Thematische Bibliographien / Cooling Devices

Inhaltsverzeichnis

  1. Zeitschriftenartikel
  2. Dissertationen
  3. Bücher
  4. Buchteile
  5. Konferenzberichte
  6. Berichte der Organisationen

Auswahl der wissenschaftlichen Literatur zum Thema „Cooling Devices“

Autor: Grafiati
Veröffentlicht am 28. Juni 2021
Zuletzt aktualisiert am 1. Februar 2022

Geben Sie eine Quelle nach APA, MLA, Chicago, Harvard und anderen Zitierweisen an

Wählen Sie eine Art der Quelle aus:

Machen Sie sich mit den Listen der aktuellen Artikel, Bücher, Dissertationen, Berichten und anderer wissenschaftlichen Quellen zum Thema "Cooling Devices" bekannt.

Neben jedem Werk im Literaturverzeichnis ist die Option "Zur Bibliographie hinzufügen" verfügbar. Nutzen Sie sie, wird Ihre bibliographische Angabe des gewählten Werkes nach der nötigen Zitierweise (APA, MLA, Harvard, Chicago, Vancouver usw.) automatisch gestaltet.

Sie können auch den vollen Text der wissenschaftlichen Publikation im PDF-Format herunterladen und eine Online-Annotation der Arbeit lesen, wenn die relevanten Parameter in den Metadaten verfügbar sind.

Zeitschriftenartikel zum Thema "Cooling Devices"

1

Ijam, Ali, und R. Saidur. „Nanofluid as a coolant for electronic devices (cooling of electronic devices)“. Applied Thermal Engineering 32 (Januar 2012): 76–82. http://dx.doi.org/10.1016/j.applthermaleng.2011.08.032.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
2

Posobkiewicz, Krzysztof, und Krzysztof Górecki. „Influence of Selected Factors on Thermal Parameters of the Components of Forced Cooling Systems of Electronic Devices“. Electronics 10, Nr. 3 (01.02.2021): 340. http://dx.doi.org/10.3390/electronics10030340.

Der volle Inhalt der Quelle
Annotation:
The paper presents some investigation results on the properties of forced cooling systems dedicated to electronic devices. Different structures of such systems, including Peltier modules, heat sinks, fans, and thermal interfaces, are considered. Compact thermal models of such systems are formulated. These models take into account a multipath heat transfer and make it possible to compute waveforms of the device’s internal temperature at selected values of the power dissipated in the device. The analytical formulas describing the dependences of the thermal resistance of electronic devices co-operating with the considered cooling systems on the power dissipated in the cooled electronic device and the power feeding the Peltier module and the speed of airflow caused by a fan are proposed. The correctness of the proposed models is verified experimentally in a wide range of powers dissipated in electronic devices operating in different configurations of the used cooling system.
APA, Harvard, Vancouver, ISO und andere Zitierweisen
3

NAKAYAMA, Wataru. „Cooling of Electronic Devices“. Journal of the Society of Mechanical Engineers 88, Nr. 802 (1985): 1048–53. http://dx.doi.org/10.1299/jsmemag.88.802_1048.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
4

Joshi, Yogendra. „Heat Out of Small Packages“. Mechanical Engineering 123, Nr. 12 (01.12.2001): 56–58. http://dx.doi.org/10.1115/1.2001-dec-5.

Der volle Inhalt der Quelle
Annotation:
Compact cooling devices are taking shape to deal with the next generation of computer chips. One of the research projects, conducted at the University of Maryland under initial sponsorship from several private companies and federal government laboratories, studied liquid cooling. In order to avoid the design complexities associated with direct liquid cooling, and to make the device of near-term applicability to systems designers, the research team at Maryland decided to use indirect liquid cooling. The university researchers focused on the use of two phase thermosyphons to meet these requirements. Researchers conceptualized a two-chamber, closed-loop device with an evaporator chamber at the chip and a condenser some distance away connected through tubing. The working fluid tested in laboratory experiments was the dielectric coolant PF 5060 made by 3M Co. The University of Maryland and Hewlett-Packard team selected two test beds to evaluate the performance and ease of integration of these devices within existing high-performance computing systems.
APA, Harvard, Vancouver, ISO und andere Zitierweisen
5

Mertens, Robert G., Louis Chow, Kalpathy B. Sundaram, R. Brian Cregger, Daniel P. Rini, Louis Turek und Benjamin A. Saarloos. „Spray Cooling of IGBT Devices“. Journal of Electronic Packaging 129, Nr. 3 (18.05.2007): 316–23. http://dx.doi.org/10.1115/1.2753937.

