Dissertationen zum Thema „Durcissement électronique“
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El, Bitar Rony. „VDMOSFETs en commutation : amélioration, durcissement“. Perpignan, 2008. http://www.theses.fr/2008PERP0844.
Der volle Inhalt der QuelleThe aim of this work is to follow the degradation of VDMOSFET power devices under extrem conditions of high voltages and high temperature. The devices are subjected to high electric voltages in order to induce a reverse current that is harmful to the integrated junction. Another method of stress is used; it is the degradation of the oxide layer by high electric field. A particular attention is given to the follow up of the switching characteristics of these devices. In certain cases a gain of speed is observed depending on the nature of defects and their geometrical emplacement. The switching speed is also a function of temperature. The defects created are then characterized by a series of capacitance measurements on gate-source and gate-drain terminals. Curves shifting are observed in both directions depending on the total charge of defects. The finality of this work is to introduce a new method to follow up the degradation of electronic devices by monitoring their switching characteristic
Piccin, Yohan. „Durcissement par conception d'ASIC analogiques“. Thesis, Bordeaux, 2014. http://www.theses.fr/2014BORD0145/document.
Der volle Inhalt der QuelleThe purpose of this thesis work is to investigate circuit design techniques to improve the robustness to Total Ionizing Dose (TID) of analog circuits within electronic systems embedded in space probes, satellites and vehicles. Such circuits often contain bipolartransistor components which are quite sensitive to cumulated radiation dose. However highly integrated CMOS technology has been shown to exhibit better natural TDI hardening.The approach proposed here is a hardening by design using a full CMOS semiconductor technology commercially available from ST Microelectronics calledHCMOS9A. The proposed generic hardening design methods will be seen to be compatibleand applicable to other existing or future process technologies. Furthermore this approach addresses the issue of ever-increasing development cost and access to hardened technologies.The first TID hardening technique proposed is applied to a full-CMOS voltage reference. This technique does not involve p-n junctions nor any particular layout precaution but instead is based on the subtraction of two different threshold voltages which allows the cancellation of TDI effects. While the use of advanced commercial CMOS technologies for specific radiation hardened applications is becoming more common, these technologies suffer from larger inputoffs et voltage drift than their bipolar transistor counterparts, which can impact system performance. The second technique studied is that of auto-zeroing, which is an efficient method to reduce the complex offset voltage drift mechanisms of operational amplifiers due to temperature. The purpose here is to prove that this technique can also cancel input offset voltage drift due to TID.Index term : hardening, cumulated dose, CMOS technology, voltage reference,operational amplifier
Hoffmann, Alain. „Etude de la conduction et du bruit de fond de structures M. O. S. En vue de caractériser le durcissement de leur technologie“. Montpellier 2, 1993. http://www.theses.fr/1993MON20058.
Der volle Inhalt der QuelleMonnier, Thierry. „Durcissement de circuits convertisseurs A/N rapides fonctionnant en environnement spatial“. Montpellier 2, 1999. http://www.theses.fr/1999MON20112.
Der volle Inhalt der QuelleKarlik, Miroslav. „Contribution à l'étude des zones de Guinier-Preston planaires par microscopie électronique à résolution atomique“. Châtenay-Malabry, Ecole centrale de Paris, 1994. http://www.theses.fr/1994ECAP0381.
Der volle Inhalt der QuelleCadinot, Nathalie. „Etude et caractérisation d'adhésifs structuraux durcissables par bombardement électronique“. Montpellier 2, 1992. http://www.theses.fr/1992MON20252.
Der volle Inhalt der QuelleDuchaussoy, Amandine. „Déformation intense d'alliages d'aluminium à durcissement structural : mécanismes de précipitation et comportement mécanique“. Thesis, Normandie, 2019. http://www.theses.fr/2019NORMR135.
Der volle Inhalt der QuelleThe combination of two mechanisms to increase mechanical strength, namely precipitation and grain size reduction, has been explored in this thesis in the aim of increasing the properties of age hardenable aluminum alloy from the 7### series.Manufacturing by severe plastic deformation makes it possible to obtain nanostructured alloys with high density of grain boundaries, which allows increasing the yield strength according to the Hall-Petch law. However, the high density of defects (dislocations, vacancies, grain boundaries ...) and the internal stresses generated by this deformation results in inherently unstable nanostructures when precipitation heat treatment is performed. These nanostructures experience rapid grain growth and drastic changes in precipitation mechanisms (heterogeneous precipitation, accelerated kinetics).In this work we have studied nanostructures obtained by severe plastic deformation using HPT and HPS (High pressure torsion / sliding) on a model alloy, Al-2% Fe and a commercial alloy AA7449 enriched with iron. The strategy was to stabilize the ultra-fine grain structure by intermetallic iron-rich nanoparticles (Zener pinning) to allow homogeneous precipitation hardening and thus combine the two mechanisms to increase the yield strength. In this context, we have particularly investigated: 1) the influence of solutes on the physical mechanisms leading to dynamic recrystallization nanostructuring; 2) specific mechanisms involved in co-deforming phases with very different mechanical behaviors; 3) the phase transformations that may lead either to the formation of a supersaturated solid solution or, on the contrary, to the decomposition of a solid solution by deformation-induced precipitation; 4) the relationship between the nanostructures thus generated, their thermal stability and related mechanical properties.The observation of the microstructures and understanding of the mechanisms induced by the deformation and relations with the mechanical behavior has been undertaken with many techniques: scanning and transmission electron microscopy (SEM/TEM), ASTAR (orientation mapping by TEM), and atom probe tomography. The study of precipitation was carried out by DSC (differential scanning calorimetry), SAXS (small angle X-ray scattering) and in-situ TEM. Finally, the relationship with the mechanical behavior has been established on the basis of tensile tests and micro-hardness measurements
Nascimento, Pagliarini Samuel. „Méthodes d'analyse et techniques d'amélioration de fiabilité pour les circuits numériques“. Thesis, Paris, ENST, 2013. http://www.theses.fr/2013ENST0060/document.
