Zeitschriftenartikel zum Thema „Electronic board design“
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Kolesnyk, Kostiantyn, Andrzej Łukaszewicz, Volodymyr Dutka, Dmytro Zahoruiko und Bohdan Vasylyshyn. „Automated design of printed circuit boards made by electronic computer –aided design (CAD) with the next using in CNC- machine“. Computer Design Systems. Theory and Practice 4, Nr. 1 (2022): 9–16. http://dx.doi.org/10.23939/cds2022.01.009.
Der volle Inhalt der QuelleLiu, Yang, Yun Feng Zhang und Ya Kui Xing. „The Optimized Design of the Electronic Bus Stop Board“. Applied Mechanics and Materials 97-98 (September 2011): 1195–200. http://dx.doi.org/10.4028/www.scientific.net/amm.97-98.1195.
Der volle Inhalt der QuelleAkash R., Maya Srinivas, Venugopal Rao S, Sanjan Kashyap, Adithya T.G., Pavithra G., Sindhu Sree M. und T.C.Manjunath. „Wireless notice board design using bluetooth technologies“. international journal of engineering technology and management sciences 6, Nr. 6 (28.11.2022): 230–33. http://dx.doi.org/10.46647/ijetms.2022.v06i06.035.
Der volle Inhalt der QuelleGOROSHKO, Andrii, Igor KOVTUN und Maryna ZEMBYTSKA. „IMPROVING THE ACCURACY OF THE VIBRATION ANALYSIS OF ON-BOARD ELECTRONICS PRINTED BOARDS“. Herald of Khmelnytskyi National University. Technical sciences 313, Nr. 5 (27.10.2022): 301–6. http://dx.doi.org/10.31891/2307-5732-2022-313-5-301-306.
Der volle Inhalt der QuelleYang, Yan Fei, Jian Wang, Xue Jian Liu, Xiao Juan Yang und Ya Hu. „Design of Electronic Seal Terminal for Tank Vehicles“. Applied Mechanics and Materials 620 (August 2014): 133–36. http://dx.doi.org/10.4028/www.scientific.net/amm.620.133.
Der volle Inhalt der QuelleSuriano, Domenico. „Design and Development of an Electronic Board for Supporting the Operation of Electrochemical Gas Sensors“. Hardware 2, Nr. 2 (14.06.2024): 173–89. http://dx.doi.org/10.3390/hardware2020009.
Der volle Inhalt der QuelleUSLU-OZKUCUK, Gonca. „TRIAC Based Isolated AC Load Drive Equivalent Circuit Design of Solid-State Relay“. Eurasia Proceedings of Science Technology Engineering and Mathematics 26 (30.12.2023): 183–89. http://dx.doi.org/10.55549/epstem.1409469.
Der volle Inhalt der QuellePandey und Vora. „Open Electronics for Medical Devices: State-of-Art and Unique Advantages“. Electronics 8, Nr. 11 (01.11.2019): 1256. http://dx.doi.org/10.3390/electronics8111256.
Der volle Inhalt der QuelleZhang, Cai Rong, Guo Liang Liu und Bin Wei. „Design and Implementation of Electronic Bus Stop Boards System Based on Wireless Communication Module“. Applied Mechanics and Materials 651-653 (September 2014): 2441–44. http://dx.doi.org/10.4028/www.scientific.net/amm.651-653.2441.
Der volle Inhalt der QuelleBucolo, Maide, Arturo Buscarino, Luigi Fortuna, Carlo Famoso, Mattia Frasca, Antonino Cucuccio, Gaetano Rasconà und Giovanni Vinci. „A Comparative Analysis of Computer-Aided Design Tools for Complex Power Electronics Systems“. Energies 14, Nr. 22 (18.11.2021): 7729. http://dx.doi.org/10.3390/en14227729.
Der volle Inhalt der QuelleLiao, Wei. „Electronic Circuit Board Design and Production Project Design and Teaching Innovation“. Creativity and Innovation 6, Nr. 3 (2022): 226–30. http://dx.doi.org/10.47297/wspciwsp2516-252745.20220603.
Der volle Inhalt der QuelleSimon, Erik P., Moritz Fröhlich, Ch Kallmayer und K. D. Lang. „Design and Optimization of an Injection-Moldable Force-Fit Interconnection Module for Smart Textile Applications“. Advances in Science and Technology 80 (September 2012): 96–101. http://dx.doi.org/10.4028/www.scientific.net/ast.80.96.
