, Carlos Oliveira, Ioannis Anastasopoulos, Mohamad Nour Nashed et al. „Wash Testing of Electronic Yarn“. Materials 13, Nr. 5 (09.03.2020): 1228. http://dx.doi.org/10.3390/ma13051228.

Der volle Inhalt der Quelle

Annotation:

Electronically active yarn (E-yarn) pioneered by the Advanced Textiles Research Group of Nottingham Trent University contains a fine conductive copper wire soldered onto a package die, micro-electro-mechanical systems device or flexible circuit. The die or circuit is then held within a protective polymer packaging (micro-pod) and the ensemble is inserted into a textile sheath, forming a flexible yarn with electronic functionality such as sensing or illumination. It is vital to be able to wash E-yarns, so that the textiles into which they are incorporated can be treated as normal consumer products. The wash durability of E-yarns is summarized in this publication. Wash tests followed a modified version of BS EN ISO 6330:2012 procedure 4N. It was observed that E-yarns containing only a fine multi-strand copper wire survived 25 cycles of machine washing and line drying; and between 5 and 15 cycles of machine washing followed by tumble-drying. Four out of five temperature sensing E-yarns (crafted with thermistors) and single pairs of LEDs within E-yarns functioned correctly after 25 cycles of machine washing and line drying. E-yarns that required larger micro-pods (i.e., 4 mm diameter or 9 mm length) were less resilient to washing. Only one out of five acoustic sensing E-yarns (4 mm diameter micro-pod) operated correctly after 20 cycles of washing with either line drying or tumble-drying. Creating an E-yarn with an embedded flexible circuit populated with components also required a relatively large micro-pod (diameter 0.93 mm, length 9.23 mm). Only one embedded circuit functioned after 25 cycles of washing and line drying. The tests showed that E-yarns are suitable for inclusion in textiles that require washing, with some limitations when larger micro-pods were used. Reduction in the circuit’s size and therefore the size of the micro-pod, may increase wash resilience.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

23

Kasukabe, Susumu, Masasi Ookubo, Yutaka Akiba, Minoru Tanaka und Hitoshi Yokono. „4931726 Apparatus for testing semiconductor device“. Microelectronics Reliability 31, Nr. 2-3 (Januar 1991): vii. http://dx.doi.org/10.1016/0026-2714(91)90266-a.

Der volle Inhalt der Quelle

APA, Harvard, Vancouver, ISO und andere Zitierweisen

24

Vanichkin, D. O., I. Ya Gantman und A. V. Levko. „ANALYSIS OF THE LARGE ARRAY OF RESULTS OBTAINED DURING THE PULSED MODE DIELECTRIC BREAKDOWN TESTING OF ELECTRONIC DEVICES“. Electronic engineering Series 2 Semiconductor devices 257, Nr. 2 (2020): 47–69. http://dx.doi.org/10.36845/2073-8250-2020-257-2-47-69.

Der volle Inhalt der Quelle

Annotation:

In this paper we perform the analysis of the large array of experimental data obtained by the testing center of S&PE Pulsar JSC during the dielectric breakdown testing of electronic devices under pulsed operation mode. Tests were carried out as part of the development work commissioned by the Ministry of Industry and Trade of Russia. The results of the analysis are arranged as diagrams, graphs and tables, taking into account the methodological basis, purpose, classification group and manufacturing method of each device under test.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

25

Kumrey, G. R., und S. K. Mahobia. „STUDY AND PERFORMANCE TESTING OF TRANSISTOR WITH COMMON EMITTER AMPLIFIER CIRCUIT“. International Journal of Research -GRANTHAALAYAH 4, Nr. 8 (31.08.2016): 100–103. http://dx.doi.org/10.29121/granthaalayah.v4.i8.2016.2567.

Der volle Inhalt der Quelle

Annotation:

The transistor has ranking in 20th century technology. It is finding the application in all electronic devices as radios, computers. Integrated circuits are containing various transistors, which are made by silicon. The transistors are used to handle large current and/or large voltages. As example, the final audio stage in the stereo system used a power transistors amplifier to drive the various speakers. Transistors are device, which are utilizes a change in current to produce a large change in voltage, current, or power.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

26

Podoleanu, Cristian, und Jean-Claude Deharo. „Management of Cardiac Implantable Electronic Device Infection“. Arrhythmia & Electrophysiology Review 3, Nr. 3 (2014): 184. http://dx.doi.org/10.15420/aer.2014.3.3.184.

