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Auswahl der wissenschaftlichen Literatur zum Thema „Dry etch“
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Zeitschriftenartikel zum Thema "Dry etch"
Lee, Jong Seok, Geun Min Choi, Ji Nok Jung, et al. "Development of a Integrated Dry/Wet Hybrid Cleaning System." Solid State Phenomena 195 (December 2012): 21–24. http://dx.doi.org/10.4028/www.scientific.net/ssp.195.21.
Der volle Inhalt der QuelleCastro, Marcelo S. B., Sebastien Barnola, and Barbara Glück. "Selective and Anisotropic Dry Etching of Ge over Si." Journal of Integrated Circuits and Systems 8, no. 2 (2013): 104–9. http://dx.doi.org/10.29292/jics.v8i2.380.
Der volle Inhalt der QuellePARK, JONG CHEON, JIN KON KIM, TAE GYU KIM, et al. "DRY ETCHING OF SnO2 AND ZnO FILMS IN HALOGEN-BASED INDUCTIVELY COUPLED PLASMAS." International Journal of Modern Physics B 25, no. 31 (2011): 4237–40. http://dx.doi.org/10.1142/s0217979211066660.
Der volle Inhalt der QuelleLenzi, Tathiane Larissa, Fabio Zovico Maxnuck Soares, and Rachel de Oliveira Rocha. "Does Bonding Approach Influence the Bond Strength of Universal Adhesive to Dentin of Primary Teeth?" Journal of Clinical Pediatric Dentistry 41, no. 3 (2017): 214–18. http://dx.doi.org/10.17796/1053-4628-41.3.214.
Der volle Inhalt der QuelleSzweda, Roy. "Dry etch processes for optoelectronic devices." III-Vs Review 14, no. 1 (2001): 42–47. http://dx.doi.org/10.1016/s0961-1290(01)89007-4.
Der volle Inhalt der QuelleChiang, Chao-Ching, Xinyi Xia, Jian-Sian Li, Fan Ren та Stephen J. Pearton. "Selective Wet and Dry Etching of NiO over β-Ga2O3". ECS Transactions 111, № 2 (2023): 73–83. http://dx.doi.org/10.1149/11102.0073ecst.
Der volle Inhalt der QuelleAltamirano-Sanchez, Efrain, Yoko Yamaguchi, Jeffrey Lindain, et al. "Dry Etch Fin Patterning of a Sub-22nm Node SRAM Cell: EUV Lithography New Dry Etch Challenges." ECS Transactions 34, no. 1 (2019): 377–82. http://dx.doi.org/10.1149/1.3567607.
Der volle Inhalt der QuelleFarrow, Woodrow D., and Jay Richman. "Summary Abstract: Advanced dry etch processing with a DRY pump." Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 6, no. 3 (1988): 1263. http://dx.doi.org/10.1116/1.575686.
Der volle Inhalt der QuelleHeidenblut, Maria, D. Sturm, Alfred Lechner, and Franz Faupel. "Characterization of Post Etch Residues Depending on Resist Removal Processes after Aluminum Etch." Solid State Phenomena 145-146 (January 2009): 349–52. http://dx.doi.org/10.4028/www.scientific.net/ssp.145-146.349.
Der volle Inhalt der QuelleKang, In Ho, Wook Bahng, Sung Jae Joo, Sang Cheol Kim, and Nam Kyun Kim. "Post Annealing Etch Process for Improved Reverse Characteristics of 4H-SiC Diode." Materials Science Forum 615-617 (March 2009): 663–66. http://dx.doi.org/10.4028/www.scientific.net/msf.615-617.663.
Der volle Inhalt der QuelleDissertationen zum Thema "Dry etch"
Nilgianskul, Tan. "Control of a semiconductor dry etch process using variation and correlation analyses." Thesis, Massachusetts Institute of Technology, 2016. http://hdl.handle.net/1721.1/107025.
Der volle Inhalt der QuelleMuthukrishnan, N. Moorthy. "Characterization and modeling of dry etch processes for titanium nitride and titanium films in Cl₂/N₂ and BCl₃ plasmas." Diss., This resource online, 1996. http://scholar.lib.vt.edu/theses/available/etd-06062008-151045/.