Der volle Inhalt der Quelle
Annotation:
The popularity and increased usage of insulated gate bipolar transistors (IGBTs) in power control systems have made the problem of cooling them a subject of considerable interest in recent years. In this investigation, a heat flux of 825W∕cm2 at the die was achieved when air-water spray cooling was used to cool IGBTs at high current levels. The junction temperature of the device was measured accurately through voltage-to-temperature characterization. Results from other cooling technologies and other spray cooling experiments were reviewed. A discussion of electrical power losses in IGBTs, due to switching and conduction, is included in this paper. Experiments were conducted on 19 IGBTs, using data collection and software control of the test set. Three types of cooling were explored in this investigation: single-phase convection with water, spray cooling with air-water and spray cooling with steam-water. The results of these experiments show clear advantages of air-water spray cooling IGBTs over other cooling technologies. The applications of spray cooling IGBTs are discussed in open (fixed) and closed (mobile) systems. Current and heat flux levels achieved during this investigation could not have been done using ordinary cooling methods. The techniques used in this investigation clearly demonstrate the superior cooling performance of air-water spray cooling over traditional cooling methods.
APA, Harvard, Vancouver, ISO und andere Zitierweisen
6

Das, Anupam, Aarti Sarda und Abhishek De. „Cooling devices in laser therapy“. Journal of Cutaneous and Aesthetic Surgery 9, Nr. 4 (2016): 215. http://dx.doi.org/10.4103/0974-2077.197028.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
7

Lorenz, Susanne, Ulrich Hohenleutner und Michael Landthaler. „Cooling Devices in Laser Therapy“. Medical Laser Application 16, Nr. 4 (Januar 2001): 283–91. http://dx.doi.org/10.1078/1615-1615-00033.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
8

Zebarjadi, M. „Electronic cooling using thermoelectric devices“. Applied Physics Letters 106, Nr. 20 (18.05.2015): 203506. http://dx.doi.org/10.1063/1.4921457.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
9

Xu, Shanglong, Weijie Wang, Zongkun Guo, Xinglong Hu und Wei Guo. „A multi-channel cooling system for multiple heat source“. Thermal Science 20, Nr. 6 (2016): 1991–2000. http://dx.doi.org/10.2298/tsci140313123x.

Der volle Inhalt der Quelle
Annotation:
High-power electronic devices with multiple heating elements often require temperature uniformity and operating within their functional temperature range for optimal performance. A multi-channel cooling experiment apparatus is developed for studying heat removal inside an electronic device with multiple heat sources. It mainly consists of a computer-controlled pump, a multi-channel heat sink for multi-zone cooling and the apparatus for measuring the temperature and pressure drop. The experimental results show the system and the designed multi-channel heat sink structure can control temperature distribution of electronic device with multiple heat sources by altering coolant flow rate.
APA, Harvard, Vancouver, ISO und andere Zitierweisen
10

Siricharoenpanich, A., S. Wiriyasart, A. Srichat und P. Naphon. „Thermal cooling system with Ag/Fe3O4 nanofluids mixture as coolant for electronic devices cooling“. Case Studies in Thermal Engineering 20 (August 2020): 100641. http://dx.doi.org/10.1016/j.csite.2020.100641.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
Mehr Quellen

Dissertationen zum Thema "Cooling Devices"

1

Khanniche, M. S. „Phase change cooling of power semiconductor devices“. Thesis, Swansea University, 1985. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.669698.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
2

Luu, Trang(Trang N. ). „Impact of surface area and porosity on the cooling performance of evaporative cooling devices“. Thesis, Massachusetts Institute of Technology, 2020. https://hdl.handle.net/1721.1/129010.