Der volle Inhalt der QuelleWith the current advances achieved in the manufacturing process of integrated circuits, a series of reliability-threatening mechanisms have emerged or have become more prominent. For instance, physical defects originating from poorly lithographed wires, vias and other low-level devices are commonly seen in nanometric circuits. On the other hand, circuits have also become more sensitive to the strikes of highly energized particles. Both mechanisms, although essentially different, can cause multiple faults that contribute for lower reliabilities in integrated circuits. Multiple faults are more troubling than single faults since these are more severe and also because they can overcome fault tolerance techniques. Digital circuits are used in most electronic systems nowadays, but there is a specific context in which they are required to be reliable. Such context comprises high-dependability applications. This is the scenario in which this thesis is conceived. It’s goals are twofold : (a) to pro pose methods to assess the reliability of digital circuits, and (b) to propose techniques for reliability improvement. Concerning the first goal, several methods have been proposed in the literature and the text shows how these methods present limitations with respect to circuit size (number of gates), circuit type (sequential or combinational) and fault profile (single versus multiple faults). This thesis proposes two methods for reliability assessment. The first method is termed SPR+ and its targeted at the analysis of combinational logic only. SPR+ improves the average analysis accuracy by taking into account the effect of each fanout reconvergent node to the overall circuit reliability. Another method, termed SNaP, is also proposed in this thesis. It is a hybrid approach since it is partially based on simulation. SNaP can be used for combinational and sequential logic and can also be emulated in an FPGA device for faster analysis. Both SPR+ and SNaP can cope with multiple faults
Santos, Filipe Vinci dos. „Techniques de conception pour le durcissement des circuits intégrés face aux rayonnements“. Grenoble 1, 1998. http://www.theses.fr/1998GRE10208.
Der volle Inhalt der QuelleNascimento, Pagliarini Samuel. „Méthodes d'analyse et techniques d'amélioration de fiabilité pour les circuits numériques“. Electronic Thesis or Diss., Paris, ENST, 2013. http://www.theses.fr/2013ENST0060.
Der volle Inhalt der QuelleWith the current advances achieved in the manufacturing process of integrated circuits, a series of reliability-threatening mechanisms have emerged or have become more prominent. For instance, physical defects originating from poorly lithographed wires, vias and other low-level devices are commonly seen in nanometric circuits. On the other hand, circuits have also become more sensitive to the strikes of highly energized particles. Both mechanisms, although essentially different, can cause multiple faults that contribute for lower reliabilities in integrated circuits. Multiple faults are more troubling than single faults since these are more severe and also because they can overcome fault tolerance techniques. Digital circuits are used in most electronic systems nowadays, but there is a specific context in which they are required to be reliable. Such context comprises high-dependability applications. This is the scenario in which this thesis is conceived. It’s goals are twofold : (a) to pro pose methods to assess the reliability of digital circuits, and (b) to propose techniques for reliability improvement. Concerning the first goal, several methods have been proposed in the literature and the text shows how these methods present limitations with respect to circuit size (number of gates), circuit type (sequential or combinational) and fault profile (single versus multiple faults). This thesis proposes two methods for reliability assessment. The first method is termed SPR+ and its targeted at the analysis of combinational logic only. SPR+ improves the average analysis accuracy by taking into account the effect of each fanout reconvergent node to the overall circuit reliability. Another method, termed SNaP, is also proposed in this thesis. It is a hybrid approach since it is partially based on simulation. SNaP can be used for combinational and sequential logic and can also be emulated in an FPGA device for faster analysis. Both SPR+ and SNaP can cope with multiple faults
Le, Fournier Marion. „Étude d'un alliage d'aluminium pour l'aéronautique par les techniques avancées de microscopie électronique en transmission“. Toulouse 3, 2012. http://thesesups.ups-tlse.fr/1836/.
Der volle Inhalt der QuelleIn aeronautics, structural hardening is one of the best ways to improve mechanical properties of metal alloys and to make the structures lighter. The structural hardening of the Al-Li-Cu alloys of the 2000 series is due to T1 precipitates (Al2CuLi) which modify locally the matrix which surround them. To understand the mechanism of deformation at a micro scale, we need to know the interactions between dislocations and hardening phases. Consequently, a precise characterization of strains is required. To do that, experimental techniques, which are supported by models, have been developed. Using high resolution electronic transmission microscopy (HREM) and geometrical phase analysis (GPA), a method is proposed to measure strains in three directions of the space. Then, the precipitates were modeled by two dissociated dislocations which are perfectly identified as a/6<112>. The growth mechanism of T1 phases is based on the presence of these dislocations. Other models have been developed to reproduce the strains created in the matrix by the precipitate. They are based on the dislocation theory and the resolution of the equations of micromechanics in the reciprocal space using isotropic and linear elasticity. By employing those models, we are able to propose a description of the strains near the tips of precipitates which is in agreement with the HREM observations
Glorieux, Maximilien. „Durcissement par conception (RHBD) et modélisation des évènements singuliers dans les circuits intégrés numériques en technologies Bulk 65 nm et FDSOI 28 nm“. Thesis, Aix-Marseille, 2014. http://www.theses.fr/2014AIXM4725.