Der volle Inhalt der Quelle

Annotation:

Despite improved preventive measures, infection associated with the use of cardiac implantable electronic devices (CIEDs) to treat often life-threatening conditions is rising at an average annual rate of almost 5 %. This rise is being driven by the increasing complexity of CIED technology and by the advancing age and co-morbidities of the patients. Although CIED infection is usually suspected based on local signs at the generator pocket site, diagnosis can be challenging in patients presenting no local manifestations or symptoms. Diagnostic methods include microbiological testing and echocardiography, and may be completed by positron emission tomography (PET)/computed tomography (CT) scan in selected cases. CIED infection requires a multidisciplinary approach in view of hardware extraction, targeted antibiotic therapy and reimplantation on an as-needed basis. Antibiotic prophylaxis targeting staphylococcal flora is recommended but the relation of these infections to medical care exposes patients to multi-resistant bacteria. New preventive measures utilising an antibacterial sleeve look promising. Treatment can be started on an empirical basis using an antistaphylococcal agent but must be continued using targeted antibiotic therapy. Crucial questions remain as to the best prevention strategy, optimal duration and timing of antibiotic therapy, and the most effective reimplantation technique.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

27

Koryahin, V. M., O. S. Blavt und S. V. Ponomaryov. „Innovative Intestification of Testing of Strength Endurance in Physical Education of Students With Chronic Diseases“. Teorìâ ta Metodika Fìzičnogo Vihovannâ 19, Nr. 3 (25.09.2019): 116–22. http://dx.doi.org/10.17309/tmfv.2019.3.02.

Der volle Inhalt der Quelle

Annotation:

The study objective is to substantiate and implement modern information-communication technologies (ICT) means for improving the testing of strength endurance of hands and upper body of students with chronic diseases in physical education. Materials and methods. To solve the research tasks used the methods of comparing and contrasting are used and analysis, synthesis, abstraction, formalization and technical modelling. Results. The result of a scientific search aimed at integrating ICT into test control of strength endurance of students with chronic diseases is a device of capacitive sensor testing. The designed capacitive touch tester is based on a combination of modern nanotechnology and microprocessor systems, including smart phone’s, tablets, etc. It is a constructive solution for electronic measuring systems of spatial position of objects based on capacitive sensor devices. Conclusions. The effectiveness of using the designed device in testing students’ of strength endurance of hands and upper body is achieved through the ease of use and compactness of the device, student-friendly testing procedure and the efficiency and reliability of control.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

28

Soman, Varun, Mark D. Poliks, James N. Turner, Mark Schadt, Michael Shay und Frank Egitto. „Reliability Analysis of a Wearable Sensor Patch (WSP) to Monitor ECG Signals“. International Symposium on Microelectronics 2017, Nr. 1 (01.10.2017): 000194–200. http://dx.doi.org/10.4071/isom-2017-wa23_137.

Der volle Inhalt der Quelle

Annotation:

Abstract Flexible Hybrid Electronic (FHE) devices interface flexible sensors and circuits with conventional rigid electronic components. This work reports preliminary results for the reliability aspects of a project aimed at fabricating a Wearable Sensor Patch (WSP) to monitor ECG signals. The device was fabricated by interfacing flexible electroplated Cu circuit lines and an ECG sensor on a Kapton® polyimide (PI) substrate with rigid electronics connected using SnPb solder (reflow temperature: 204 °C), making it a FHE device. Phase I of this project faced reliability issues as Cu circuit lines were susceptible to failure due to cracking near the front-end signal conditioning chip. This issue needed to be resolved in Phase II of the project to produce a robust device fit to be used in real world applications. The effect of changes in Cu trace thickness (2 and 6 μm) and Kapton® PI thickness (2 and 5 mil) on device robustness was tested. Effect of the use of low reflow temperature SnBi solder (reflow temperature: 175 °C) on device reliability was also tested. Multiple devices fabricated using different configurations of Cu trace and Kapton® PI thicknesses and either SnPb or SnBi solder were bend tested to single out the most robust configuration. Improved solder pad design for Cu traces at solder joint sites was also tested. It was observed that only devices with 6 μm thick Cu traces, 2 mil thick Kapton® and SnBi solder had no defects as a result of thermal cycling during fabrication. They also performed best during bend testing. Some of the factors contributing to robustness of this configuration might be lower CTE mismatch due to lower solder reflow temperature as well as greater strength under bending due to increased thickness. Improved solder pad design for Cu traces also improved device robustness considerably.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

