Auswahl der wissenschaftlichen Literatur zum Thema „Electromechanical admittance“
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Zeitschriftenartikel zum Thema "Electromechanical admittance"
Ai, Demi, Chengxing Lin, Hui Luo und Hongping Zhu. „Temperature effect on electromechanical admittance–based concrete structural health monitoring“. Structural Health Monitoring 19, Nr. 3 (09.07.2019): 661–92. http://dx.doi.org/10.1177/1475921719860397.
Der volle Inhalt der QuelleAPARNA, M., M. RAGHAVENDER, G. PRASAD und G. S. KUMAR. „ELECTROMECHANICAL CHARACTERIZATION OF LANTHANUM-DOPED SODIUM BISMUTH TITANATE CERAMICS“. Modern Physics Letters B 20, Nr. 09 (10.04.2006): 475–80. http://dx.doi.org/10.1142/s0217984906010664.
Der volle Inhalt der QuelleXu, Guidong, Baiqiang Xu, Chenguang Xu und Ying Luo. „Temperature effects in the analysis of electromechanical impedance by using spectral element method“. Multidiscipline Modeling in Materials and Structures 12, Nr. 1 (13.06.2016): 119–32. http://dx.doi.org/10.1108/mmms-03-2015-0015.
Der volle Inhalt der QuelleZuo, Chunyuan, Xin Feng und Jing Zhou. „A Three-Dimensional Model of the Effective Electromechanical Impedance for an Embedded PZT Transducer“. Mathematical Problems in Engineering 2013 (2013): 1–10. http://dx.doi.org/10.1155/2013/218026.
Der volle Inhalt der QuelleProvidakis, Costas P. „Repair of Cracked Structures under Dynamic Load Using Electromechanical Admittance Approach“. Key Engineering Materials 348-349 (September 2007): 49–52. http://dx.doi.org/10.4028/www.scientific.net/kem.348-349.49.
Der volle Inhalt der QuelleVIJAYA BHASKAR RAO, P., und T. BHIMA SANKARAM. „ELECTRO MECHANICAL AND IMPEDANCE STUDIES OF (Na1-xKx)1/2Bi1/2TiO3“. International Journal of Modern Physics B 23, Nr. 14 (10.06.2009): 3131–45. http://dx.doi.org/10.1142/s0217979209052443.
Der volle Inhalt der QuelleKarlash, V. „Modeling of the energy-loss piezoceramic resonators by electric equivalent networks with passive elements“. Mathematical Modeling and Computing 1, Nr. 2 (2014): 163–77. http://dx.doi.org/10.23939/mmc2014.02.163.
Der volle Inhalt der QuelleSofuoğlu, Mehmet A., Gökhan Haydarlar, Melih C. Kuşhan, Sezan Orak und Mesut Tekkalmaz. „Investigation of electromechanical impedance and residual stress relation for samples machined by hot ultrasonic-assisted turning“. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 236, Nr. 8 (30.10.2021): 4180–93. http://dx.doi.org/10.1177/09544062211050473.
Der volle Inhalt der QuelleChoi, S.-B., H. S. Kim und J.-S. Park. „New design methodology for piezoelectric shunt structures using admittance analysis“. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 222, Nr. 2 (01.02.2008): 131–45. http://dx.doi.org/10.1243/09544062jmes591.
Der volle Inhalt der QuelleZhang, Chenxu. „Pavement damage monitoring using electromechanical impedance of embedded piezoelectric plate“. Applied and Computational Engineering 25, Nr. 5 (30.11.2023): 30–42. http://dx.doi.org/10.54254/2755-2721/25/ojs/20230729.
Der volle Inhalt der QuelleDissertationen zum Thema "Electromechanical admittance"
Ding, Wenxiang. „Structural health monitoring of piezoelectric ultrasonic transducers“. Electronic Thesis or Diss., Bourges, INSA Centre Val de Loire, 2021. http://www.theses.fr/2021ISAB0008.