Der volle Inhalt der Quelle
Annotation:
Thesis: S.M., Massachusetts Institute of Technology, Department of Mechanical Engineering, September, 2020
Cataloged from student-submitted PDF version of thesis.
Includes bibliographical references (pages 110-111).
Evaporative cooling devices are low-cost, low-energy solutions for post-harvest storage of fruits and vegetables on farmlands. Surface area and porosity are two design parameters that affect the cooling devices' evaporation rate and cooling performance. Both design parameters lack prior systematic testing that methodically varies levels of surface area and material porosity to understand their effects on these devices' cooling performance (e.g. maximum temperature drop, duration of high internal relative humidity, cooling efficiency and total cooling). For fruits and vegetables, storage environments with low temperature and high humidity are critical to reduce deterioration. In this thesis, ridges were cut into the outer wall of pot-in-pot evaporative cooling devices at four different interridge distances to vary total available surface area. Sawdust was added to clay in different ratios to create devices with varying porosity.
A new performance metric of total cooling is also introduced to account for the maximum temperature drop and the total duration of evaporative cooling. The surface area experiments reveal that adding corrugations on the surface introduces competing effects between increased surface area for water evaporation and decreased vapor concentration gradient inside of the corrugations' troughs; consequently, among the devices with corrugations, the amount of total surface area does not always correlate with cooling performance. Between the devices with some surface corrugation and the device without corrugation, the devices with corrugation do consistently achieve greater temperature drops. However, the devices with corrugation are unable to maintain temperature drops and high levels of internal relative humidity for as long as the device without corrugation. The porosity experiments conclude that the greater the porosity in the device's outer vessel, the greater the maximum temperature drop.
This is due to the reduced transport resistance during water and moisture movement to the device's surface. Higher percentages of porosity lead to faster evaporation rates which deplete the amount of water inside the devices quicker and explain why the temperature drops and internal relative humidity of the more porous devices do not last as long as the temperature drops and internal relative humidity of the less porous devices. This thesis investigates two design parameters of cooling devices and shows that increasing surface area and porosity increases maximum temperature drops but decreases both the duration of temperature drops and high internal relative humidity. Between the two design parameters, increasing porosity is the more practical and less burdensome solution to improve the overall performance of evaporative cooling devices for low-resource communities.
by Trang Luu.
S.M.
S.M. Massachusetts Institute of Technology, Department of Mechanical Engineering
APA, Harvard, Vancouver, ISO und andere Zitierweisen
3

Townsend, Christopher G. „Laser cooling and trapping of atoms“. Thesis, University of Oxford, 1995. http://ora.ox.ac.uk/objects/uuid:6a3d235b-22da-412b-b34b-e064322336d5.

Der volle Inhalt der Quelle
Annotation:
A detailed experimental and theoretical investigation of a magneto-optical trap for caesium atoms is presented. Particular emphasis has been placed on achieving high spatial number densities and low temperatures. Optimizing both of these together enables efficient evaporative cooling from a conservative trap, a procedure which has recently led to the first observations of Bose-Einstein condensation in a dilute atomic vapour. The behaviour of a magneto-optical trap is nominally determined by four independent parameters: the detuning and intensity of the light field, the magnetic field gradient and the number of trapped atoms. A model is presented which incorporates previous treatments into a single description of the trap that encompasses a wide range of its behaviour. This model was tested quantitatively by measuring the temperature of the cloud and its spatial distribution as a function of the four parameters. The maximum density was found to be limited both by the reabsorption of photons scattered within the cloud and by a reduction of the confining force at small light shifts. The nonlinear variation with position of the restoring force was found to be significant in limiting the number of atoms confined to a high density. A maximum density in phase space (defined as the number of atoms in a box with sides of dimension one thermal de Broglie wavelength) of (1.5 ± 0.5) x 10-5 was observed, with a spatial density of 1.5 x 1011 atoms per cm3. Cold collision losses from a caesium magneto-optical trap have been studied with the purpose of assessing their influence on spatial densities. In contrast to previous measurements of similar quantities, these measurements did not require the use of an ultra-low (< 10-10 Torr) background vapour pressure. The dependence of the cold collision loss coefficient β on the trapping intensity was measured to permit identification of the different cold collision processes. The largest loss rates observed were those due to hyperfine structure-changing collisions, with a coefficient β = (2±1) x 10-10cm3s-1. A study is presented of a modified magneto-optical trap in which a fraction of the population is shelved into a hyperfine level that does not interact with the trapping light. In this so-called "dark" magneto-optical trap, improved densities of nearly 1012cm-3 have been previously reported for sodium. The application of the technique to caesium is not straightforward due to the larger excited state hyperfine splittings. A simple theory for caesium is presented and its main predictions verified by measurements of density, number and temperature. A density of nearly 1012cm,-3 was indeed obtained but at a temperature substantially higher than in the conventional magneto-optical trap.
APA, Harvard, Vancouver, ISO und andere Zitierweisen
4

Gerty, Donavon R. „Fluidic driven cooling of electronic hardware“. Diss., Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/31722.

