Inhaltsverzeichnis
Auswahl der wissenschaftlichen Literatur zum Thema „Cu foam“
Geben Sie eine Quelle nach APA, MLA, Chicago, Harvard und anderen Zitierweisen an
Machen Sie sich mit den Listen der aktuellen Artikel, Bücher, Dissertationen, Berichten und anderer wissenschaftlichen Quellen zum Thema "Cu foam" bekannt.
Neben jedem Werk im Literaturverzeichnis ist die Option "Zur Bibliographie hinzufügen" verfügbar. Nutzen Sie sie, wird Ihre bibliographische Angabe des gewählten Werkes nach der nötigen Zitierweise (APA, MLA, Harvard, Chicago, Vancouver usw.) automatisch gestaltet.
Sie können auch den vollen Text der wissenschaftlichen Publikation im PDF-Format herunterladen und eine Online-Annotation der Arbeit lesen, wenn die relevanten Parameter in den Metadaten verfügbar sind.
Zeitschriftenartikel zum Thema "Cu foam"
Wang, Jing, Zan Zhang, Jian Ding, Chuan Rong Qiu, Xing Chuan Xia, and Wei Min Zhao. "Quasi-Static Compressive Characteristics of Cu-Containing Closed-Cell Aluminum Foams." Key Engineering Materials 748 (August 2017): 173–80. http://dx.doi.org/10.4028/www.scientific.net/kem.748.173.
Der volle Inhalt der QuelleDutta, Abhijit, Kiran Kiran, Motiar Rahaman, et al. "Insights from Operando and Identical Location (IL) Techniques on the Activation of Electrocatalysts for the Conversion of CO2: A Mini-Review." CHIMIA International Journal for Chemistry 75, no. 9 (2021): 733–43. http://dx.doi.org/10.2533/chimia.2021.733.
Der volle Inhalt der QuelleYang, Haobo, Jichao Li, Hao Yu, Feng Peng, and Hongjuan Wang. "Metal-Foam-Supported Pd/Al2O3 Catalysts for Catalytic Combustion of Methane: Effect of Interaction between Support and Catalyst." International Journal of Chemical Reactor Engineering 13, no. 1 (2015): 83–93. http://dx.doi.org/10.1515/ijcre-2014-0009.
Der volle Inhalt der QuelleSridaeng, Duangruthai, Benjatham Sukkaneewat, Nuttawut Chueasakol, and Nuanphun Chantarasiri. "Copper-amine complex solution as a low-emission catalyst for flexible polyurethane foam preparation." e-Polymers 15, no. 2 (2015): 119–26. http://dx.doi.org/10.1515/epoly-2014-0197.
Der volle Inhalt der QuelleHuang, Yao, Zexin Li, Lucai Wang, et al. "Preparation and Heat Dissipation Properties Comparison of Al and Cu Foam." Metals 12, no. 12 (2022): 2066. http://dx.doi.org/10.3390/met12122066.
Der volle Inhalt der QuelleMirzaee, Majid, and Changiz Dehghanian. "Nanostructured Ni-Cu Foam Electrodeposited on a Copper Substrate Applied as Supercapacitor Electrode." Acta Metallurgica Slovaca 24, no. 4 (2018): 325. http://dx.doi.org/10.12776/ams.v24i4.1138.
Der volle Inhalt der QuelleSridaeng, Duangruthai, Wannisa Jitaree, Preecha Thiampanya, and Nuanphun Chantarasiri. "Preparation of rigid polyurethane foams using low-emission catalysts derived from metal acetates and ethanolamine." e-Polymers 16, no. 4 (2016): 265–75. http://dx.doi.org/10.1515/epoly-2016-0021.
Der volle Inhalt der QuelleBalciunaite, Aldona, Žana Činčienė, Loreta Tamasiunaite, Jūratė Vaičiūnienė, and Eugenijus Norkus. "3D Structured Pt(Cu-Ni)/Ti Catalysts for the Oxidation of Sodium Borohydride." ECS Meeting Abstracts MA2022-01, no. 35 (2022): 1523. http://dx.doi.org/10.1149/ma2022-01351523mtgabs.