29

Shoaib, Muhammad, Nor Hisham Hamid, Aamir Farooq Malik, Noohul Basheer Zain Ali und Mohammad Tariq Jan. „A Review on Key Issues and Challenges in Devices Level MEMS Testing“. Journal of Sensors 2016 (2016): 1–14. http://dx.doi.org/10.1155/2016/1639805.

Der volle Inhalt der Quelle

Annotation:

The present review provides information relevant to issues and challenges in MEMS testing techniques that are implemented to analyze the microelectromechanical systems (MEMS) behavior for specific application and operating conditions. MEMS devices are more complex and extremely diverse due to the immersion of multidomains. Their failure modes are distinctive under different circumstances. Therefore, testing of these systems at device level as well as at mass production level, that is, parallel testing, is becoming very challenging as compared to the IC test, because MEMS respond to electrical, physical, chemical, and optical stimuli. Currently, test systems developed for MEMS devices have to be customized due to their nondeterministic behavior and complexity. The accurate measurement of test systems for MEMS is difficult to quantify in the production phase. The complexity of the device to be tested required maturity in the test technique which increases the cost of test development; this practice is directly imposed on the device cost. This factor causes a delay in time-to-market.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

30

Afiyat, Nur, Mohamad Hariyadi und Muhammad Dimas Al Hakim. „PROTOTYPE SISTEM PENGENDALIAN PERANGKAT ELEKTRONIK BERBASIS IOT (INTERNET OF THINGS) MENGGUNAKAN VOICE CONTROL DAN BLYNK“. Jurnal RESISTOR (Rekayasa Sistem Komputer) 4, Nr. 1 (21.04.2021): 93–104. http://dx.doi.org/10.31598/jurnalresistor.v4i1.750.

Der volle Inhalt der Quelle

Annotation:

With the IoT based prototype electronic device control system, users can control electronic devices at home. Commands can be done in two ways, namely using voice or voice control with the Google Assistant application and using the interface buttons on the Blynk application. The prototype system can control electronic devices on and off and can control fan speed. The main component uses NodeMCU as a microcontroller that is equipped with a WiFi module so that it can be connected to the WiFi network needed to be connected to the internet. This system works when the user gives voice commands to control electronic devices via Google Assistant or the user can also control electronic devices by pressing a button on the Blynk application. Based on the results of testing the success of controlling using the voice control system has an average success of 100%, and testing the success of controlling using the Blynk system has an average of 100%. While the measurement of delay when controlling using voice control, each command has an average delay of 15.8797 - 17.9731 milliseconds, and while for testing using the interface button on the Blynk application, each command has an average delay of 15.8926-17. 5463 milliseconds.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

31

Druzhinina, Polina O., und Aelita V. Shaburova. „ECONOMIC EFFICIENCY OF USING AN OPTICAL-ELECTRONIC INSTRUMENT FOR TESTING A SET OF TRIAL EYE GLASSES“. Interexpo GEO-Siberia 6, Nr. 1 (08.07.2020): 131–37. http://dx.doi.org/10.33764/2618-981x-2020-6-1-131-137.

Der volle Inhalt der Quelle

Annotation:

The article discusses the economic efficiency of using an optoelectronic device for verifying a set of test eyeglass lenses in a metrological laboratory, and calculates the payback from introducing the device for MedtechStandard LLC. A characteristic is given to an optical-electronic device, namely, a lensmeter standard multi-functional LEM-1. The calculation of the number of jobs planned for verification of sets of trial eyeglass lenses is carried out. Also, for the company MedtechStandard LLC, the positive effects from the use of an optical-electronic device of the standard multifunctional lens meter LEM-1 were considered, which include reducing the cost of subcontracting, reducing the time it takes to test a set of trial spectacle lenses, additional profit for the enterprise, reducing the risk of loss contract and attracting new customers. The estimated annual program of attorney spectacle lenses is calculated.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

32

Liu, Lu Ning, Yang Guang Zhang, Zhen Yu Shi und Zhan Qiang Liu. „Development of Electronic Impact Hammer and its Application to Face Milling Cutter Modal Analysis“. Advanced Materials Research 797 (September 2013): 585–91. http://dx.doi.org/10.4028/www.scientific.net/amr.797.585.