Der volle Inhalt der QuelleCatala, Antoine. "Gravure Plasma du Nitrure de Gallium pour la réalisation de micro LEDs à hautes performances." Electronic Thesis or Diss., Université Grenoble Alpes, 2024. http://www.theses.fr/2024GRALT041.
Der volle Inhalt der QuelleVilla, Katherine. "The use of wet-to-dry dressings for mechanical debridement." Honors in the Major Thesis, University of Central Florida, 2013. http://digital.library.ucf.edu/cdm/ref/collection/ETH/id/928.
Der volle Inhalt der QuelleHamlett, Anna. "Human trafficking : a modern day slavery." Honors in the Major Thesis, University of Central Florida, 2009. http://digital.library.ucf.edu/cdm/ref/collection/ETH/id/1270.
Der volle Inhalt der QuelleTorres, Gabriella. "An exploratory study : romanticism in modern day men and women." Honors in the Major Thesis, University of Central Florida, 2010. http://digital.library.ucf.edu/cdm/ref/collection/ETH/id/1509.
Der volle Inhalt der QuelleMiniello, Jonathan. "Missing the consequences misperceptions of the 1967 six-day israeli-arab war." Honors in the Major Thesis, University of Central Florida, 2011. http://digital.library.ucf.edu/cdm/ref/collection/ETH/id/478.
Der volle Inhalt der QuelleAhmed, Shameem. "Day in and day out : women's experience in the family and the reconstruction of their secondary status." Thesis, McGill University, 1991. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=59959.
Der volle Inhalt der QuelleGuijarro, de Ortiz Myriam. "Literacy Activities that Parents of Preschool Children Attending Day Care Promote at Home and Community Settings." Honors in the Major Thesis, University of Central Florida, 2005. http://digital.library.ucf.edu/cdm/ref/collection/ETH/id/760.
Der volle Inhalt der QuelleAlabed, Hadhom Mohamed. "The effects of fasting for a single day, and during Ramadan, upon performance." Thesis, Liverpool John Moores University, 2010. http://researchonline.ljmu.ac.uk/5958/.
Der volle Inhalt der QuelleBücher zum Thema "Dry etch"
Deepak, Ranadive, and Society of Photo-optical Instrumentation Engineers., eds. Dry etch technology: 9-10-September 1991, San Jose, California. SPIE, 1992.
Den vollen Inhalt der Quelle findenAndrews, Mark. Dry suit diver manual. PSA International, 2005.
Den vollen Inhalt der Quelle findenRowney, Eddie. The guide to dry stone walling. E. Rowney, 2000.
Den vollen Inhalt der Quelle findenRoss, Kathy. Every day is Earth Day: A craft book. Millbrook Press, 1994.
Den vollen Inhalt der Quelle findenRoss, Kathy. Every day is Earth Day: A craft book. Millbrook Press, 1995.
Den vollen Inhalt der Quelle findenBuchteile zum Thema "Dry etch"
van Roosmalen, A. J., J. A. G. Baggerman, and S. J. H. Brader. "Etch Processes." In Dry Etching for VLSI. Springer US, 1991. http://dx.doi.org/10.1007/978-1-4899-2566-4_6.
Der volle Inhalt der QuellePearton, S. J., and R. J. Shul. "Dry Etch Damage in Widegap Semiconductor Materials." In Defects in Optoelectronic Materials. CRC Press, 2022. http://dx.doi.org/10.1201/9780367811297-5.
Der volle Inhalt der QuelleMansfield, William M. "Enhancement of Dry-Etch Resistance of Poly(butene-1 sulfone)." In Polymers for High Technology. American Chemical Society, 1987. http://dx.doi.org/10.1021/bk-1987-0346.ch027.
Der volle Inhalt der QuelleClaes, Martine, Quoc Toan Le, J. Keldermans, et al. "Photoresist Characterization and Wet Strip after Low-k Dry Etch." In Solid State Phenomena. Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/3-908451-46-9.325.