Der volle Inhalt der QuelleThe extreme technology scaling of digital circuits leads to increase their sensitivity to ionizing radiation, whether in spatial or terrestrial environments. Natural radiation can now induce single event effects in deca-nanometer circuits and impact their reliability.This thesis focuses on the modeling of single event mechanisms and the development of hardening by design solutions that mitigate radiation threat on the circuit error rate.In a first part of this work, we have developed a physical model for both the transport and collection of radiation-induced charges in a biased circuit, derived from pure physics-based equations without any fitting parameter. This model is called Random-Walk Drift-Diffusion (RWDD). This particle-level model and its numerical transient solving allows the coupling of the charge collection process with a circuit simulator, taking into account the time variations of the electrical fields in the structure. The RWDD model is able to simulate the behavior of a circuit following a radiation impact, independently of the implemented function and the considered technology.In a second part of our work, hardening solutions that limit radiation impacts on circuit reliability have been developed. At elementary cell level, new radiation-hardened latch architectures have been proposed, with a limited impact on performances. At system level, a clock tree duplication methodology has been proposed, leaning on specific latches. Finally, a triplication flow has been design for critical applications. All these solutions have been implemented in 65 nm and UTBB-FDSOI 28nm technologies and radiation test have been performed to measure their hardening efficiency
Bardel, Didier. „Rôle de la microstructure d'un alliage à durcissement structural sur son comportement et sa tenue mécanique sous sollicitations cycliques après un transitoire thermique“. Thesis, Lyon, INSA, 2014. http://www.theses.fr/2014ISAL0045/document.
Der volle Inhalt der QuelleIn order to assemble the pressure vessel of experimental Reactor Jules Horowitz (RJH) of France in the future, the electron beam welding process will be used. Several ferrules in a 6061-T6 age hardening aluminum alloy are used for manufacturing this vessel. The fine precipitation state (T6) is affected significantly by the electron beam welding process. Consequently, this microstructural degradation leads to an evolution of the mechanical behaviour and thus will affect the distribution of residual stresses. Moreover, the mechanical properties of the weld joint at ambiant temperature can be modified, such as the yield stress that may drop from 280 MPa to 55 MPa. In this work, cyclic tensile tests have been performed after anisothermal histories representative of welding and during isothermal treatments. The analysis of these results is compared with Small Angles Neutrons Scattering (SANS) and Transmission Electron Microscopy (TEM) characterizations that allow to understand the effect of the precipitation on the material behaviour. To predict the microstructural evolutions in the 6061 structure, a precipitation model has been developped. The precipitation software "PreciSo" coupled with a Finite Element thermal simulations and elastoplastic models allows to open new prospectives in the physical-based simulations domain
Zerarka, Moustafa. „Étude des régimes extrêmes de fonctionnement en environnement radiatif des composants de puissance en vue de leur durcissement pour les applications aéronautiques et spatiales“. Phd thesis, Toulouse 3, 2013. http://thesesups.ups-tlse.fr/2149/.
Der volle Inhalt der QuelleThis work deals with the reliability of electronic components such as power MOSFETs and IGBTs affected by Radiative Natural Environment. Nowadays, this problem is considered to be part of the component reliability. While it concerned initially with components which work in severe radiation environment for aerospace, the evolution and complexity of embedded electronics that can interact with this environment which have potentially damaging effects lead us to take these radiative constraints into account as the case of heavy ion. From this scope this work was conducted. Simulations were carried out with Synopsys TCAD simulator in order to give a better understanding of the failure mechanisms such as the Single Event Burnout (SEB) or Single Event Latchup and to define the criteria of triggering, the behavior and the sensitivity of different structure (VDMOS, SJ-MOSFET, IGBT planar and IGBT trench). This study allows us to propose and evaluate hardening solutions in design against the triggering phenomena related to the parasites structures
Balan, Alexandre. „Modélisation isotherme et anisotherme de la limite d'élasticité précipitation-dépendante de l'Inconel 718“. Thesis, Lyon, 2017. http://www.theses.fr/2017LYSEI003/document.
Der volle Inhalt der QuelleThis thesis manuscript presents the results of work concerning the effects of thermal transients on the precipitation of intermetallic phases in the nickel-based superalloy Inconel 718® and the consequences of this precipitation on the mechanical properties of this alloy. This work focuses on a coupled approach capable of describing the evolution of the precipitation of the γ'' phase and its consequences on the yield strength of the Inconel 718®. The precipitation state is modeled thanks to the implementation of the equations of the classical germination and growth theory, modified to take into account the platelet geometry of the γ'' precipitates. This precipitation model is then validated by experimental data from the literature but also from transmission electron microscope observations and small angle neutron scattering tests. The size distribution of the γ'' phase thus simulated is used as the input data of a model for predicting the precipitation-dependent elasticity limit. These simulated elasticity limits are finally compared with experimental results from tensile tests. A welding model was then made to test the elastic yield prediction model for thermal transients in an industrial case
Zerarka, Moustafa. „Étude des régimes extrêmes de fonctionnement en environnement radiatif des composants de puissance en vue de leur durcissement pour les applications aéronautiques et spatiales“. Phd thesis, Université Paul Sabatier - Toulouse III, 2013. http://tel.archives-ouvertes.fr/tel-00874051.
