Thematische Bibliographien / Curtaining

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Auswahl der wissenschaftlichen Literatur zum Thema „Curtaining“

Autor: Grafiati

Veröffentlicht am 28. Juni 2021

Zuletzt aktualisiert am 17. Februar 2022

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Zeitschriftenartikel zum Thema "Curtaining"

Schwartz, Jonathan, Yi Jiang, Yongjie Wang, Anthony Aiello, Pallab Bhattacharya, Hui Yuan, Zetian Mi, Nabil Bassim und Robert Hovden. „Removing Stripes, Scratches, and Curtaining with Nonrecoverable Compressed Sensing“. Microscopy and Microanalysis 25, Nr. 3 (14.03.2019): 705–10. http://dx.doi.org/10.1017/s1431927619000254.

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AbstractHighly-directional image artifacts such as ion mill curtaining, mechanical scratches, or image striping from beam instability degrade the interpretability of micrographs. These unwanted, aperiodic features extend the image along a primary direction and occupy a small wedge of information in Fourier space. Deleting this wedge of data replaces stripes, scratches, or curtaining, with more complex streaking and blurring artifacts—known within the tomography community as “missing wedge” artifacts. Here, we overcome this problem by recovering the missing region using total variation minimization, which leverages image sparsity-based reconstruction techniques—colloquially referred to as compressed sensing (CS)—to reliably restore images corrupted by stripe-like features. Our approach removes beam instability, ion mill curtaining, mechanical scratches, or any stripe features and remains robust at low signal-to-noise. The success of this approach is achieved by exploiting CS's inability to recover directional structures that are highly localized and missing in Fourier Space.

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Denisyuk, Andrey, Tomáš Hrnčíř, Jozef Vincenc Oboňa, Sharang, Martin Petrenec und Jan Michalička. „Mitigating Curtaining Artifacts During Ga FIB TEM Lamella Preparation of a 14 nm FinFET Device“. Microscopy and Microanalysis 23, Nr. 3 (20.03.2017): 484–90. http://dx.doi.org/10.1017/s1431927617000241.

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AbstractWe report on the mitigation of curtaining artifacts during transmission electron microscopy (TEM) lamella preparation by means of a modified ion beam milling approach, which involves altering the incident angle of the Ga ions by rocking of the sample on a special stage. We applied this technique to TEM sample preparation of a state-of-the-art integrated circuit based on a 14-nm technology node. Site-specific lamellae with a thickness <15 nm were prepared by top-down Ga focused ion beam polishing through upper metal contacts. The lamellae were analyzed by means of high-resolution TEM, which showed a clear transistor structure and confirmed minimal curtaining artifacts. The results are compared with a standard inverted thinning preparation technique.

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Schankula, Christopher W., Christopher K. Anand und Nabil D. Bassim. „Multi-Angle Plasma Focused Ion Beam (FIB) Curtaining Artifact Correction Using a Fourier-Based Linear Optimization Model“. Microscopy and Microanalysis 24, Nr. 6 (Dezember 2018): 657–66. http://dx.doi.org/10.1017/s1431927618015234.

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AbstractWe present a flexible linear optimization model for correcting multi-angle curtaining effects in plasma focused ion beam scanning electron microscopy (PFIB-SEM) images produced by rocking-polishing schemes. When PFIB-SEM is employed in a serial sectioning tomography workow, it is capable of imaging large three-dimensional volumes quickly, providing rich information in the critical 10–100 nm feature length scale. During tomogram acquisition, a “rocking polish” is often used to reduce straight-line “curtaining” gradations in the milled sample surface. While this mitigation scheme is effective for deep curtains, it leaves shallower line artifacts at two discretized angles. Segmentation and other automated processing of the image set requires that these artifacts be corrected for accurate microstructural quantification. Our work details a new Fourier-based linear optimization model for correcting curtaining artifacts by targeting curtains at two discrete angles. We demonstrate its capabilities by processing images from a tomogram from a multiphase, heterogeneous concrete sample. We present methods for selecting the parameters which meet the user’s goals most appropriately. Compared to previous works, we show that our model provides effective multi-angle curtain correction without introducing artifacts into the image, modifying non-curtain structures or causing changes to the contrast of voids. Our algorithm can be easily parallelized to take advantage of multi-core hardware.