Der volle Inhalt der QuelleYe, Bora, and Sunjung Kim. "Formation of Nanocrystalline Surface of Cu–Sn Alloy Foam Electrochemically Produced for Li-Ion Battery Electrode." Journal of Nanoscience and Nanotechnology 15, no. 10 (2015): 8217–21. http://dx.doi.org/10.1166/jnn.2015.11434.
Der volle Inhalt der QuelleHou, Guang Ya, Ji Yu Li, Lian Kui Wu, Yi Ping Tang, Hua Zhen Cao, and Guo Qu Zheng. "Effect of Dealloying Process on Microstructure and Electrochemical Properties of Ni Foam." Materials Science Forum 922 (May 2018): 3–7. http://dx.doi.org/10.4028/www.scientific.net/msf.922.3.
Der volle Inhalt der QuelleDissertationen zum Thema "Cu foam"
Smith, William Daniel. "The effects of zirconium on the microstructure and mechanical properties of the Al-Li-Cu-Mg alloy 8090." Thesis, University of Southampton, 1997. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.245329.
Der volle Inhalt der QuelleAn, Tao. "Design, realization and study of bimetallic and metallic based composite materials with controlled architecture obtained by mixed process : additive manufacturing/foundry/powder metallurgy for heat exchange in braking systems." Electronic Thesis or Diss., Université de Lille (2022-....), 2024. https://pepite-depot.univ-lille.fr/ToutIDP/EDSMRE/2024/2024ULILR028.pdf.
Der volle Inhalt der QuelleBullock, Richard John. "Mobility, chemical form and bioavailability of Cd, Zn, Pb and Cu in woodland soils contaminated by aerial fallout." Thesis, University of Bristol, 1992. http://hdl.handle.net/1983/745d9114-d91c-4b21-9dfd-bb0195a59939.
Der volle Inhalt der QuelleCarnahan, Elizabeth A. "Foraminiferal assemblages as bioindicators of potentially toxic elements in Biscayne Bay, Florida." [Tampa, Fla.] : University of South Florida, 2005. http://purl.fcla.edu/fcla/etd/SFE0001019.
Der volle Inhalt der QuelleGiarnieri, Ilenia. "Kraft lignin depolymerization to added-value building blocks by electrooxidation over Ni and Cu electrocatalysts." Master's thesis, Alma Mater Studiorum - Università di Bologna, 2021. http://amslaurea.unibo.it/24402/.
Der volle Inhalt der QuelleChen, Wen-Yu, and 陳玟郁. "Cu(I)-mediating Pt reduction to form Pt-nanoparticle-embedded Nafion composites and their electrocatalytic O2 reduction." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/37732141788256658047.
Der volle Inhalt der QuelleYahg, Hui-Wen, and 楊惠文. "Cu(I)-mediating Au reduction to form Au-nanoparticle-embedded Nafion composites applied for highly selective detection of arsenic(III)." Thesis, 2016. http://ndltd.ncl.edu.tw/handle/13555172531941257327.
Der volle Inhalt der QuelleMAREPALLY, BHANU CHANDRA. "Production of Solar Fuels using CO2." Doctoral thesis, 2017. http://hdl.handle.net/11570/3107057.
Der volle Inhalt der QuelleBücher zum Thema "Cu foam"
Anghelescu, Șerban, and Răzvan Supuran. Mețeriașii: (foae cu mîini). Casa de Pariuri Literare, 2011.
Den vollen Inhalt der Quelle findenHoward, Elizabeth P., Leon N. Geffen, and Sophie Hogeveen. InterRAI Check-Up (CU) Assessment Form, Korean Edition. interRAI, 2024.
Den vollen Inhalt der Quelle findenBuchteile zum Thema "Cu foam"
Park, Soo Han, Yong Su Um, and Bo Young Hur. "Rheological Properties of Molten Al-Cu Alloys for Manufacturing Metallic Foam." In Solid State Phenomena. Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/3-908451-26-4.656.