Der volle Inhalt der QuelleDelmas, François. „Influence des traitements thermiques sur les propriétés mécaniques d'un alliage AIMgSiCu“. Toulouse 3, 2002. http://www.theses.fr/2002TOU30141.
Der volle Inhalt der QuelleNasedkina, Yana. „Etude des transformations de phase dans des alliages Al-Cu et Al-Mg-Si nanostructurés par déformation intense“. Rouen, 2015. http://www.theses.fr/2015ROUES023.
Der volle Inhalt der QuelleAl alloys are widely used for structural application in aerospace, automotive and constructive engineering due to their low density and high strength and for functional application in electrical engineering due to a relatively high electrical conductivity. Precipitation hardening and grain size strengthening are among the main strengthening mechanisms of heat-treatable Al alloys. The precipitation hardening is achieved by artificial aging (AA) and the grain size strengthening could be achieved by several methods, including severe plastic deformation (SPD). The combination of these strengthening effects allows significant improvement of strength of Al alloys. In order to combine these effects, i. E. To design an ultrafine grain structure with nanoscaled precipitates, it is possible to use three different routes: SPD followed by AA; AA followed by SPD or SPD at temperatures of AA. However in practice it turns out to be sometime complex, because of phase transformations induced by SPD in Al alloys. The mechanisms of such phase transformations are still poorly understood. Therefore, the control of microstructure and as a consequence the control of properties becomes very difficult. Therefore, in this work, the first step was to determine the microstructure changes occurring in Al alloys under SPD and to understand the underlying mechanisms of microstructure evolution. In a second step we have also quantified the relationship between structure and mechanical and electrical properties. To reach these goals, model Al-Cu and industrial Al-Mg-Si alloys were studied using Transmission Electron Microscopy (TEM), Atom Probe Tomography (APT), microhardness measurements and electrical conductivity measurements. Alloys were subjected to SPD by high pressure torsion (HPT) under different processing conditions to reveal the influence on microstructure and properties. It is shown that HPT at ambient temperature leads to the decomposition of solid solutions for both Al alloys and dynamic precipitation at grain boundaries only for Al-Cu alloy. The solute drag by grain boundaries motion was identified as the main mechanism supporting the decomposition of solid solutions. The precipitation in the Al-Cu alloy occurs due to an increase of Cu concentration at GBs and a high Cu GB diffusivity. Besides, the optimum thermomechanical treatment, combining HPT and post-deformation heat treatment was also determined in order to optimize the combination of high strength and electrical conductivity
Stephan, Baptiste. „Etude cinétique et microstructurale de la transformation ordre-désordre dans les alliages Ni2Cr à faible teneur en fer“. Thesis, Lille 1, 2018. http://www.theses.fr/2018LIL1R004/document.
Der volle Inhalt der QuelleChemical ordering in Ni-Cr alloys modifies their mechanical properties and is a potential issue for their use in pressurized water reactors. In this work, ordering kinetics have been determined by accelerated ageing on model alloys with low iron content. The Ni2Cr ordered phase appearance induces a hardness increase. Furthermore, thermoelectric power measurements have been revealed very sensitive to ordering. The iron content does not affect ordering kinetics at low temperatures (<450 °C), contrary to thermal treatments practiced on the alloys. Our results have been extrapolated to the industrial case, where the iron content is higher: ordering incubation time is estimated at 140 years at 325 °C. The nanometric size of ordered domains together with their small difference in chemical composition with the disordered matrix make their study difficult. We used advance characterizations with transmission electron microscopy to progress in their description. Thanks to the coupling of image analysis with orientation mappings, the surface proportion of ordered domains has been estimated on a control sample. Energy loss chemical maps reveal that the iron is partly segregated around ordered domains. This questions the state of order of the Ni2Cr phase, which is corroborated by quantitative microdiffractions achieved on ordered domains. At the atomic scale, analyzes show that iron substitutes preferentially for chromium in the ordered phase
Ben, Dhia Arwa. „Durcissement de circuits logiques reconfigurables“. Electronic Thesis or Diss., Paris, ENST, 2014. http://www.theses.fr/2014ENST0068.