Der volle Inhalt der Quelle

Annotation:

As for the deficiency by using manual hammer for modal testing, an electronic impact hammer testing device is developed in this paper. The developed electronic impact hammer consists of workbench, controller, trigger, switching power supply, and actuator, etc. According to the electromagnetic theory, by controlling traction electromagnet on/off to make the traction force drive the impact hammer, the hammer impacting on the testing object can be realized. By means of controlling the contact time between the impact hammer and the object to be impacted, an ideal force pulse signal can be got. The developed electronic impact hammer has the advantages of repeatability and regulatory. Face milling cutter tip point frequency response functions is tested by using the device in this paper. The frequency response curve and the modal parameters for the face milling cutter are obtained.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

33

Smith, Lilla Safford, Gordon D. Hoople, Jim C. Cheng und Albert P. Pisano. „A Resealable, Gas-Tight Packaging Technique for Silicon Microfluidic Devices“. Journal of Microelectronics and Electronic Packaging 12, Nr. 1 (01.01.2015): 49–54. http://dx.doi.org/10.4071/imaps.444.

Der volle Inhalt der Quelle

Annotation:

Recent efforts have led to the development of a silicon microfluidic cooling device known as the microcolumnated loop heat pipe (μCLHP). The μCLHP, like a traditional heat pipe, utilizes phase change of a liquid to rapidly draw heat away from a concentrated hot spot. Proper gas-tight packaging of this device is critical for the reliable testing of the recirculating fluid. This work presents a novel approach to filling and sealing the μCLHP. A miniature valve (Beswick M3SV-N) is bonded to the silicon fill ports of the μCLHP. The use of a resealable valve, as opposed to a permanent sealing method, allows the device to be filled, sealed, and then evacuated for testing with different fluids and at multiple pressures. Building on earlier work, the fill ports on the μCLHP were metalized with a Cr (10 nm)/Ni (200 nm)/Au (10 nm) stack. Then a lead-based solder was used to bond the stainless steel adapter to the metalized layers. Leak testing of devices sealed using these miniature valves demonstrated average hourly percent weight losses between 0.17% and 0.82%. While this bonding method has been developed specifically for the μCLHP, it is broadly applicable to most ceramic microfluidic devices, especially those fabricated from silicon and glass. Due to the time-intensive manufacturing process of microfluidic devices made from these hard materials, a novel, robust, resealing method that allows reuse of a single silicon microfluidic device for multiple test conditions is highly desirable.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

34

Plusquellic, J. F., S. P. Levitan und D. M. Chiarulli. „Digital IC device testing by transient signal analysis (TSA)“. Electronics Letters 31, Nr. 18 (31.08.1995): 1568–70. http://dx.doi.org/10.1049/el:19951065.

Der volle Inhalt der Quelle

APA, Harvard, Vancouver, ISO und andere Zitierweisen

35

Willberg, HansH, und Ekkehar Ueberreiter. „4889242 Device for testing and sorting electronic components, more particularly integrated circuit chips“. Microelectronics Reliability 31, Nr. 1 (Januar 1991): i—ii. http://dx.doi.org/10.1016/0026-2714(91)90470-r.

Der volle Inhalt der Quelle

APA, Harvard, Vancouver, ISO und andere Zitierweisen

36

Shen, Zhenzhen, James Storey, Otto Fanini und Michael Osterman. „Modeling Vibration Induced Fatigue Failure of Free Standing Wire Bonds“. International Symposium on Microelectronics 2017, Nr. 1 (01.10.2017): 000635–40. http://dx.doi.org/10.4071/isom-2017-tha55_087.