Der volle Inhalt der QuelleUltrasonic transducers have been widely used in medical diagnostic, therapy, non-destructive evaluation, cleaning, underwater sonar, and other applications. The proper functioning of the transducer itself is a key factor in the reliability of the entire system. However, due to the misuse of operators or material degradation, defects may occur, such as breakages in cables, cracks, damaged or weakened crystals, and delamination between layers. This contribution focuses on a detail analysis of the influence of bonding delamination on the performance of the transducer, aiming to determine procedures to facilitate the monitoring of the behavior of the transducer during its lifetime and the detection of degradations before they significantly affect the performance of the system.In the frame of this work, an original two-dimensional analytical model for coupled vibrations of finite piezoelectric resonators is proposed. General solutions for all the physical quantities in Cartesian and cylindrical coordinate systems are deduced from the governing equations. They are expressed as a series of trigonometric or Bessel functions. Electrical impedance, mode shape, and frequency spectrum of piezoceramics are calculated by the proposed analytical method as well as by the finite element method. Comparison of the results of these two methods shows an excellent agreement.A systematic investigation of the influence of different kinds of bonding delamination on the performance of single-element and linear array ultrasonic transducers is presented. Finite element models are developed to show the impact of bonding delamination as well as other factors on the electromechanical admittance (EMA) of ultrasonic transducers, which are composed of a piezoceramic disk or parallelepiped, a backing, and a matching layer. Experimental studies are set up to validate the models and quantitative indicators are proposed. 3D printed backings and matching layers are mounted on piezoceramic elements to obtain an intact model transducer and delaminated ones. Comparison between numerical and experimental results show a good agreement, which allows to affirm that changes in EMA can reveal the occurrence and extent of a delamination in an ultrasound probe
Buchteile zum Thema "Electromechanical admittance"
Providakis, C. P. „Repair of Cracked Structures under Dynamic Load Using Electromechanical Admittance Approach“. In Advances in Fracture and Damage Mechanics VI, 49–52. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-448-0.49.
Der volle Inhalt der QuelleKonferenzberichte zum Thema "Electromechanical admittance"
Otitoju, Shola, Hanz Richter und Antonie J. van den Bogert. „Admittance control for an electromechanical rowing machine“. In 2016 IEEE International Conference on Advanced Intelligent Mechatronics (AIM). IEEE, 2016. http://dx.doi.org/10.1109/aim.2016.7576757.
Der volle Inhalt der QuelleZhang, Yang, Kai Zhou und Jiong Tang. „Memetic Optimizer for Structural Damage Identification Using Electromechanical Admittance“. In ASME 2022 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. American Society of Mechanical Engineers, 2022. http://dx.doi.org/10.1115/detc2022-91039.
Der volle Inhalt der QuelleChen, Yuntong, und Siyi Lu. „Study of six-degree-of-freedom wave characteristics simulator based on admittance control“. In Fourth International Conference on Artificial Intelligence and Electromechanical Automation (AIEA 2023), herausgegeben von Fushuan Wen, chuanjun Zhao und Yanjiao Chen. SPIE, 2023. http://dx.doi.org/10.1117/12.2684879.
Der volle Inhalt der QuelleZhao, Liuxian, Lingyu Yu, Mattieu Gresil, Michael Sutton und Siming Guo. „Electromechanical Impedance Modeling for Structural Health Monitoring“. In ASME 2012 Conference on Smart Materials, Adaptive Structures and Intelligent Systems. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/smasis2012-8094.
Der volle Inhalt der QuelleCoorpender, Steven J., Daniel Finkel, Jennifer Kyzar, Robert Sims, Alexandra B. Smirnova, Mohamed Tawhid, Chad E. Bouton und Ralph C. Smith. „Modeling and Optimization Issues Concerning a Circular Piezoelectric Actuator Design“. In ASME 1999 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1999. http://dx.doi.org/10.1115/imece1999-0544.
Der volle Inhalt der QuelleZhang, Boying, Hamad Hameed, Yuxin Xu, Chonglin Zhang und Yong Bai. „Electromechanical Impedance Method for Damage Detection of Typical Joint on Jacket Platform“. In ASME 2018 37th International Conference on Ocean, Offshore and Arctic Engineering. American Society of Mechanical Engineers, 2018. http://dx.doi.org/10.1115/omae2018-77385.
Der volle Inhalt der QuelleDai, Zishu, Yongchang Cai, Yiying Han und Jiao Tian. „Influence of Parameter Variation on Electromechanical Admittance Spectrum of a Multiple Degree of Freedom System“. In 2015 International Conference on Mechatronics, Electronic, Industrial and Control Engineering. Paris, France: Atlantis Press, 2015. http://dx.doi.org/10.2991/meic-15.2015.354.
Der volle Inhalt der QuelleMaheshwari, Muneesh, Venu Gopal Madhav Annamdas, John H. L. Pang, Swee Chuan Tjin und Anand Asundi. „Fibre optic sensors for load-displacement measurements and comparisons to piezo sensor based electromechanical admittance signatures“. In SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, herausgegeben von Peter J. Shull. SPIE, 2015. http://dx.doi.org/10.1117/12.2084039.
Der volle Inhalt der QuelleShahab, Shima, und Alper Erturk. „Underwater Dynamic Actuation of Macro-Fiber Composite Flaps With Different Aspect Ratios: Electrohydroelastic Modeling, Testing, and Characterization“. In ASME 2014 Conference on Smart Materials, Adaptive Structures and Intelligent Systems. American Society of Mechanical Engineers, 2014. http://dx.doi.org/10.1115/smasis2014-7538.
Der volle Inhalt der QuelleGiurgiutiu, Victor, und Craig A. Rogers. „Modeling of the Electro-Mechanical (E/M) Impedance Response of a Damaged Composite Beam“. In ASME 1999 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1999. http://dx.doi.org/10.1115/imece1999-0525.
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