Der volle Inhalt der QuelleAs feature sizes scale down to nano-design level, electronic devices have become smaller, more performant, less power-onsuming, but also less reliable. Indeed, reliability has arisen as a serious challenge in nowadays’ microelectronics industry and as an important design criterion, along with area, performance and power consumption. For instance, physical defects due to imperfections in the manufacturing process have been observed more frequently, impacting the yield. Besides, nanometric circuits have become more vulnerable during their lifetime to ionizing radiation which causes transient faults. Both manufacturing defects and transient faults contribute to decreasing reliability of integrated circuits. When moving to a new technology node, Field Programmable Gate Arrays (FPGAs) are the first coming into the market, thanks to their low development and Non-Recurring Engineering (NRE) costs and their flexibility to be used for any application. FPGAs have especially attractive characteristics for space and avionic applications, where reconfigurability, high performance and low-power consumption can be fruitfully used to develop innovative systems. However, missions take place in a harsh environment, rich in radiation, which can induce soft errors within electronic devices. This shows the importance of FPGA reliability as a design criterion in safety and critical applications. Most of commercial FPGAs have a mesh architecture and their logic blocks are gathered into clusters. Therefore, this thesis deals with the fault tolerance of basic blocks (clusters and switch boxes) in a mesh of clusters FPGA. These blocks are mainly made up of multiplexers. In order to improve their reliability, it is imperative to be able to assess it first, then select the proper hardening approach according to the available budget. So, this is the main outline in which this thesis is conceived. Its goals are twofold: (a) analyze the fault tolerance of the basic blocks in a mesh of clusters FPGA, and point out the most vulnerable components (b) propose hardening schemes at different granularity levels, depending on the hardening budget. As far as the first goal is concerned, a methodology to evaluate the reliability of the cluster is proposed. This methodology uses an existent analytical method for reliability computation of combinational circuits. The same method is employed to identify the worthiest components to be hardened. Regarding the second goal, hardening techniques are proposed at both multiplexer and transistor levels. At multiplexer level, two hardening solutions are presented. The first solution resorts to spacial redundancy and concerns the logic block structure. A novel Configurable Logic Block (CLB) architecture baptized Butterfly is introduced. It is compared with other hardened CLB architectures in terms of reliability and cost penalties. The second hardening solution is a redundanceless scheme. It is based on a “smart” synthesis that consists in seeking the most reliable design in a given founder library, instead of directly using a redundant solution. Then, at transistor level, new single-ended and dual-rail multiplexer architectures are proposed. They are compared to different other transistor structures, according to suitable design metrics
Damerval, Claire. „Contributions à l'étude du comportement mécanique des composites cotac γ /γ'-NbC à moyenne et haute température“. Paris 11, 1986. http://www.theses.fr/1986PA112034.
Der volle Inhalt der QuelleZhong, Sheng-Yi. „Étude des évolutions microstructurales à haute température en fonction des teneurs initiales en Y, Ti et O et, de leur incidence sur les hétérogénéités de déformation dans les aciers ODS Fe-14Cr1W“. Phd thesis, Université Paris Sud - Paris XI, 2012. http://tel.archives-ouvertes.fr/tel-00737497.
Der volle Inhalt der QuelleBen, Dhia Arwa. „Durcissement de circuits logiques reconfigurables“. Thesis, Paris, ENST, 2014. http://www.theses.fr/2014ENST0068/document.
Der volle Inhalt der QuelleAs feature sizes scale down to nano-design level, electronic devices have become smaller, more performant, less power-onsuming, but also less reliable. Indeed, reliability has arisen as a serious challenge in nowadays’ microelectronics industry and as an important design criterion, along with area, performance and power consumption. For instance, physical defects due to imperfections in the manufacturing process have been observed more frequently, impacting the yield. Besides, nanometric circuits have become more vulnerable during their lifetime to ionizing radiation which causes transient faults. Both manufacturing defects and transient faults contribute to decreasing reliability of integrated circuits. When moving to a new technology node, Field Programmable Gate Arrays (FPGAs) are the first coming into the market, thanks to their low development and Non-Recurring Engineering (NRE) costs and their flexibility to be used for any application. FPGAs have especially attractive characteristics for space and avionic applications, where reconfigurability, high performance and low-power consumption can be fruitfully used to develop innovative systems. However, missions take place in a harsh environment, rich in radiation, which can induce soft errors within electronic devices. This shows the importance of FPGA reliability as a design criterion in safety and critical applications. Most of commercial FPGAs have a mesh architecture and their logic blocks are gathered into clusters. Therefore, this thesis deals with the fault tolerance of basic blocks (clusters and switch boxes) in a mesh of clusters FPGA. These blocks are mainly made up of multiplexers. In order to improve their reliability, it is imperative to be able to assess it first, then select the proper hardening approach according to the available budget. So, this is the main outline in which this thesis is conceived. Its goals are twofold: (a) analyze the fault tolerance of the basic blocks in a mesh of clusters FPGA, and point out the most vulnerable components (b) propose hardening schemes at different granularity levels, depending on the hardening budget. As far as the first goal is concerned, a methodology to evaluate the reliability of the cluster is proposed. This methodology uses an existent analytical method for reliability computation of combinational circuits. The same method is employed to identify the worthiest components to be hardened. Regarding the second goal, hardening techniques are proposed at both multiplexer and transistor levels. At multiplexer level, two hardening solutions are presented. The first solution resorts to spacial redundancy and concerns the logic block structure. A novel Configurable Logic Block (CLB) architecture baptized Butterfly is introduced. It is compared with other hardened CLB architectures in terms of reliability and cost penalties. The second hardening solution is a redundanceless scheme. It is based on a “smart” synthesis that consists in seeking the most reliable design in a given founder library, instead of directly using a redundant solution. Then, at transistor level, new single-ended and dual-rail multiplexer architectures are proposed. They are compared to different other transistor structures, according to suitable design metrics
Lescoat, Marie-Laure. „Etude du comportement des nano-renforts des matériaux ODS (Oxide Dispersion Strengthened) sous irradiation : Approche analytique par des irradiations aux ions“. Thesis, Lille 1, 2012. http://www.theses.fr/2012LIL10167/document.