Der volle Inhalt der Quelle

Annotation:

Abstract Wire bonds are used to connect device terminals to package terminals or substrate terminal that forms circuits that are needed to create desired higher level functions. If a wire bond breaks or becomes detached during operation, the desired function will be lost. Depending on the design, a loss in function could be catastrophic. Aluminum, gold, and copper wires are used to create wire bonds in electronic products. These materials have been selected for their ability to be formed as fine wires and their ability to provide low electrical resistance. In many electronics packages, wire bonds are encapsulated in a polymer molding compound that is used to protect the electronic device. However, in some electronic devices such as hermetically sealed cavity packages, wire bonds may be free-standing. Under vibration loading, free-standing wire bonds may be subject to failure due to mechanical fatigue. In this work, an analytic model is presented for predicting natural frequency of a free-standing wire bond and for assessing a wire bond time to failure under a harmonic loading condition. The model for natural frequency is calibrated by finite element analysis and validated through experimental testing. The life prediction model, a test plan, and preliminary test results are presented.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

37

Tenelsen, Florian, Dennis Brueckner, Thomas Muehlbauer und Marco Hagen. „Validity and Reliability of an Electronic Contact Mat for Drop Jump Assessment in Physically Active Adults“. Sports 7, Nr. 5 (16.05.2019): 114. http://dx.doi.org/10.3390/sports7050114.

Der volle Inhalt der Quelle

Annotation:

The aim of the present study was to investigate the concurrent validity and the test–retest reliability of an electronic contact mat for drop jump assessment in physically active adults. Seventy-nine young, physically active adults participated in the validity study, and 49 subjects were recruited for the reliability study. The motor task required subjects to perform two-legged drop jumps using drop heights of 24, 43, and 62 cm as well as one-legged drop jumps with the left and right leg using a drop height of 24 cm. Ground contact times were simultaneously quantified with an electronic contact mat, a force plate (i.e., gold standard), and a light-barrier system (another criterion device). Concurrent validity was assessed using intraclass correlation coefficient (ICC), systematic bias, limits of agreement, and linear regression analysis. Test–retest reliability (one week apart) was determined by calculating the ICC, the standard error of measurement (SEM), the coefficient of variation (CV), and Lin´s concordance correlation coefficient (рc). Further, we determined the minimal detectable change (MDC95%). Irrespective of drop height and jump condition, good agreements between testing devices (ICC ≥ 0.95) were shown. Compared to the force plate (−0.6 to 3.1 ms) but not to the light-barrier system (31.4 to 41.7 ms), the contact mat showed low systematic bias values. In terms of test–retest reliability, our analyses showed that the measuring devices are in agreement (ICC: 0.70–0.92; SEM: 8.5–18.4 ms; CV: 3.6–6.4%). Depending on the measurement device, drop height, and jump condition, a MDC95% value ranging from 23.6 to 50.9 ms represents the minimum amount of change needed to identify practical relevant effects in repeated measurements of drop jump performance. Our findings indicate that the electronic contact mat is a valid and reliable testing device for drop jump assessment from different drop heights in young physically active adults.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

38

Mbaruku, A. L., U. P. Trociewitz und J. Schwartz. „Development of a Low-Temperature Electro-Mechanical Testing Device“. IEEE Transactions on Appiled Superconductivity 15, Nr. 2 (Juni 2005): 3620–23. http://dx.doi.org/10.1109/tasc.2005.849374.

Der volle Inhalt der Quelle

APA, Harvard, Vancouver, ISO und andere Zitierweisen

39

Liu, Huajun, Qingyun Qu, Qinyan Pan, Yu Wu, Chuanjun Huang, Laifeng Li, Min Yu und Liang Guo. „Testing of the Ceramic Insulation Break for Fusion Device“. IEEE Transactions on Applied Superconductivity 24, Nr. 3 (Juni 2014): 1–4. http://dx.doi.org/10.1109/tasc.2013.2287278.

Der volle Inhalt der Quelle

APA, Harvard, Vancouver, ISO und andere Zitierweisen

40

Wang, Zhan Sheng, Xin Zhao, Jian Jun Gao, Pan Yang, Wei Xu und Hong Xin Pan. „Study on Testing System for Real-Time of Communication of the Digital Substation's Secondary Equipments“. Applied Mechanics and Materials 420 (September 2013): 401–6. http://dx.doi.org/10.4028/www.scientific.net/amm.420.401.