Der volle Inhalt der Quelle
Annotation:
Thesis (Ph.D)--Mechanical Engineering, Georgia Institute of Technology, 2009.
Committee Chair: Glezer, Ari; Committee Member: Alben, Silas; Committee Member: Joshi, Yogendra; Committee Member: Smith, Marc; Committee Member: Webster, Donald. Part of the SMARTech Electronic Thesis and Dissertation Collection.
APA, Harvard, Vancouver, ISO und andere Zitierweisen
5

Wei, Xiaojin. „Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronics Devices“. Diss., Georgia Institute of Technology, 2004. http://hdl.handle.net/1853/4873.

Der volle Inhalt der Quelle
Annotation:
A stacked microchannel heat sink was developed to provide efficient cooling for microelectronics devices at a relatively low pressure drop while maintaining chip temperature uniformity. Microfabrication techniques were employed to fabricate the stacked microchannel structure, and experiments were conducted to study its thermal performance. A total thermal resistance of less than 0.1 K/W was demonstrated for both counter flow and parallel flow configurations. The effects of flow direction and interlayer flow rate ratio were investigated. It was found that for the low flow rate range the parallel flow arrangement results in a better overall thermal performance than the counter flow arrangement; whereas, for the large flow rate range, the total thermal resistances for both the counter flow and parallel flow configurations are indistinguishable. On the other hand, the counter flow arrangement provides better temperature uniformity for the entire flow rate range tested. The effects of localized heating on the overall thermal performance were examined by selectively applying electrical power to the heaters. Numerical simulations were conducted to study the conjugate heat transfer inside the stacked microchannels. Negative heat flux conditions were found near the outlets of the microchannels for the counter flow arrangement. This is particularly evident for small flow rates. The numerical results clearly explain why the total thermal resistance for counter flow arrangement is larger than that for the parallel flow at low flow rates. In addition, laminar flow inside the microchannels were characterized using Micro-PIV techniques. Microchannels of different width were fabricated in silicon, the smallest channel measuring 34 mm in width. Measurements were conducted at various channel depths. Measured velocity profiles at these depths were found to be in reasonable agreement with laminar flow theory. Micro-PIV measurement found that the maximum velocity is shifted significantly towards the top of the microchannels due to the sidewall slope, a common issue faced with DRIE etching. Numerical simulations were conducted to investigate the effects of the sidewall slope on the flow and heat transfer. The results show that the effects of large sidewall slope on heat transfer are significant; whereas, the effects on pressure drop are not as pronounced.
APA, Harvard, Vancouver, ISO und andere Zitierweisen
6

Sullivan, Owen A. „Embedded thermoelectric devices for on-chip cooling and power generation“. Thesis, Georgia Institute of Technology, 2012. http://hdl.handle.net/1853/45867.

Der volle Inhalt der Quelle
Annotation:
Thermoelectric devices are capable of providing both localized active cooling and waste heat power generation. This work will explore the possibility of embedding thermoelectric devices within electronic packaging in order to achieve better system performance. Intel and Nextreme, Inc. have produced thin-film superlattice thermoelectric devices that have above average performance for thermoelectrics and are much thinner than most devices on the market currently. This allows them to be packaged inside of the electronic package where the thermoelectric devices can take advantage of the increased temperatures and decreased thermal lag as compared to the devices being planted on the outside of the package. This work uses the numerical CFD solver FLUENT and the analog electronic circuit simulator SPICE to simulate activity of thermoelectric devices within an electronics package.
APA, Harvard, Vancouver, ISO und andere Zitierweisen
7

Murphy, K. F. „Investigation of self-cooling devices for beverage and food containers“. Thesis, University of Nottingham, 2002. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.407004.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
8

Parthasarathy, Swarrnna Karthik. „Energy efficient active cooling of integrated circuits using embedded thermoelectric devices“. Thesis, Georgia Institute of Technology, 2014. http://hdl.handle.net/1853/53047.

Der volle Inhalt der Quelle
Annotation:
With technology scaling, the amount of transistors on a single chip doubles itself every 18 months giving rise to increased power density levels. This has directly lead to a rapid increase of thermal induced issues on a chip and effective methodologies of removing the heat from the system has become the order of the day. Thermoelectric (TE) devices have shown promise for on-demand cooling of ICs. However, the additional energy required for cooling remains a challenge for the successful deployment of these devices. This thesis presents a closed loop control system that dynamically switches a TE module between Peltier and Seebeck modes depending on chip temperature. The autonomous system harvests energy during regular operation and uses the harvested energy to cool during high power operation. The system is demonstrated using a commercial thin-film TE device, an integrated boost regulator and few off chip components. The feasibility of the integration of the TEM and the automated mode switching within the microprocessor package is also evaluated. With continuous usage of thermoelectric modules, it starts to degrade over time due to thermal and mechanical induced stress which in turn reduces the cooling performance over time. Impact of thermal cycling on thermoelectric cooling performance over time is evaluated using the developed full chip package model.
APA, Harvard, Vancouver, ISO und andere Zitierweisen
9

Taylor, Robert A. „Comprehensive optimization for thermoelectric refrigeration devices“. Diss., Columbia, Mo. : University of Missouri-Columbia, 2005. http://hdl.handle.net/10355/4247.