Der volle Inhalt der QuelleKhan, Noor Mohmmed, Shubhangi Patil, Tushar Diggewadi und Anand Gudnavar. „Cinch and Sterling Analog Circuits for Laboratory“. International Journal of Advanced Research in Electrical, Electronics and Instrumentation Engineering 6, Nr. 01 (25.06.2017): 51–58. http://dx.doi.org/10.15662/ijareeie.2017.0601007.
Der volle Inhalt der QuelleNazirkulov, N., und N. Burambaeva. „A systematic approach to in-circuit diagnostics and design of printed circuit boards for locomotives“. BULLETIN of the L.N. Gumilyov Eurasian National University. PHYSICS. ASTRONOMY Series 141, Nr. 4 (30.12.2022): 29–40. http://dx.doi.org/10.32523/2616-6836-2022-141-4-29-40.
Der volle Inhalt der QuelleCole, Reena, Tara Dalton, Jeff Punch, Mark R. Davies und Ronan Grimes. „Forced Convection Board Level Thermal Design Methodology for Electronic Systems“. Journal of Electronic Packaging 123, Nr. 2 (21.07.2000): 120–26. http://dx.doi.org/10.1115/1.1339822.
Der volle Inhalt der QuelleKim, Ernest M., und Thomas F. Schubert. „A low-cost design experience for junior-level electronics circuits laboratories through emulation of industry-printed circuit board design practice“. International Journal of Electrical Engineering & Education 54, Nr. 3 (03.11.2016): 208–22. http://dx.doi.org/10.1177/0020720916673650.
Der volle Inhalt der QuelleOberloier, Shane, und Joshua Pearce. „Belt-Driven Open Source Circuit Mill Using Low-Cost 3-D Printer Components“. Inventions 3, Nr. 3 (05.09.2018): 64. http://dx.doi.org/10.3390/inventions3030064.
Der volle Inhalt der QuelleHan, Ye, Xiang Dong You, Xu Zhang, Hui Yang Wang und Cong Deng. „A Novel Design of the CNG Dispenser Electronic Control System“. Applied Mechanics and Materials 448-453 (Oktober 2013): 3119–22. http://dx.doi.org/10.4028/www.scientific.net/amm.448-453.3119.
Der volle Inhalt der QuelleYang, Jun, und Jing Liu. „Direct printing and assembly of FM radio at the user end via liquid metal printer“. Circuit World 40, Nr. 4 (28.10.2014): 134–40. http://dx.doi.org/10.1108/cw-07-2014-0029.
Der volle Inhalt der QuelleLi, Hong, und Si Qing Zhang. „Design for Robot Control Board Based on AVR Single Chip Microcomputer“. Applied Mechanics and Materials 484-485 (Januar 2014): 570–73. http://dx.doi.org/10.4028/www.scientific.net/amm.484-485.570.
Der volle Inhalt der QuelleShonhe, Liah, und Balulwami Grand. „Implementation of electronic records management systems“. Records Management Journal 30, Nr. 1 (11.09.2019): 43–62. http://dx.doi.org/10.1108/rmj-03-2019-0013.
Der volle Inhalt der QuelleTaylor, Christine, Budy Notohardjono, Suraush Khambati und Shawn Canfield. „Designing Electronic Card Packages Against Shipping Shock“. Journal of the IEST 64, Nr. 1 (01.12.2021): 42–49. http://dx.doi.org/10.17764/1557-2196-64.1.42.
Der volle Inhalt der QuelleRojas-Molina, Adriana, Gilberto Herrera-Ruiz, Rodrigo Castañeda-Miranda, Antonio Terrazas-Lara, Javier Hissarlik Flores-Chaparro, Benjamín Barón-Rodríguez und Ricardo Chaparro-Sánchez. „Diseño de tarjeta electrónica genérica para el control de motores trifásicos“. Ingeniería, investigación y tecnología 13, Nr. 1 (01.01.2012): 21–31. http://dx.doi.org/10.22201/fi.25940732e.2012.13n1.003.
Der volle Inhalt der QuelleKannan Megalingam, Rajesh, Shree Rajesh Raagul Vadivel, Sreekumar S, Swathi Sekhar, Thejus R Nair und Midhun RR. „Design and Implementation of CNC Milling Bot for Milled Circuit Board Fabrication“. International Journal of Engineering & Technology 7, Nr. 3.12 (20.07.2018): 1205. http://dx.doi.org/10.14419/ijet.v7i3.12.17838.
Der volle Inhalt der QuelleYunardi, Riky Tri, Moh Zakky Zulfiar, Rr Wanda Auruma Putri und Deny Arifianto. „Design and Implementation of Solder Paste Dispenser Based on Linear Drive System“. JEEE-U (Journal of Electrical and Electronic Engineering-UMSIDA) 3, Nr. 2 (13.11.2019): 338. http://dx.doi.org/10.21070/jeee-u.v3i2.2637.