Der volle Inhalt der Quelle

Annotation:

Digital substations primary equipments make use of many intelligent primary equipment, for example, Electronic Transformers (including Electronic Voltage Transformers EVT and Electronic Current Transformers ECT,which meet the standards IEC 60044-7/8),intelligent switch and so on,digital substations secondary equipments include many IED(Intelligent Electronic Device). This thesis studys on the function,design,hardware and testing method of the testing system for real-time of communication of the digital substations secondary equipments.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

41

Zhelev, Georgi, Koycho Koev, Viktor Stoyanov und Vladimir Petrov. „Electronic rat-control devices – solution or scam? Results of field trials and a summary of the literary data“. Archives of Veterinary Medicine 11, Nr. 1 (16.09.2018): 27–36. http://dx.doi.org/10.46784/e-avm.v11i1.14.

Der volle Inhalt der Quelle

Annotation:

The electronic rat-control devices are humane means of controlling harmful rodents without toxic substances. They are relatively inexpensive and very easy to use and have gained increasing popularity in recent years. Although they have been introduced long ago in the practice of deratization, scientific information about their real effectiveness is scarce and at the same time very controversial. The purpose of this study was to evaluate the repellent efficiency of an electronic device using the combined action of ultrasonic waves, light signals, and electromagnetic field change in practice. Two field trials were carried out on a cattle-breeding farm and a feed warehouse inhabited by brown rats (Rattus norvegicus) and roof rats (Rattus rattus). Repellent efficacy was determined by comparing the indicators evaluating the presence and activity of rodents during the pre-testing period before the inclusion of the device and after its activation during the test period. A lack of repellent effect was found in both field studies. The results obtained are supported by an analysis of the scientific literature confirming the inadequate effectiveness of electronic rat control devices in practical conditions. Emphasis is placed on the deficiencies and the need for regulatory adjustments governing the control and admission of electronic devices to control rats on the market.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

42

Hobkirk, Andréa L., Zachary Bitzer, Reema Goel, Christopher T. Sica, Craig Livelsberger, Jessica Yingst, Kenneth R. Houser et al. „An Electronic Aerosol Delivery System for Functional Magnetic Resonance Imaging“. Substance Abuse: Research and Treatment 14 (Januar 2020): 117822182090414. http://dx.doi.org/10.1177/1178221820904140.

Der volle Inhalt der Quelle

Annotation:

Background: Public health concerns over the addictive potential of electronic cigarettes (e-cigs) have heightened in recent years. Brain function during e-cig use could provide an objective measure of the addictive potential of new vaping products to facilitate research; however, there are limited methods for delivering e-cig aerosols during functional magnetic resonance imaging (fMRI). The current study describes the development and feasibility testing of a prototype to deliver up to four different e-cig aerosols during fMRI. Methods: Standardized methods were used to test the devices’ air flow variability, nicotine yield, and free radical production. MRI scans were run with and without the device present to assess its safety and effects on MRI data quality. Five daily smokers were recruited to assess plasma nicotine absorption from e-liquids containing nicotine concentrations of 8, 11, 16, 24, and 36 mg/ml. Feedback was collected from participants through a semi-structured interview and computerized questionnaire to assess comfort and subjective experiences of inhaling aerosol from the device. Results: Nicotine yield captured from the aerosol produced by the device was highly correlated with the nicotine concentration of the e-liquids used (R2 = 0.965). Nicotine yield was reduced by a mean of 48% and free radical production by 17% after traveling through the device. The e-liquid containing the highest nicotine concentration tested (36 mg/ml) resulted in the highest plasma nicotine boost (6.6 ng/ml). Overall, participants reported that the device was comfortable to use and inhaling the e-cig aerosols was tolerable. The device was determined to be safe for use during fMRI and had insignificant effects on scan quality. Conclusions: With the current project, we were able to design a working prototype that safely and effectively delivers e-cig aerosols during fMRI. The device has the potential to be used to assess brain activation during e-cig use and to compare brain reactivity to varying flavors, nicotine concentrations, and other e-cig characteristics.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

43

Kurbanismailov, Z. M., A. T. Tarlanov und E. M. Akimov. „The technique of point visualization of the electric field in space and time“. Russian Technological Journal 9, Nr. 3 (28.06.2021): 58–65. http://dx.doi.org/10.32362/2500-316x-2021-9-3-58-65.