Der volle Inhalt der QuelleOxide Dispersion Strengthened (ODS) Ferritic-Martensitic (FM) alloys are expected to play an important role as cladding material in Generation IV sodium fast reactors operating in extreme temperature (400-500°C) and irradiation conditions (up to 200 dpa). Since nano-oxides give ODS steels their high-temperature strength, the stability of these particles is an important issue. The present study evaluate the radiation response of nano-oxides by the use of in-situ and ex-situ ion irradiations performed on both Fe18Cr1W0,4Ti +0,3 Y2O3 and Fe18Cr1W0,4Ti + 0.3 MgO ODS steels. In particular, the results showed that Y-Ti-O nano-oxides are quite stable under very high dose irradiation, namely 237 dpa at 500°C and, that the oxide interfacial structures are likely playing an important role on the behavior under irradiation (oxide stability and point defect recombination)
Salager, Laurent. „Conception en vue du durcissement des circuits intégrés numériques aux effets radiatifs“. Montpellier 2, 1999. http://www.theses.fr/1999MON20030.
Der volle Inhalt der QuelleDelbove, Maxime. „Fatigue et corrosion d’alliages de cuivre pour applications ferroviaires“. Thesis, Lille 1, 2017. http://www.theses.fr/2017LIL10009/document.
Der volle Inhalt der QuelleEmployed for their good balance between mechanical, thermal and electrical properties, precipitation hardened Cu-Ni-Si alloys are used for various purposes, including railway maintenance. In the latter case, they are submitted to train traffic and environmental effects. This is why the low cycle fatigue (LCF), the wet corrosion and the fatigue-corrosion behaviours of a CuNi2Si alloy have been studied. The aim of the present work is to relate the macroscopic properties to the microstructural behaviour. The fatigue life of the alloy is composed of an initial hardening step, followed by a continuous softening until fracture. Thanks to the combination of transmission and scanning electron microscopies (respectively TEM and SEM), including ECCI (Electron Channeling Contrast Imaging) in addition to EBSD (Electron BackScattered Diffraction), the formation of dislocation cells has been identified, which ones are then consumed by the formation of precipitate free bands after the mechanical dissolution of the δ-Ni2Si precipitates. This sequence describes the cyclic strain accommodation mechanism. The progress in the formation of these bands explains the different regimes observed into the Manson-Coffin diagram. The alloy exhibits intergranular corrosion in 50 g.L-1 NaCl solution. The electrochemical impedance spectroscopy (EIS) indicates the formation of a compact passive film at the surface of the alloy. Finally, the alloy seems to be sensible to fatigue-corrosion, especially at high strain range where the number of cycle to failure is reduced by a third. Moreover, a fracture surface similar to a stress corrosion cracking surface is also observed
Meyruey, Gwenaëlle. „Caractérisation et modélisation du vieillissement thermique d’un composite à base d’alliage d’Aluminium“. Thesis, Lyon, 2018. http://www.theses.fr/2018LYSEI092.
Der volle Inhalt der QuellePrecipitation-strengthened alloys as Al-Mg-Si alloys reinforced with ceramic particles are an appropriate alternative for industrial applications. The precipitation sequence in Al-Mg-Si alloys is particularly complex when Silicon is in excess with respect to the Mg2Si composition and it is expected to be modified by the presence of the ceramic reinforcement. This is why, for industrial applications, under certain use conditions, it is fundamental to be able to predict the evolution of the microstructure in the alloy and the consequences on mechanical properties. The present work is devoted to the study of an age-hardenable Al-Mg-Si aluminium alloy which, can be facing temperatures between 100°C and 350°C in use conditions. This material is characterized by a complex precipitation sequence due to Silicon-excess and ceramic particles. The main objectives of the work are the following: 1) To describe how the microstructure evolves in the Al-Mg-Si alloy with silicon excess studied, with or without reinforcement, during a long storage period at a temperature between 100°C and 350°C. Then, it appeared necessary to describe the evolution of the mechanical properties in the same conditions but starting from a T6 state (corresponding to peak aged conditions). 2) To predict these evolutions (microstructure and strength) using an appropriate model. It was highlighted that the high silicon excess in the studied alloy leads to a simultaneous precipitation of several semi-coherent phases. Their precipitation has been predicted thanks to a KWN-type model based on classical nucleation-growth theories, validated by the experiments, and implemented considering: 1) the competitive precipitation between coherent et semi-coherent phases, 2) the rod-shape morphology of precipitates with a variable aspect ratio. This model has been used for the prediction of the Time-Temperature-Transformation diagram of the alloys and its composite considering the acceleration of the precipitation kinetics observed and attributed to the high dislocation density resulting from the presence of ceramic particles. Finally, 2 methods for the mechanical properties prediction have been compared: 1) a JMAK-type empirical approach 2) a physically based approach. The JMAK approach allowed us a quicker and easier prediction of the loss of hardness from the T6 state, for alloy and composite, during isothermal and non-isothermal treatment. Despite a prediction close to the experimental results, this approach cannot give us information about the physical mechanisms responsible for the observed mechanical variations. Then, a physically based approach taking into account the predictions of the precipitation model was used for the yield stress estimation during aging with a micromechanical model. This approach gave encouraging results and could be a powerful tool for the prediction of the strength during industrial use conditions
Hoche, François-Xavier. „Vers une prise en compte du vieillissement thermique dans la filière de dimensionnement des structures pour la fatigue thermomécanique“. Thesis, Paris Sciences et Lettres (ComUE), 2016. http://www.theses.fr/2016PSLEM051.