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Sparkes, Peter. „The 1925 Property Legislation: Curtaining off the Antecedents“. Statute Law Review 9, Nr. 3 (1988): 146–59. http://dx.doi.org/10.1093/slr/9.3.146.

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Schwarz, Stephen M., Brian W. Kempshall, Lucille A. Giannuzzi1 und Molly R. McCartney. „Avoiding the Curtaining Effect: Backside Milling by FIB INLO“. Microscopy and Microanalysis 9, S02 (28.07.2003): 116–17. http://dx.doi.org/10.1017/s1431927603441044.

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Schwartz, Jonathan, Yi Jiang, Yongjie Wang, Anthony Aiello, Pallab Bhattacharya, Hui Yuan, Zetian Mi, Nabil Bassim und Robert Hovden. „Removing Stripes, Scratches, and Curtaining with Non-Recoverable Compressed Sensing“. Microscopy and Microanalysis 25, S2 (August 2019): 174–75. http://dx.doi.org/10.1017/s1431927619001600.

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Santoro, Francesca, Elmar Neumann, Gregory Panaitov und Andreas Offenhäusser. „FIB section of cell–electrode interface: An approach for reducing curtaining effects“. Microelectronic Engineering 124 (Juli 2014): 17–21. http://dx.doi.org/10.1016/j.mee.2014.04.021.

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Fitschen, Jan Henrik, Jianwei Ma und Sebastian Schuff. „Removal of curtaining effects by a variational model with directional forward differences“. Computer Vision and Image Understanding 155 (Februar 2017): 24–32. http://dx.doi.org/10.1016/j.cviu.2016.12.008.

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Altan, Burçin Deda, Mehmet Atılgan und Aydoğan Özdamar. „An experimental study on improvement of a Savonius rotor performance with curtaining“. Experimental Thermal and Fluid Science 32, Nr. 8 (September 2008): 1673–78. http://dx.doi.org/10.1016/j.expthermflusci.2008.06.006.

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Denisyuk, Andrey, Tomáš Hrnčíř, Jozef Vincenc Oboňa, Martin Petrenec und Jan Michalička. „Curtaining-Free Top-Down TEM Lamella Preparation from a Cutting Edge Integrated Circuit“. Microscopy and Microanalysis 22, S3 (Juli 2016): 196–97. http://dx.doi.org/10.1017/s1431927616001835.

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Dissertationen zum Thema "Curtaining"

Dvořák, Martin. „Anticurtaining - obrazový filtr pro elektronovou mikroskopii“. Master's thesis, Vysoké učení technické v Brně. Fakulta informačních technologií, 2021. http://www.nusl.cz/ntk/nusl-445537.

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Tomographic analysis produces 3D images of examined material in nanoscale by focus ion beam (FIB). This thesis presents new approach to elimination of the curtain effect by machine learning method. Convolution neuron network is proposed for elimination of damaged imagine by the supervised learning technique. Designed network deals with features of damaged image, which are caused by wavelet transformation. The outcome is visually clear image. This thesis also designs creation of synthetic data set for training the neuron network which are created by simulating physical process of the creation of the real image. The simulation is made of creation of examined material by milling which is done by FIB and by process displaying of the surface by electron microscope (SEM). This newly created approach works precisely with real images. The qualitative evaluation of results is done by amateurs and experts of this problematic. It is done by anonymously comparing this solution to another method of eliminating curtaining effect. Solution presents new and promising approach to elimination of curtaining effect and contributes to a better procedure of dealing with images which are created during material analysis.

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Bücher zum Thema "Curtaining"

Capricious fancy: Draping and curtaining the historic interior, 1800-1930. Philadelphia: University of Pennsylvania Press, 2012.