Der volle Inhalt der Quelle

Annotation:

Testing of electronic devices is an integral part of the technological process of any manufacturer of such equipment. In this case, an electronic device is understood as an energy-intensive unit such as a mobile phone, data center or spacecraft. One of the key stages of testing is to identify the effect of electric fields on various electronic components of the device. This stage often requires making a mock-up of some part of an unfinished device in order to fix interference with special equipment. This requires time, financial and human resource costs. In order to reduce these costs in the modern world, the use of mathematical modeling tools for testing noise immunity and electromagnetic compatibility is becoming popular. In this paper, it is proposed to use an algorithm for visualizing electric fields in three-dimensional space and time. The algorithm is easily embedded into applications as a component of a mathematical modeling system. The work considered three ways of visualizing the electric field strength: starting from a simple setting of points in space, on the basis of which the electric field will be built, around the source of electric field radiation, to the use of algorithms that make it possible to arrange points equidistantly based on a given number of points in space for the formation of an electric field. The performance and visual implications of these methods were analyzed. The proposed methodology will be useful to the developer community as an embedded solution for point visualization of the electric field in any project in any algorithmic language with the ability to animate in time.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

44

Liu, De Wang. „Research of Steady Acquisition Method of Large-Scale Electronic Circuit Shorted Signal“. Applied Mechanics and Materials 602-605 (August 2014): 2765–68. http://dx.doi.org/10.4028/www.scientific.net/amm.602-605.2765.

Der volle Inhalt der Quelle

Annotation:

Large-scale electronic circuits need to collect shorted signal to meet the control requirements of closing phase angle in high voltage circuit breaker testing process. . In this paper, by using photovoltaic technology and the design of a new synchronous voltage signal acquisition device, a stable, accurate voltage signal is got. This paper mainly introduces the principle, structure, advantages and applications of signal transmission interference problems of the new synchronous voltage signal acquisition device. The practical application showed that the functions of synchronization acquisition device have reached the designed requirements, which highly improves the stability of the short-circuit signal acquisition.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

45

Desai, Chandrakant S., Zhichao Wang, Russell Whitenack und Tribikram Kundu. „Testing and Modeling of Solders Using New Test Device, Part 1: Models and Testing“. Journal of Electronic Packaging 126, Nr. 2 (01.06.2004): 225–31. http://dx.doi.org/10.1115/1.1756146.

Der volle Inhalt der Quelle

APA, Harvard, Vancouver, ISO und andere Zitierweisen

46

Pirc, Eva, Bertrand Balosetti, Damijan Miklavčič und Matej Reberšek. „Electronic Emulator of Biological Tissue as an Electrical Load during Electroporation“. Applied Sciences 10, Nr. 9 (29.04.2020): 3103. http://dx.doi.org/10.3390/app10093103.

Der volle Inhalt der Quelle

Annotation:

Electroporation is an emerging technology, with great potential in many different medical and biotechnological applications, food engineering and biomass processing. Large variations of biological load characteristics, however, represent a great challenge in electroporator design, which results in different solutions. Because a clinical electroporator is a medical device, it must comply with medical device regulative and standards. However, none of the existing standards directly address the operation or electroporator’s performance requirements. In order to evaluate clinical, laboratory and prototype electroporation devices during the development process, or to evaluate their final performance considering at least from the perspective of output pulse parameters, we present a case study on the design of an electronic emulator of biological tissue as an electrical load during electroporation. The proposed electronic load emulator is a proof of concept, which enables constant and sustainable testing and unbiased comparison of different electroporators’ operations. We developed an analog electrical circuit that has equivalent impedance to the beef liver tissue in combination with needle electrodes, during high voltage pulse delivery and/or electroporation. Current and voltage measurements during electroporation of beef liver tissue ex vivo, were analyzed and parametrized to define the analog circuit equation. An equivalent circuit was simulated, built and validated. The proposed concept of an electronic load emulator can be used for “classical” electroporator (i.e., not nanosecond) performance evaluation and comparison of their operation. Additionally, it facilitates standard implementation regarding the testing protocol and enables quality assurance.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

47

Oguchi, T., F. Hanawa, N. Takato, N. Tomita und N. Atobe. „Arrayed hybrid filter/coupler device for inservice fibre line testing“. Electronics Letters 29, Nr. 20 (1993): 1786. http://dx.doi.org/10.1049/el:19931189.