Der volle Inhalt der QuelleCole, Reena, Mark Davies und Jeff Punch. „A Board Level Study of an Array of Ball Grid Components—Aerodynamic and Thermal Measurements“. Journal of Electronic Packaging 125, Nr. 4 (01.12.2003): 480–89. http://dx.doi.org/10.1115/1.1604811.
Der volle Inhalt der QuelleStęplewski, Wojciech, Mateusz Mroczkowski, Radoslav Darakchiev, Konrad Futera und Grażyna Kozioł. „New technologies of multi-layered printed circuit boards, intended of rapid-design electronic modules“. Circuit World 41, Nr. 3 (03.08.2015): 121–24. http://dx.doi.org/10.1108/cw-03-2015-0008.
Der volle Inhalt der QuelleRodgers, Peter, Vale´rie Eveloy und M. S. J. Hashmi. „An Investigation Into the Potential of Low-Reynolds Number Eddy Viscosity Turbulent Flow Models to Predict Electronic Component Operational Temperature“. Journal of Electronic Packaging 127, Nr. 1 (01.03.2005): 67–75. http://dx.doi.org/10.1115/1.1849234.
Der volle Inhalt der QuelleMao, Weiwei, Teng Pang, Xiaoyu Jin, Yang Li und Hongbao Bai. „Overall Scheme Design of Fault Diagnosis for Complex Electronic Systems“. Journal of Physics: Conference Series 2731, Nr. 1 (01.03.2024): 012031. http://dx.doi.org/10.1088/1742-6596/2731/1/012031.
Der volle Inhalt der QuellePennathur, Priyadarshini R., Ann M. Bisantz, Rollin J. Fairbanks, Shawna J. Perry, Frank Zwemer und Robert L. Wears. „Assessing the Impact of Computerization on Work Practice: Information Technology in Emergency Departments“. Proceedings of the Human Factors and Ergonomics Society Annual Meeting 51, Nr. 4 (Oktober 2007): 377–81. http://dx.doi.org/10.1177/154193120705100448.
Der volle Inhalt der QuelleFomin, D. G., N. V. Dudarev, S. N. Darovskikh, M. G. Vakhitov und D. S. Klygach. „Specific Features of Volume-modular Technology Application in the Design of Microwave Electronic Devices“. Ural Radio Engineering Journal 5, Nr. 2 (2021): 91–103. http://dx.doi.org/10.15826/urej.2021.5.2.001.
Der volle Inhalt der QuelleChong, Peng Lean, Silvia Ganesan, Poh Kiat Ng und Feng Yuan Kong. „A TRIZ-Adopted Development of a Compact Experimental Board for the Teaching and Learning of Operational Amplifier with Multiple Circuit Configurations“. Sustainability 14, Nr. 21 (29.10.2022): 14115. http://dx.doi.org/10.3390/su142114115.
Der volle Inhalt der QuellePang, Teng, Weiwei Mao, Hongliang Liu, Yuan Li und Chao Hou. „Design of Fault Diagnosis Method Based on Circuit Frequency Domain Characteristics Fault Dictionary Method“. Journal of Physics: Conference Series 2731, Nr. 1 (01.03.2024): 012009. http://dx.doi.org/10.1088/1742-6596/2731/1/012009.
Der volle Inhalt der QuelleEt al., Andy Wahyu H. „Developing Learning Media Based Project Board in Electronic Materials to Improve the Analysis Capability and Skills for the Cadets of PIP Semarang“. Turkish Journal of Computer and Mathematics Education (TURCOMAT) 12, Nr. 6 (05.04.2021): 2686–94. http://dx.doi.org/10.17762/turcomat.v12i6.5769.
Der volle Inhalt der QuelleEvdulov, O. V., und A. M. Khaibulaev. „Experimental studies of the electronic board cooling system“. Herald of Dagestan State Technical University. Technical Sciences 49, Nr. 1 (19.05.2022): 6–13. http://dx.doi.org/10.21822/2073-6185-2022-49-1-6-13.
Der volle Inhalt der QuelleChung, B. T. F., und H. H. Li. „Forced Convective Cooling Enhancement Through a Double Layer Design“. Journal of Electronic Packaging 117, Nr. 1 (01.03.1995): 69–74. http://dx.doi.org/10.1115/1.2792069.
Der volle Inhalt der QuelleOzerkin, D. V., und V. O. Bondarenko. „Using Microthermostatting to Increase Thermal Stability of On-Board Electronics“. Herald of the Bauman Moscow State Technical University. Series Instrument Engineering, Nr. 3 (132) (September 2020): 18–36. http://dx.doi.org/10.18698/0236-3933-2020-3-18-36.