Der volle Inhalt der QuelleSchaedeli, U., M. Hofmann, E. Tinguely, and N. Münzel. "A Top-Surface Imaging Approach Based on the Light-Induced Formation of Dry-Etch Barriers." In ACS Symposium Series. American Chemical Society, 1995. http://dx.doi.org/10.1021/bk-1995-0614.ch020.
Der volle Inhalt der QuelleIto, Hiroshi, Mitsuru Ueda, and Mayumi Ebina. "Copolymer Approach to Design of Sensitive Deep-UV Resist Systems with High Thermal Stability and Dry Etch Resistance." In ACS Symposium Series. American Chemical Society, 1989. http://dx.doi.org/10.1021/bk-1989-0412.ch004.
Der volle Inhalt der QuelleClaes, M., Vasile Paraschiv, S. Beckx, et al. "Selective Wet Removal of Hf-Based Layers and Post-Dry Etch Residues in High-k and Metal Gate Stacks." In Solid State Phenomena. Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/3-908451-06-x.93.
Der volle Inhalt der QuelleBreuker, Remco E. "North Korean Slavery and Forced Labor in Present-Day Europe." In The Palgrave Handbook of Global Slavery throughout History. Springer International Publishing, 2023. http://dx.doi.org/10.1007/978-3-031-13260-5_36.
Der volle Inhalt der QuelleMohammed, S. G., M. Halliru, J. M. Jibrin, I. Kapran, and H. A. Ajeigbe. "Impact Assessment of Developing Sustainable and Impact-Oriented Groundnut Seed System Under the Tropical Legumes (III) Project in Northern Nigeria." In Enhancing Smallholder Farmers' Access to Seed of Improved Legume Varieties Through Multi-stakeholder Platforms. Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-15-8014-7_6.
Der volle Inhalt der QuelleLeape, Lucian L. "A Community of Concern: The Massachusetts Coalition for the Prevention of Medical Errors." In Making Healthcare Safe. Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-71123-8_8.
Der volle Inhalt der QuelleKonferenzberichte zum Thema "Dry etch"
Cho, Kyoung Y., and Dong W. Im. "ECR plasma and etch characterization of photoresist dry etch processes." In Dry Etch Technology, edited by Deepak Ranadive. SPIE, 1992. http://dx.doi.org/10.1117/12.56918.
Der volle Inhalt der QuelleTurner, Terry R. "Correlation of real-time-monitored process module parameters and wafer results." In Dry Etch Technology, edited by Deepak Ranadive. SPIE, 1992. http://dx.doi.org/10.1117/12.56921.
Der volle Inhalt der QuelleNulty, James E., and Joseph A. Maher. "Application-specific integrated processing for ULSI." In Dry Etch Technology, edited by Deepak Ranadive. SPIE, 1992. http://dx.doi.org/10.1117/12.56920.
Der volle Inhalt der QuelleYoneda, Masahiro, K. Kawai, Hiroshi Miyatake, Nobuo Fujiwara, K. Nishioka, and Haruhiko Abe. "Evaluation of silicon surface damage induced by plasma radiation." In Dry Etch Technology, edited by Deepak Ranadive. SPIE, 1992. http://dx.doi.org/10.1117/12.56910.
Der volle Inhalt der QuelleNamura, Takashi, Hirofumi Uchida, Hiroyuki Okada, et al. "Wafer charging in different types of plasma etchers." In Dry Etch Technology, edited by Deepak Ranadive. SPIE, 1992. http://dx.doi.org/10.1117/12.56911.
Der volle Inhalt der QuelleHasan, Zia, Joseph A. Maher, James E. Nulty, and Larry Krynski. "In-situ auto ash: a key to reducing process-generated particles." In Dry Etch Technology, edited by Deepak Ranadive. SPIE, 1992. http://dx.doi.org/10.1117/12.56912.