Der volle Inhalt der QuelleCylinder heads of automotive engines are produced by casting of precipitation strengthened Al-Si alloys.The cylinder head quickly reaches a steady state temperature but the succession of starts and stops generates thermomechanical fatigue in the area between the valve seats. At service temperature, the precipitation microstructures evolve from their state after precipitation hardening heat treatment to an aged state, which results in the reduction of their mechanical properties. The increase of thermomechanical stresses in new engines requires taking thermal aging into account for sizing. To that end, the precipitation microstructures (precipitates crystal structures, composition, morphology, and distribution) have been analyzed by Transmission Electron Microscopy (TEM) for various aging conditions and the corresponding cyclic least-viscoplastic behavior has been determined. The effect of plastic deformation on the kinetics of precipitate growth has been studied throughout loadings representative of engine operation. The morphological characteristics of the precipitation microstructure resulting from the thermomechanical aging were determined by TEM for different numbers of cycles and compared with those resulting from the mere thermal aging in order to assess the effect of plastic deformation on the kinetics of precipitate growth. As micro hardness is a good indicator of the aging of precipitation strengthened aluminium alloys, micro hardness evolution models have been developed to calculate its decrease in the cylinder head during a test simulating in service conditions. The simulations give us a better understanding of the in-service aging of these alloys
Delacour, Pascal. „Etude en microscopie analytique par transmission d'alliages renforcés par oxydation interne et de martensites du système Cu-Al. Importance du coherent bremsstrahlung dans la microanalyse X de ces alliages“. Rouen, 1994. http://www.theses.fr/1994ROUES073.
Der volle Inhalt der QuelleLorfèvre, Eric. „Défaillances induites par les rayonnements ionisants dans les composants de puissance IGBT et VIP : Solutions de durcissement“. Montpellier 2, 1998. http://www.theses.fr/1998MON20271.
Der volle Inhalt der QuelleAndrianjohany, Nomena Gabriel. „Méthodologie de prédiction multi-échelle pour l'évaluation et le durcissement des circuits intégrés complexes face aux événements singuliers d'origine radiative“. Electronic Thesis or Diss., Aix-Marseille, 2018. http://www.theses.fr/2018AIXM0099.
Der volle Inhalt der QuelleThe scaling trend of highly integrated circuits makes them more and more sensitive to single event effects (SEE). This sensitivity was observed in widely studied environments (spatial, nuclear) but also in general public applications up to now spared by such effects. It has now become necessary for circuit designers to estimate the sensitivity of their circuit and new technology during the design phase and thus avoid spending efforts on unnecessary circuit manufacturing and testing.This thesis aims to develop a prediction methodology for integrated circuits evaluation and hardening face to the single event effect in order to assess their reliability before manufacturing and therefore, reduce the testing costs. The first step of the study is the analysis of the link between physical model and macroscopic failure in order establish prediction chains. The second step is the implementation of these chains and the validation of the associated models using simple circuits. The final step is the application and the validation of the prediction methods within a real integrated circuit design flow
Chbihi, Abdelahad. „Etude de l'effet d'une déformation plastique préalable sur les transformations de phases dans les alliages modèles : CuCr et FePd“. Phd thesis, Université de Rouen, 2011. http://tel.archives-ouvertes.fr/tel-00648671.
Der volle Inhalt der QuelleChbihi, Abdelahad. „Etude de l'effet d'une déformation plastique préalable sur les transformations de phases dans les alliages modèles : CuCr et FePd“. Phd thesis, Rouen, 2011. http://www.theses.fr/2011ROUED005.
Der volle Inhalt der QuelleThe application of severe plastic deformation on metal alloys usually leads to the reduction of the grain size and the formation of a high density of defects (dislocations, vacancies, grain boundaries, etc. ), pushing systems far from thermodynamic equilibrium. This can affect the stability of microstructures and influence the mechanisms of phase transformations. The aim of this work is to understand the effect of prior plastic deformation on two kinds of phase transformations: precipitation and ordering. For this, two model alloys were chosen: CuCr1 and Fe50Pd50 For the CuCr1, the early stages of the Cr precipitation in Cu were first investigated in the undeformed state. Atom Probe Tomography and Transmission Electron Microscopy clearly show the coexistence of three kinds of Cr rich precipitates. Both their structure and composition were investigated in detail. The precipitation kinetic was modeled on the basis of thermodynamic arguments, taking into account the different energy terms, i. E. Driving force, elastic energy and interfacial energy, which come into competition during the Cr precipitation in Cu. The large deformation (by rolling) of the CuCr1 alloy leads to an acceleration of the precipitation kinetic due to the heterogeneous nucleation of Cr precipitates on dislocations. For the Fe50Pd50 alloy, the effect of plastic deformation by High Pressure Torsion on the ordering mechanism was investigated. Transmission Electron Microscopy observations showed that the ordering process in the ultrafine grained state is associated with the recrystallization. The ordered domains nucleate at grain boundaries and grow at the expense of non-recrystallized grains. It should be noted that, a record coercive field was obtained for this alloy in the nanostructured state
Andrianjohany, Nomena Gabriel. „Méthodologie de prédiction multi-échelle pour l'évaluation et le durcissement des circuits intégrés complexes face aux événements singuliers d'origine radiative“. Thesis, Aix-Marseille, 2018. http://www.theses.fr/2018AIXM0099/document.