Der volle Inhalt der Quelle
Annotation:
Thesis (M.S.)--University of Missouri-Columbia, 2005.
The entire dissertation/thesis text is included in the research.pdf file; the official abstract appears in the short.pdf file (which also appears in the research.pdf); a non-technical general description, or public abstract, appears in the public.pdf file. Title from title screen of research.pdf file viewed on (December 20, 2006) Includes bibliographical references.
APA, Harvard, Vancouver, ISO und andere Zitierweisen
10

Hopkins, Stephen Antony. „Laser cooling of rubidium atoms in a magneto-optical trap“. n.p, 1995. http://oro.open.ac.uk/19431/.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
Mehr Quellen

Bücher zum Thema "Cooling Devices"

1

Jones, Alexander Thomas. Cooling Electrons in Nanoelectronic Devices by On-Chip Demagnetisation. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-51233-0.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
2

A, Wirtz R., Lehmann G. L und American Society of Mechanical Engineers. Heat Transfer Division., Hrsg. Thermal modeling and design of electronic systems and devices: Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Dallas, Texas, November 25-30, 1990. New York, N.Y: American Society of Mechanical Engineers, 1990.

Den vollen Inhalt der Quelle finden
APA, Harvard, Vancouver, ISO und andere Zitierweisen
3

Kuznecov, Vyacheslav, und Oleg Bryuhanov. Gasified boiler units. ru: INFRA-M Academic Publishing LLC., 2021. http://dx.doi.org/10.12737/1003548.

Der volle Inhalt der Quelle
Annotation:
The textbook gives the basic concepts of gasified heat generating (boiler) installations and the terminology used in boiler technology, the principle of operation and device of gasified heat generating (boiler) installations. The types and device of heat generators (boilers) of their furnace devices are considered; types and device of gas-burning devices, the number and places of their installation in furnace devices; auxiliary equipment-devices for air supply and removal of combustion products, devices for water treatment, steam supply and circulation of the coolant of hot water boilers; device for thermal control and automatic regulation of the boiler installation. The issues of operation and efficiency of gasified heat generating (boiler) installations and their gas supply systems; requirements for conducting gas-hazardous and emergency recovery operations of gas supply systems are considered. Meets the requirements of the federal state educational standards of secondary vocational education of the latest generation. For students of secondary vocational education in the specialty 08.02.08 "Installation and operation of equipment and gas supply systems".
APA, Harvard, Vancouver, ISO und andere Zitierweisen
4

(Firm), IT Watchdogs, Hrsg. Server room climate & power monitoring: How to protect computer equipment against damage & downtime using low-cost, Web-based devices. Austin, TX: IT Watchdogs, Inc., 2006.

Den vollen Inhalt der Quelle finden
APA, Harvard, Vancouver, ISO und andere Zitierweisen
5

Abbas, T. Displacement Ventilation and Static Cooling Devices (COP 17/99). BSRIA, 1999.

Den vollen Inhalt der Quelle finden
APA, Harvard, Vancouver, ISO und andere Zitierweisen
6

Incropera, Frank P. Liquid Cooling of Electronic Devices by Single-Phase Convection. Wiley-Interscience, 1999.

Den vollen Inhalt der Quelle finden
APA, Harvard, Vancouver, ISO und andere Zitierweisen
7

Jones, Alexander Thomas. Cooling Electrons in Nanoelectronic Devices by On-Chip Demagnetisation. Springer, 2020.

Den vollen Inhalt der Quelle finden
APA, Harvard, Vancouver, ISO und andere Zitierweisen
8

F, Goldman Ralph, und Risk Reduction Engineering Laboratory (U.S.), Hrsg. Evaluation of personal cooling devices for a dioxin clean-up operation. Cincinnati, OH: Risk Reduction Engineering Laboratory, Office of Research and Development, U.S. Environmental Protection Agency, 1988.

Den vollen Inhalt der Quelle finden
APA, Harvard, Vancouver, ISO und andere Zitierweisen
9

United States. National Aeronautics and Space Administration., Hrsg. Numerical comparison of convective heat transfer augmentation devices used in cooling channels of hypersonic vehicles. [Washington, DC]: National Aeronautics and Space Administration, 1994.