Der volle Inhalt der QuelleLokhande, Prasad E., Umesh S. Chavan, S. V. Deokar, Mukul Ingale, and Himanshu Khadase. "Copper Oxide Synthesis on Cu Foam by Chemical Bath Deposition with Surfactant for Supercapacitor." In Advances in Energy Research, Vol. 1. Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-15-2666-4_34.
Der volle Inhalt der QuelleTripathi, Nitish Kumar, Prafulla P. Shevkar, Chitransh Atre, and Baburaj A. Puthenveettil. "Design to Avoid Dry Out in a Flat Heat Pipe Based on Cu Foam." In Lecture Notes in Mechanical Engineering. Springer Nature Singapore, 2024. http://dx.doi.org/10.1007/978-981-99-7827-4_16.
Der volle Inhalt der QuelleCostanza, Girolamo, Francesco Mantineo, Andrea Sili, and Maria Elisa Tata. "Chacterization of Cu Tube Filled with al Alloy Foam by Means of X-Ray Computer Tomography." In TMS 2014: 143rd Annual Meeting & Exhibition. Springer International Publishing, 2014. http://dx.doi.org/10.1007/978-3-319-48237-8_74.
Der volle Inhalt der QuelleCostanza, Girolamo, Francesco Mantineo, Andrea Sili, and Maria Elisa Tata. "Characterization of Cu Tube Filled with Al Alloy Foam by Means of X-Ray Computer Tomography." In TMS 2014 Supplemental Proceedings. John Wiley & Sons, Inc., 2014. http://dx.doi.org/10.1002/9781118889879.ch74.
Der volle Inhalt der QuelleSommadossi, S., P. K. Khanna, S. K. Bhatnagar, et al. "Development of Cu/Cu Interconnections Using an Indium Interlayer." In Metal Matrix Composites and Metallic Foams. Wiley-VCH Verlag GmbH & Co. KGaA, 2005. http://dx.doi.org/10.1002/3527606203.ch38.
Der volle Inhalt der QuellePardasani, R. T., and P. Pardasani. "Effective magnetic moment of [{Cu(NCO)(OCH2CH2NEt2)}4] (triclinic form)." In Magnetic Properties of Paramagnetic Compounds. Springer Berlin Heidelberg, 2012. http://dx.doi.org/10.1007/978-3-642-23675-4_4466.
Der volle Inhalt der QuelleDlubek, Günter, Sebastian Depetasse, Alexander Sourkov, and Norbert Meyendorf. "Positron Annihilation Studies of Early Stages of Precipitation in High-Strength 2024 Al-Cu-Mg Alloy." In Metal Matrix Composites and Metallic Foams. Wiley-VCH Verlag GmbH & Co. KGaA, 2005. http://dx.doi.org/10.1002/3527606203.ch4.
Der volle Inhalt der QuelleDeJong, T. M. "Uptake and assimilation of nutrient resources." In Concepts for understanding fruit trees. CABI, 2022. http://dx.doi.org/10.1079/9781800620865.0003.
Der volle Inhalt der QuelleShinozaki, K., and K. Koyama. "Development of Al/Cu Dissimilar Brazing Joint Controlled Form of Intermetallic Compound." In THERMEC 2006. Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-428-6.4075.
Der volle Inhalt der QuelleKonferenzberichte zum Thema "Cu foam"
Yang, Le, Jianbo Xin, Zhen Pan, et al. "Mechanism Study of the Cu Foam Reinforced Sandwich Structure of Cu Sintered Joints." In 2024 25th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2024. http://dx.doi.org/10.1109/icept63120.2024.10668641.
Der volle Inhalt der QuelleT, Petrov, I. Markova Deneva, Chauvet O, and Denev I. "Synthesis and Study of Porous Carbon Foam/Cu (Cu-Sn) Nanoparticles Composites for Electrode Materials." In 9th International Conference on Multi-Material Micro Manufacture. Research Publishing Services, 2012. http://dx.doi.org/10.3850/978-981-07-3353-7_266.