Der volle Inhalt der Quelle

APA, Harvard, Vancouver, ISO und andere Zitierweisen

48

Ismailov, T. A., A. R. Shakhmaeva und A. M. Ibragimova. „THERMOELECTRIC SEMICONDUCTOR DEVICES FOR THERMAL STABILISATION OF REA POWERFUL TRANSISTORS“. Herald of Dagestan State Technical University. Technical Sciences 47, Nr. 1 (21.04.2020): 30–38. http://dx.doi.org/10.21822/2073-6185-2020-47-1-30-38.

Der volle Inhalt der Quelle

Annotation:

Abstract. Aim. The aim of the study is to analyse the problem of heat dissipation in high-power transistors and develop devices for their thermal stabilisation when used in electronic equipment. Method. A method is proposed for testing power transistors using a device to to ensure thermal stabilisation in the stating volume by means of a two-position temperature controller along with a model for the use of these components in electronic devices. The proposed devices support high thermal stabilisation accuracy of power transistors in a radioelectronic device system allowing temperature to be maintained at a given level with high accuracy by means of a thermoelectric battery. Results. Device designs were developed for increasing the accuracy of thermal stabilisation of power transistors with high efficiency, low energy consumption and small size. Conclusion. Based on the results of experimental studies, optimal designs for devices for the thermostabilisation of radioelectronic device components that dissipate significant power during their operation are presented. The devices can be used to increase the accuracy of thermal stabilisation of the radioelectronic device element by means of a working substance whose melting point coincides with its thermal stabilisation temperature. The developed devices have the following functions: the thermoelectric battery sections of the thermoelectric battery will be sequentially disconnected depending on the electrical signals from the temperature sensors to which the solid phase of the working substance has moved. The battery of the thermoelectric module (TEM) removes excess heat from the heat-stabilising substance while maintaining the required temperature of the radioelectronic device element. Excess heat from the heat-generating junctions of the TEM battery is removed by the heat exchanger. During melting of the working substance, the temperature of the thin-walled metal container – and, accordingly, the temperature of the CEA element – can be maintained at a constant value equal to the melting temperature of the working substance.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

49

Al Kalaa, Mohamad Omar, Seth J. Seidman, Donald Witters und Hazem H. Refai. „Practical aspects of wireless medical device coexistence testing“. IEEE Electromagnetic Compatibility Magazine 6, Nr. 4 (2017): 47–52. http://dx.doi.org/10.1109/memc.0.8272281.

Der volle Inhalt der Quelle

APA, Harvard, Vancouver, ISO und andere Zitierweisen

50

Jia, Xiaofei, Wenhao Chen, Bing Ding und Liang He. „Noise test method for dual-gate MOSFET device“. Modern Physics Letters B 33, Nr. 31 (10.11.2019): 1950387. http://dx.doi.org/10.1142/s0217984919503871.

Der volle Inhalt der Quelle

Annotation:

In recent years, with the development of mesoscopic physics and nanoelectronics, the research on noise and testing technology of electronic components has been developed. It is well known that noise can characterize the transmission characteristics of carriers in nanoscale electronic components. With the continuous shrinking of the device size, the carrier transport of nanoscale MOSFET devices has been gradually transformed from the traditional drift-diffusion to become the quasi-ballistic or ballistic transport, and its current noise contains granular and thermal noise. The paper by Jeon et al. [The first observation of shot noise characteristics in 10-nm scale MOSFETs, in Proc. 2009 Symp. VLSI Technology (IEEE, Honolulu, 2009), pp. 48–49] presents the variation relation of 20 nm MOSFET current noise with source–drain current and voltage, and its current noise characteristic is between thermal noise and shot noise, so 20 nm MOSFET current noise is shot noise and thermal noise. The paper by Navid et al. [J. Appl. Phys. 101 (2007) 124501] shows through simulation that the 60 nm MOSFET current noise is suppressed shot noise and thermal noise. At present, the current noise has seriously affected the basic performance of the device, thus the circuit cannot work normally. Therefore, it is necessary to study the generation mechanism and characteristics of current noise in electronic components so as to suppress device noise, which can not only realize the reduction of device noise, but also play a positive role in the work-efficiency, life-span and reliability of electronic components.

APA, Harvard, Vancouver, ISO und andere Zitierweisen

Zeitschriftenartikel zum Thema „Electronic device testing“

Geben Sie eine Quelle nach APA, MLA, Chicago, Harvard und anderen Zitierweisen an