Den vollen Inhalt der Quelle finden
APA, Harvard, Vancouver, ISO und andere Zitierweisen
10

United States. National Aeronautics and Space Administration., Hrsg. Numerical comparison of convective heat transfer augmentation devices used in cooling channels of hypersonic vehicles. [Washington, DC]: National Aeronautics and Space Administration, 1994.

Den vollen Inhalt der Quelle finden
APA, Harvard, Vancouver, ISO und andere Zitierweisen
Mehr Quellen

Buchteile zum Thema "Cooling Devices"

1

Kleinstreuer, Clement, und Jie Li. „Microscale Cooling Devices“. In Encyclopedia of Microfluidics and Nanofluidics, 2158–73. New York, NY: Springer New York, 2015. http://dx.doi.org/10.1007/978-1-4614-5491-5_1008.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
2

Kleinstreuer, Clement, und Jie Li. „Microscale Cooling Devices“. In Encyclopedia of Microfluidics and Nanofluidics, 1–18. Boston, MA: Springer US, 2011. http://dx.doi.org/10.1007/978-3-642-27758-0_1008-1.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
3

Thadela, Sudheer, und Raja Sekhar Dondapati. „Cryogenic Cooling Strategies“. In High-Temperature Superconducting Devices for Energy Applications, 21–66. First edition. | Boca Raton, FL : CRC Press, 2021.: CRC Press, 2020. http://dx.doi.org/10.1201/9781003045304-2.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
4

Suchaneck, Gunnar, und Gerald Gerlach. „Thin Films for Electrocaloric Cooling Devices“. In Recent Advances in Thin Films, 369–88. Singapore: Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-15-6116-0_12.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
5

Williams, B. W. „Cooling of Power Switching Semiconductor Devices“. In Power Electronics, 90–110. London: Macmillan Education UK, 1987. http://dx.doi.org/10.1007/978-1-349-18525-2_5.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
6

Tong, Xingcun Colin. „Liquid Cooling Devices and Their Materials Selection“. In Advanced Materials for Thermal Management of Electronic Packaging, 421–75. New York, NY: Springer New York, 2010. http://dx.doi.org/10.1007/978-1-4419-7759-5_10.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
7

Heumann, Klemens. „Snubber Circuits, Triggering, Cooling, and Protection Devices“. In Basic Principles of Power Electronics, 36–61. Berlin, Heidelberg: Springer Berlin Heidelberg, 1986. http://dx.doi.org/10.1007/978-3-642-82674-0_4.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
8

Kohri, Hitoshi, und Ichiro Shiota. „Development of Thermoelectric Cooling Devices with Graded Structure“. In Functionally Graded Materials VIII, 151–56. Stafa: Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/0-87849-970-9.151.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
9

Straub, J., J. Winter, G. Picker und M. Zell. „Cooling of small electronic devices by boiling under microgravity“. In Dynamics of Multiphase Flows Across Interfaces, 134–49. Berlin, Heidelberg: Springer Berlin Heidelberg, 1996. http://dx.doi.org/10.1007/bfb0102667.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
10

Jones, Alexander Thomas. „On-Chip Demagnetisation Cooling of a High Capacitance CBT“. In Cooling Electrons in Nanoelectronic Devices by On-Chip Demagnetisation, 71–89. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-51233-0_5.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen

Konferenzberichte zum Thema "Cooling Devices"

1

LaBounty, Christopher J., Ali Shakouri, Patrick Abraham und John E. Bowers. „Integrated cooling for optoelectronic devices“. In Symposium on Integrated Optoelectronics, herausgegeben von Yoon-Soo Park und Ray T. Chen. SPIE, 2000. http://dx.doi.org/10.1117/12.382148.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
2

Yang, X. D. „HIRFL-CSR electron cooling devices“. In CYCLOCTRONS AND THEIR APPLICATIONS 2001: Sixteenth International Conference. AIP, 2001. http://dx.doi.org/10.1063/1.1435230.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
3

Stintz, Andreas, Richard I. Epstein, Mansoor Sheik-Bahae, Kevin J. Malloy, Michael P. Hasselbeck und Stephen T. P. Boyd. „Nanogap experiments for laser cooling“. In Integrated Optoelectronic Devices 2008, herausgegeben von Richard I. Epstein und Mansoor Sheik-Bahae. SPIE, 2008. http://dx.doi.org/10.1117/12.761962.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
4

Kerwin, Michael, Christopher Bascomb und John Culver. „Infantry Soldier Cooling“. In ASME 2017 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/imece2017-70086.