Der volle Inhalt der QuelleMonier-Vinard, Eric, Najib Laraqi, Cheikh Dia, Minh-Nhat Nguyen und Valentin Bissuel. „Analytical modeling of multi-layered printed circuit board using multi-stacked via clusters as component heat spreader“. Thermal Science 20, Nr. 5 (2016): 1633–47. http://dx.doi.org/10.2298/tsci140403143m.
Der volle Inhalt der QuelleZhang, Xiaoyan, Bo Lan, Yadongyang Zhu und Lugang Zhang. „Application of EDA Technology in Electronic Engineering Design“. Learning & Education 10, Nr. 7 (07.06.2022): 175. http://dx.doi.org/10.18282/l-e.v10i7.2998.
Der volle Inhalt der QuelleZhou, Shuyu. „Design of Novel Optical Fiber Communication Electronic System and Big Data Prediction Method of Its Loss“. Journal of Nanoelectronics and Optoelectronics 16, Nr. 8 (01.08.2021): 1308–16. http://dx.doi.org/10.1166/jno.2021.3082.
Der volle Inhalt der QuelleSandera, Josef. „Connection of electronic and microelectronic modules“. Microelectronics International 31, Nr. 2 (29.04.2014): 86–89. http://dx.doi.org/10.1108/mi-10-2013-0053.
Der volle Inhalt der QuelleR., Prabhu, und Divija T. „Design of Temperature Based Automatic Fan Speed Controller Using Arudino“. International Journal of Innovative Research in Advanced Engineering 10, Nr. 07 (31.07.2023): 537–42. http://dx.doi.org/10.26562/ijirae.2023.v1007.17.
Der volle Inhalt der QuelleLei, Lei, Jia Jing Zhuo, He Chen, Xian Feng Luo und Wei Peng. „Design and Realization of One Circuit Board General Test System Based on USB“. Applied Mechanics and Materials 121-126 (Oktober 2011): 1977–81. http://dx.doi.org/10.4028/www.scientific.net/amm.121-126.1977.
Der volle Inhalt der QuelleHasegawa, Kiyohisa, Yasuki Torigoshi und Daisuke Oshima. „Board Design Environments and Simulation Technologies“. Journal of The Japan Institute of Electronics Packaging 25, Nr. 5 (01.08.2022): 488–98. http://dx.doi.org/10.5104/jiep.25.488.
Der volle Inhalt der QuelleKUBODERA, Tadashi. „Printed Circuit Board Design for EMC“. Journal of Japan Institute of Electronics Packaging 5, Nr. 4 (2002): 405–11. http://dx.doi.org/10.5104/jiep.5.405.
Der volle Inhalt der QuelleSinotin, A. M., O. M. Tsymbal, T. A. Kolesnikova und S. V. Sotnik. „Algorithm for multi-board radio-electronic devices synthesis on maximal accepted overheat“. Radiotekhnika, Nr. 190 (16.10.2017): 89–96. http://dx.doi.org/10.30837/rt.2017.3.190.13.
Der volle Inhalt der QuelleZwal, Yahaya Ibrahim, Madiu Ismail Opeyemi und Ibrahim Muhammad Warji. „Design and Construction of a Modified SMS-Based Electronic Notice Board“. Path of Science 9, Nr. 4 (30.04.2023): 2001–6. http://dx.doi.org/10.22178/pos.91-7.
Der volle Inhalt der QuellePape, Alioune Dia, und Ndiaye Ababacar. „Design of a low-cost electronic board for monitoring photovoltaic systems“. International Journal of Physical Sciences 18, Nr. 1 (31.01.2023): 1–11. http://dx.doi.org/10.5897/ijps2022.4999.
Der volle Inhalt der QuelleBURDUCEA, Sorin, und Miron ZAPCIU. „SIMULATION TECHNOLOGIES USED IN HIGH-SPEED PRINTED CIRCUIT BOARD DESIGN“. ANNALS OF THE ACADEMY OF ROMANIAN SCIENTISTS Series on ENGINEERING SCIENCES 13, Nr. 2 (2021): 46–62. http://dx.doi.org/10.56082/annalsarscieng.2021.2.46.
Der volle Inhalt der QuelleACITO, Bill. „“A Cross-Domain, System Planning Methodology”“. International Symposium on Microelectronics 2018, Nr. 1 (01.10.2018): 000005–12. http://dx.doi.org/10.4071/2380-4505-2018.1.000005.
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