Der volle Inhalt der QuelleReinhardt, Karen A., and Francois M. Dumesnil. "Characterization of silicon damage during LDD oxide spacer etch with the use of thermal-wave-modulated reflectance." In Dry Etch Technology, edited by Deepak Ranadive. SPIE, 1992. http://dx.doi.org/10.1117/12.56913.
Der volle Inhalt der QuelleMiyatake, Hiroshi, K. Kawai, Nobuo Fujiwara, Masahiro Yoneda, K. Nishioka, and Haruhiko Abe. "Surface contamination control during plasma etching." In Dry Etch Technology, edited by Deepak Ranadive. SPIE, 1992. http://dx.doi.org/10.1117/12.56914.
Der volle Inhalt der QuelleTanimoto, Keisuke, Hiroyuki Komeda, Daisuke Takehara, Ryohei Kawabata, and Hikou Shibayama. "Consideration on the resolution limit of the resist silylated process." In Dry Etch Technology, edited by Deepak Ranadive. SPIE, 1992. http://dx.doi.org/10.1117/12.56915.
Der volle Inhalt der QuelleNicolau, Dan V., Gheorghita Jinescu, Florin Fulga, and Mircea V. Dusa. "Mathematical model of the plasma etching of resists containing silicon." In Dry Etch Technology, edited by Deepak Ranadive. SPIE, 1992. http://dx.doi.org/10.1117/12.56916.
Der volle Inhalt der QuelleBerichte der Organisationen zum Thema "Dry etch"
Ohta, Taisuke. LaB6 nanostructures - wet vs dry etch. Office of Scientific and Technical Information (OSTI), 2019. http://dx.doi.org/10.2172/1491599.
Der volle Inhalt der QuelleZhang, Linlin, Xiaoming Xi, Xihua Liu, et al. Should aerobic and resistance training interventions for Multiple sclerosis be performed on the same day: A protocol for systematic review and network meta-analysis. INPLASY - International Platform of Registered Systematic Review and Meta-analysis Protocols, 2021. http://dx.doi.org/10.37766/inplasy2021.12.0126.
Der volle Inhalt der QuelleMarlow, Thomas. PR-000-18COMP-R03 Damage Prevention Compendium. Pipeline Research Council International, Inc. (PRCI), 2019. http://dx.doi.org/10.55274/r0011548.
Der volle Inhalt der QuelleGreaney, Carrie. PR-000-18COMP-R04 Geohazards Compendium. Pipeline Research Council International, Inc. (PRCI), 2019. http://dx.doi.org/10.55274/r0011549.
Der volle Inhalt der QuelleMarlow, Thomas, Laurie Perry (Archived), and Carrie Greaney. PR-000-18COMP-R05 Horizontal Directional Drilling Compendium. Pipeline Research Council International, Inc. (PRCI), 2019. http://dx.doi.org/10.55274/r0011550.
Der volle Inhalt der QuelleMarlow, Thomas. PR-000-18COMP-R06 Pipeline Repair Compendium. Pipeline Research Council International, Inc. (PRCI), 2019. http://dx.doi.org/10.55274/r0011551.
Der volle Inhalt der QuelleMarlow, Thomas. PR-000-18COMP-R02 Composite Repairs Compendium. Pipeline Research Council International, Inc. (PRCI), 2019. http://dx.doi.org/10.55274/r0011547.
Der volle Inhalt der QuelleChoquette, Gary. PR-000-18COMP-R01 Gas Engine Emissions Compendium. Pipeline Research Council International, Inc. (PRCI), 2019. http://dx.doi.org/10.55274/r0011546.
Der volle Inhalt der QuelleChoquette, Gary. PR-000-21COMP-R04 Valve Spacing and Automation Compendium. Pipeline Research Council International, Inc. (PRCI), 2021. http://dx.doi.org/10.55274/r0012149.
Der volle Inhalt der QuelleRipey, Mariya. NUMBERS IN THE NEWS TEXT (BASED ON MATERIAL OF ONE ISSUE OF NATIONWIDE NEWSPAPER “DAY”). Ivan Franko National University of Lviv, 2021. http://dx.doi.org/10.30970/vjo.2021.50.11106.
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