Der volle Inhalt der Quelle
Annotation:
This report discusses the design problem of developing an air-based cooling system for an infantry soldier. The background explores the different designs that already exist as well as specific parts and materials that will be essential to the design process. Currently, liquid-based cooling systems are the most explored types of cooling devices. However, there are specific downsides to this type of cooling device. As opposed to an air-based system, water requires more energy to be cooled, and therefore more battery power. The liquid-based system is also relatively bulky and heavy due to battery size and the water that runs through the system. With air-based cooling systems, efficient cooling is possible. An air-based cooling system was tested in a laboratory and field environment. In a humid environment, a desiccant attachment can improve the cooling device’s effectiveness. The cooling design effectively reduces the wearer’s core body temperature through evaporative cooling. The design evaporates a significant amount of sweat from wearer’s back and torso. While the prototype can be improved, evaporative cooling is an effective cooling solution for Soldiers.
APA, Harvard, Vancouver, ISO und andere Zitierweisen
5

Lee, Youngmoon, Eugene Kim und Kang G. Shin. „Efficient thermoelectric cooling for mobile devices“. In 2017 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED). IEEE, 2017. http://dx.doi.org/10.1109/islped.2017.8009199.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
6

Webb, Ralph L. „Next Generation Devices for Electronic Cooling“. In ASME 2003 International Mechanical Engineering Congress and Exposition. ASMEDC, 2003. http://dx.doi.org/10.1115/imece2003-42179.

Der volle Inhalt der Quelle
Annotation:
Conventional technology to cool desktop computers and servers is that of the “direct heat removal” heat sink, which consists of a heat sink/fan mounted on the CPU. Although this is a very cost effective solution, it is nearing its end of life. This is because future higher power CPUs will require a lower R-value than can be provided by this technology, within current size and fan limits. This paper discusses new technology that uses “indirect heat removal” technology, which involves use of a single or two-phase working fluid to transfer heat from the hot source to an ambient heat sink. This technology will support greater heat rejection than is possible with the “direct heat removal” method. Further, it will allow use of higher performance air-cooled ambient heat sinks than are possible with the “direct heat removal” heat sink. A concern of the indirect heat removal technology is the possibility that it may be orientation sensitive. This paper identifies preferred options and discusses the degree to which they are (or or not) orientation sensitive. It should be possible to attain an R-value of 0.12K/W at the balance point on the fan curve.
APA, Harvard, Vancouver, ISO und andere Zitierweisen
7

Zebarjadi, Mona. „Thermoelectric devices for electronic cooling applications“. In Proceedings of CHT-15. 6th International Symposium on ADVANCES IN COMPUTATIONAL HEAT TRANSFER , May 25-29, 2015, Rutgers University, New Brunswick, NJ, USA. Connecticut: Begellhouse, 2015. http://dx.doi.org/10.1615/ichmt.2015.intsympadvcomputheattransf.1830.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
8

Sheik-Bahae, M., B. Imangholi, M. P. Hasselbeck, R. I. Epstein und S. Kurtz. „Advances in laser cooling of semiconductors“. In Integrated Optoelectronic Devices 2006, herausgegeben von Marek Osinski, Fritz Henneberger und Yasuhiko Arakawa. SPIE, 2006. http://dx.doi.org/10.1117/12.644915.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
9

Quan, Dongliang, Songling Liu, Jianghai Li und Gaowen Liu. „Investigation on Cooling Performance of Impingement Cooling Devices Combined With Pins“. In ASME Turbo Expo 2005: Power for Land, Sea, and Air. ASMEDC, 2005. http://dx.doi.org/10.1115/gt2005-68930.