Der volle Inhalt der QuelleHe, Huang, Shangyu Huang, and Yong Xiao. "Cu interconnects soldered with a novel Sn-based composite solder reinforced by Ni-Cu alloy foam." In 2020 21st International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2020. http://dx.doi.org/10.1109/icept50128.2020.9202641.
Der volle Inhalt der QuelleSharma, Vyas Mani, Vikranth Racherla, and Surjya Kanta Pal. "Fabrication of Copper Foam Plate Using Friction Sintering." In ASME 2019 14th International Manufacturing Science and Engineering Conference. American Society of Mechanical Engineers, 2019. http://dx.doi.org/10.1115/msec2019-2952.
Der volle Inhalt der QuelleHe, Huang, Kewei Tan, Yingxian He, Lei Zhao, Wen Wang, and Yong Xiao. "The microstructure of Cu joint soldered with a new Cu coated Ni foam reinforced Sn composite solder." In 2023 24th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2023. http://dx.doi.org/10.1109/icept59018.2023.10492134.
Der volle Inhalt der QuelleArrivo, Lucas, Steven Schon, and Aaron P. Wemhoff. "Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers." In ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2021. http://dx.doi.org/10.1115/ipack2021-73015.
Der volle Inhalt der QuelleWang, Qiwei, Yong Xiao, and Xingyi Zhang. "Ultrasound-assisted soldering of Cu alloy using a Ni-foam reinforced Sn composite solder." In 2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2017. http://dx.doi.org/10.1109/icept.2017.8046584.
Der volle Inhalt der QuellePetrov, T., V. Milanova, I. Denev, and I. Markova. "Electrochemical Behavior of Porous Nanocomposites Based on Carbon Foam and Intermetallic Cu-Sn Nanoparticles." In 10th International Conference on Multi-Material Micro Manufacture. Research Publishing Services, 2013. http://dx.doi.org/10.3850/978-981-07-7247-5-332.
Der volle Inhalt der QuelleZhu, Yichen, Cunwei Wei, Liyun Li, Huijun Cao, and Zhihao Zhang. "Rapid manufacturing of complete intermetallic joints using Cu/Sn foam composite by ultrasonic- assisted soldering." In 2020 21st International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2020. http://dx.doi.org/10.1109/icept50128.2020.9202530.
Der volle Inhalt der QuelleHe, Huang, Shangyu Huang, and Yong Xiao. "Microstructure evolution and mechanical properties of Cu interconnects bonded with Ni-foam reinforced pure Sn solder." In 2019 20th International Conference on Electronic Packaging Technology(ICEPT). IEEE, 2019. http://dx.doi.org/10.1109/icept47577.2019.245222.
Der volle Inhalt der QuelleBerichte der Organisationen zum Thema "Cu foam"
Leybourne, M. I., J. M. Peter, M A Schmidt, D. Layton-Matthews, A. Voinot, and L. Mathieu. Geochemical evidence for a magmatic contribution to the metal budget of the Windy Craggy Cu-Co(±Zn) volcanogenic massive-sulfide deposit, northwestern British Columbia. Natural Resources Canada/CMSS/Information Management, 2022. http://dx.doi.org/10.4095/328018.
Der volle Inhalt der QuelleCorriveau, L., and E. G. Potter. Advancing exploration for iron oxide-copper-gold and affiliated deposits in Canada: context, scientific overview, outcomes, and impacts. Natural Resources Canada/CMSS/Information Management, 2024. http://dx.doi.org/10.4095/332495.
Der volle Inhalt der QuelleChefetz, Benny, Baoshan Xing, Leor Eshed-Williams, Tamara Polubesova, and Jason Unrine. DOM affected behavior of manufactured nanoparticles in soil-plant system. United States Department of Agriculture, 2016. http://dx.doi.org/10.32747/2016.7604286.bard.
Der volle Inhalt der Quelle