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1923-, Cummings Abbott Lowell, Little Nina Fletcher 1903- und Society for the Preservation of New England Antiquities., Hrsg. Bed hangings: A treatise on fabrics and styles in the curtaining of beds, 1650-1850. Boston: Society for the Preservation of New England Antiquities, 1994.

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Nylander, Jane, und Nina Fletcher Little. Bed Hangings: A Treatise on Fabrics and Styles in the Curtaining of Beds, 1650-1850. Society for the Preservation of New England Antiquities, 1994.

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Buchteile zum Thema "Curtaining"

Gooch, Jan W. „Curtaining“. In Encyclopedic Dictionary of Polymers, 188. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_3211.

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„Curtaining“. In Encyclopedic Dictionary of Polymers, 250. New York, NY: Springer New York, 2007. http://dx.doi.org/10.1007/978-0-387-30160-0_3157.

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Konferenzberichte zum Thema "Curtaining"

Fairfield, Adam J., Jonathan Plasencia, Yun Jang, Nicholas Theodore, Neil R. Crawford, David H. Frakes und Ross Maciejewski. „Volume curtaining: a focus+context effect for multimodal volume visualization“. In SPIE Medical Imaging, herausgegeben von Stephen Aylward und Lubomir M. Hadjiiski. SPIE, 2014. http://dx.doi.org/10.1117/12.2043186.

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Phinney, Leslie M., Bonnie B. McKenzie, James A. Ohlhausen, Thomas E. Buchheit und Randy J. Shul. „Characterization of SOI MEMS Sidewall Roughness“. In ASME 2011 International Mechanical Engineering Congress and Exposition. ASMEDC, 2011. http://dx.doi.org/10.1115/imece2011-62593.

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Deep reactive ion etching (DRIE) of silicon enables high aspect ratio, deep silicon features that can be incorporated into the fabrication of microelectromechanical systems (MEMS) sensors and actuators. The DRIE process creates silicon structures and consists of three steps: conformal polymer deposition, ion sputtering, and chemical etching. The sequential three step process results in sidewalls with roughness that varies with processing conditions. This paper reports the sidewall roughness for DRIE etched MEMS as a function of trench width from 5 μm to 500 μm for a 125 μm thick device layer corresponding to aspect ratios from 25 to 0.25. Using a scanning electron microscope (SEM), the surfaces were imaged detecting an upper region exhibiting a scalloping morphology and a rougher lower region exhibiting a curtaining morphology. The height of rougher curtaining region increases linearly with aspect ratio when the etch cleared the entire device layer. The surface roughness for two trench widths: 15 μm and 100 μm were further characterized using an atomic force microscope (AFM), and RMS roughness values are reported as a function of height along the surface. The sidewall roughness varies with height and depends on the trench width.

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Moreau, S., D. Bouchu und G. Audoit. „Fast and easy sample preparation with reduced curtaining artifacts using a P-FIB“. In 2014 IEEE 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). IEEE, 2014. http://dx.doi.org/10.1109/ipfa.2014.6898159.

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Hrnčíř, Tomáš, und Lukáš Hladík. „Fast and Precise 3D Tomography of TSV by Using Xe Plasma FIB“. In ISTFA 2013. ASM International, 2013. http://dx.doi.org/10.31399/asm.cp.istfa2013p0027.

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Abstract 3D tomography of TSVs was performed by combining Xe plasma FIB milling and lift-out techniques. This approach allows analyzing the structure of TSVs in detail using a method faster than the usual 3D tomography by Ga FIB and more precise than X-ray tomography. Both well-filled TSVs and TSVs with voids were analyzed and the results were compared. The analysis procedure was optimized in order to reduce the analysis time and to increase the throughput. The lift-out of the analyzed block of material was performed to obtain 90° angle between TSV and the ion beam axes, which is critical to reduce the curtaining effect and which allowed to increase FIB beam current significantly, reducing the analysis time.

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