Der volle Inhalt der Quelle
Annotation:
Integrated impingement and pin fin cooling devices have comprehensive advantages of hot-side film cooling, internal impingement cooling, large internal heat transfer area and enhanced heat exchange caused by the pin fin arrays, so it is considered a promising cooling concept to meet the requirements of modern advanced aircraft engines. In this paper, experimental study, one dimensional model analysis and numerical simulation were conducted to investigate cooling performance of this kind of cooling device. A typical configuration specimen was made and tested in a large scale low speed closed-looped wind tunnel. The cooling effectiveness was measured by an infrared thermography technique. The target surface was coated carefully with a high quality black paint to keep a uniform high emissivity condition. The measurements were calibrated with thermocouples welded on the surface. Detailed two-dimensional contour maps of the temperature and cooling effectiveness were obtained for different pressure ratios and therefore different coolant flow-rates through the tested specimen. The experimental results showed that very high cooling effectiveness can be achieved by this cooling device with relatively small amount of coolant flow. Based on the theory of transpiration cooling in porous material, a one dimensional heat transfer model was established to analyze the effect of various parameters on the cooling effectiveness. The required resistance and internal heat transfer characteristics were obtained from experiments. It was found from this model that the variation of heat transfer on the gas side, including heat transfer coefficient and film cooling effectiveness, of the specimen created much more effect on its cooling effectiveness than that of the coolant side. The heat transfer intensities inside the specimen played an important role in the performance of cooling. In the last part of this paper, a conjugate numerical simulation was carried out using commercial software FLUENT 6.1. The domain of the numerical simulation included the specimen and the coolant. Detailed temperature contours of the specimen were obtained for various heat transfer boundary conditions. The calculated flow resistance and cooling effectiveness agree well with the experimental data and the predictions with the one-dimensional analysis model. The numerical simulations reveal that the impingement of the coolant jets in the specimen is the main contribution to the high cooling effectiveness.
APA, Harvard, Vancouver, ISO und andere Zitierweisen
10

Dogonkin, Eugen B., und Georgy G. Zegrya. „Current-induced cooling of quantum systems“. In Symposium on Integrated Optoelectronic Devices, herausgegeben von Jerry R. Meyer und Claire F. Gmachl. SPIE, 2002. http://dx.doi.org/10.1117/12.467956.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen

Berichte der Organisationen zum Thema "Cooling Devices"

1

Kenny, Thomas, und Theodore H. Geballe. Thermionic Cooling Devices. Fort Belvoir, VA: Defense Technical Information Center, August 2000. http://dx.doi.org/10.21236/ada380668.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
2

LaBounty, Christopher, Ali Shakouri, Patrick Abraham und John E. Bowers. Integrated Cooling for Optoelectronic Devices. Fort Belvoir, VA: Defense Technical Information Center, Januar 2000. http://dx.doi.org/10.21236/ada459476.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
3

Wiltsee, G. Heat-activated cooling devices: A guidebook for general audiences. Office of Scientific and Technical Information (OSTI), Februar 1994. http://dx.doi.org/10.2172/10190288.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
4

Tang, Hong, und Chee-Wei Wong. (DARPA) Optical Radiation Cooling and Heating In Integrated Devices: Circuit cavity optomechanics for cooling and amplification on a silicon chip. Fort Belvoir, VA: Defense Technical Information Center, Juli 2015. http://dx.doi.org/10.21236/ada626747.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
5

Overmyer, Donald L., Webb, Edmund Blackburn, III (,, ), Michael P. Siegal und William Graham Yelton. Electroforming of Bi(1-x)Sb(x) nanowires for high-efficiency micro-thermoelectric cooling devices on a chip. Office of Scientific and Technical Information (OSTI), November 2006. http://dx.doi.org/10.2172/899368.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
6

Balldin, Ulf, Jeff Whitmore, Richard Harrison, Dion Fisher, Joseph Fischer und Roger Stork. The Effects of a Palm Cooling Device and a Cooling Vest During Simulated Pilot Heat Stress. Fort Belvoir, VA: Defense Technical Information Center, Januar 2007. http://dx.doi.org/10.21236/ada470115.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
7

Ang, Simon S., Paneer Selvam, Ajay Malshe und Fred Barlow. A Micromachined Microjet Array Impingement Cooling Device for High Power Electronics. Fort Belvoir, VA: Defense Technical Information Center, Mai 2004. http://dx.doi.org/10.21236/ada425124.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
8

Cui, Jun, Duane D. Johnson, Vitalij K. Pecharsky, Ichiro Takeuchi und Qiming Zhang. Advancing Caloric Materials for Efficient Cooling: Key Scientific and Device-Related Materials Challenges for Impact. Ames (Iowa): Iowa State University. Library, Dezember 2015. http://dx.doi.org/10.31274/mse_reports-20191113-1.

Der volle Inhalt der Quelle
APA, Harvard, Vancouver, ISO und andere Zitierweisen
Die Auswahlen zum Thema "Cooling Devices" für konkrete Quellenarten können Sie auch interessieren:
Zeitschriftenartikel Dissertationen Bücher
Wir bieten Rabatte auf alle Premium-Pläne für Autoren, deren Werke in thematische Literatursammlungen aufgenommen wurden. Kontaktieren Sie uns, um einen einzigartigen Promo-Code zu erhalten!

Zur Bibliographie