Der volle Inhalt der QuelleThe scaling trend of highly integrated circuits makes them more and more sensitive to single event effects (SEE). This sensitivity was observed in widely studied environments (spatial, nuclear) but also in general public applications up to now spared by such effects. It has now become necessary for circuit designers to estimate the sensitivity of their circuit and new technology during the design phase and thus avoid spending efforts on unnecessary circuit manufacturing and testing.This thesis aims to develop a prediction methodology for integrated circuits evaluation and hardening face to the single event effect in order to assess their reliability before manufacturing and therefore, reduce the testing costs. The first step of the study is the analysis of the link between physical model and macroscopic failure in order establish prediction chains. The second step is the implementation of these chains and the validation of the associated models using simple circuits. The final step is the application and the validation of the prediction methods within a real integrated circuit design flow
Durand, Renaud. „Modélisation des effets de dose dans les circuits intégrés en environnement spatial“. Toulouse, ISAE, 2007. http://www.theses.fr/2007ESAE0016.
Der volle Inhalt der QuelleRoume, Chantal. „Synthèse de monomères multiépoxydes et de leurs dérivés acryliques à propriétés thermiques améliorées“. Montpellier 2, 1991. http://www.theses.fr/1991MON20039.
Der volle Inhalt der QuellePepitone, Kévin. „Etude de la production, de la propagation et de la focalisation d'un faisceau d'électrons impulsionnel intense“. Thesis, Bordeaux, 2014. http://www.theses.fr/2014BORD0158/document.
Der volle Inhalt der QuelleThe electron beam (500 keV, 30 kA, 100 ns) of the RKA (Relativistic Klystron Amplifier) generator is used to study materials under shocks at low fluences (< 10 cal/cm²). Their response depends on the beam characteristics at the impact location, mainly in terms of spatial homogeneity. We have used electrical diagnostics as well as an optical diagnostics where the visible photons produced by Cerenkov emission in a silica target are collected by fast cameras. Beam homogeneity has been studied in the vacuum diode as a function of the materials used for the cathode and the anode. Beam propagation and focusing in a chamber filled with a low-pressure gas has also been investigated.Each part of the installation has been optimized during this work. We found that, among the tested materials, a velvet cathode with well-aligned fibers is the best emitter. An anode of thickness about ten micrometers improves the beam homogeneity by scattering of electrons. Next, we focused on beam propagation and focusing in the chamber. For example, a 400 keV, 4.2 kA electron beam can be propagated at constant radius in argon at 0.7 mbar. We performed simulations with the Monte Carlo code Geant4 in order to compute the beam interaction with the Cerenkov target as well as with the anode. Beam emission and propagation were simulated with the PIC code Magic. The good agreement with the experimental results allows us to estimate the electron distributions at any position along the beam path in order to initialize correctly the computation of the beam-material interaction
Lecat-Mathieu, de Boissac Capucine. „Developing radiation-hardening solutions for high-performance and low-power systems“. Electronic Thesis or Diss., Aix-Marseille, 2021. http://www.theses.fr/2021AIXM0413.
Der volle Inhalt der QuelleNew actors have accelerated the pace of putting new satellites into orbit, and other domains like the automotive industry are at the origin of this development. These new actors rely on advanced technologies, such as UTBB FD-SOI in order to be able to achieve the necessary performance to accomplish the tasks. Albeit disruptive in terms of intrinsic soft-error resistance, the growing density and complexity of spaceborne and automotive systems require an accurate characterization of technologies, as well as an adaptation of traditional hardening techniques. This PhD focuses on the study of radiation effects in advanced FD-SOI and bulk silicon processes, and on the research of innovative protection mechanisms. A custom, self-calibrating transient measurements structure with automated design flow is first presented, allowing for the characterization of four different technologies during accelerated tests. The soft-error response of 28~nm FD-SOI and 40~nm bulk logic and storage cells is then assessed through beam testing and with the help of TCAD simulations, allowing to study the influence of voltage, frequency scaling and the application of forward body biasing on sensitivity. Total ionizing dose is also investigated through the use of an on-chip monitoring block. The test results are then utilized to propose a novel hardening solution for system on chip, which gathers the monitoring structures into a real-time radiation environment assessment and a power management unit for power mode adjustments. Finally, as an extension of the SET sensors capability, an implementation of radiation monitors in a context of secure systems is proposed to detect and counteract laser attacks
Vivona, Marilena. „Radiation hardening of rare-earth doped fiber amplifiers“. Thesis, Saint-Etienne, 2013. http://www.theses.fr/2013STET4008.
Der volle Inhalt der QuelleThis thesis is devoted to the study of the radiation response of optical amplifiers based on Er/Yb doped fibers. These devices operating at 1.5 µm are conceived for space applications and contextually the evaluation of their performance in such harsh environment becomes of crucial importance. Two treatments, the H2-loading and the Ce-doping of the fiber core, are investigated as radiation hardening solutions. A spectroscopic study has been associated, in order to improve the knowledge of the physical mechanisms responsible for the signal degradation and the action of the hardening solutions. The thesis is organized in three parts. Part I deals with a general description of the Rare-Earth (RE)-doped fibers, with the introduction of some basic concepts of the RE-ion physics and their interaction with the host matrix material (phosphosilicate glass). The state-of-art of the radiation effects on the optical fibers, particularly the RE- doped fibers, is also overviewed. Part II describes the samples (fiber fabrication, geometry and chemical compositions), and the used experimental techniques, including a short discussion on the related theoretical background. Part III describes the main results; firstly, the active tests, performed on the RE-doped fiber as part of an optical amplifier, demonstrate that the Ce-codoping and H2-load have a key-role in the limitation of the radiation induced losses. Then, the spectroscopic analysis of the phosphosilicate glass (Raman study) and of the RE-ions (stationary and time-resolved luminescence) show a stabilization effect due to the two treatments, leading to a preservation of the high efficiency of the physical system under study