Auswahl der wissenschaftlichen Literatur zum Thema „Circuits imprimés – Simulation par ordinateur“
Geben Sie eine Quelle nach APA, MLA, Chicago, Harvard und anderen Zitierweisen an
Inhaltsverzeichnis
Machen Sie sich mit den Listen der aktuellen Artikel, Bücher, Dissertationen, Berichten und anderer wissenschaftlichen Quellen zum Thema "Circuits imprimés – Simulation par ordinateur" bekannt.
Neben jedem Werk im Literaturverzeichnis ist die Option "Zur Bibliographie hinzufügen" verfügbar. Nutzen Sie sie, wird Ihre bibliographische Angabe des gewählten Werkes nach der nötigen Zitierweise (APA, MLA, Harvard, Chicago, Vancouver usw.) automatisch gestaltet.
Sie können auch den vollen Text der wissenschaftlichen Publikation im PDF-Format herunterladen und eine Online-Annotation der Arbeit lesen, wenn die relevanten Parameter in den Metadaten verfügbar sind.
Dissertationen zum Thema "Circuits imprimés – Simulation par ordinateur"
Atintoh, Ange. „Modélisation thermomécanique 3D de circuits imprimés“. Electronic Thesis or Diss., Université de Lorraine, 2023. http://www.theses.fr/2023LORR0123.
Der volle Inhalt der QuelleThe rapid changes in the industry and the increasing integration of electronics in new environments require the control of the reliability of electronic boards. The integration of electronics in severe environments within the MAPP platform (Mechatronics for the Improvement of Products and Processes) of CEA Tech Grand Est deal with this problem. In these environments, defects such as delamination and via cracking can occur in printed circuit boards (PCB). From this perspective, this thesis proposes a contribution to creating a numerical tool to prevent these defects. For a realistic modeling, the thermomechanical characterization of the different layers of the PCB has been performed through experimental tests. Nevertheless, this characterization was incomplete because of the thinness of the PCB, which motivated the implementation of a multi-scale method. An inverse method based on Mechanics of Structure Genome (MSG) was developed and implemented as a Python script. Microscopic observations were coupled to Gmsh software to create the microscopic model and then to TexGen modeling software for the mesoscopic model. The presence of inclusions inside the matrix between the yarns was confirmed by nanoindentation. The influence of yarns' geometrical parameters and phase properties was analyzed. Adapting a hybrid optimization method was implemented to minimize the discrepancies between the experimental and numerical properties. Obtained results were used to simulate the behavior of an electronic board in operation using ABAQUS/Standard finite element software. Thermomechanical tests at the board scale were implemented to validate the simulations. The comparison shows good agreement between results as predicted by both numerical and experimental approaches. The mechanical field analysis showed contrasts that could lead to thermomechanical fatigue. Nevertheless, delamination tests to feed cohesive zones at the interfaces between layers were not performed due to the small thickness
Bazzoli, Sébastien. „Caractérisation et simulation de la susceptibilité des circuits intégrés face aux risques d'inductions engendrées par des micro-ondes de forte puissance“. Lille 1, 2005. https://pepite-depot.univ-lille.fr/LIBRE/Th_Num/2005/50376-2005-Bazzoli.pdf.
Der volle Inhalt der QuelleEgot, Stéphane. „Intégration des équipements électroniques dans la modélisation de l'architecture électrique des véhicules automobiles : application à la prédiction de compatibilité électromagnétique dans les phases amont de la conception“. Lille 1, 2005. http://www.theses.fr/2005LIL10151.
Der volle Inhalt der QuelleThis thesis deals with the elaboration and the evaluation of an integration methodology of electronic equipment in the EMC modeling of the electrical architecture in the early design phase of a vehicle. The proposed approach is based on dissociating the equipment modeling into two complementary parts involving the car manufacturer and the elctronic supplier. The feasibility of this modeling technique primarily required ton characterize the interaction between the equipment and the car body. Besides, the different factors having an influence on the validity of the model were examined as well as its needed level of precision. The latter issue was considered by taking into account the globality of the system, especially the variability brought by the random bundling of the cable harness. Finally the proposed method was evaluated by comparing statistical measurement and simulation results obtained on a realistic electronic sub-system
Linot, Fabrice. „Apport des Surfaces à Haute Impédance à la conception d'antennes réseaux compactes et d'antennes réseaux à très large bande passante“. Phd thesis, Télécom ParisTech, 2011. http://pastel.archives-ouvertes.fr/pastel-00617270.
Der volle Inhalt der QuelleBureau, Denis. „Conception de circuits imprimés : vers un compilateur cuivre“. Compiègne, 1989. http://www.theses.fr/1989COMPD227.
Der volle Inhalt der QuelleWe put forth a new concept : a « copper compiler ». This concept is to printed circuit boards what silicon compilers are to integrated circuits. A large part of current PCB design software is now approaching the limits of its capabilities, essentially in terms of efficiency, and printed circuits are becoming as complex as integrated circuits of a few years ago. The development of such a software tool requires an efficient router and an intelligent system to manage all the necessary modules. That’s why this thesis presents, firstly, an original gridless and internally hierarchical router along with a prototype which validates a theoretical model of a printed circuit ; and secondly, a novel software structure which permits the construction of modular expert systems which simultaneously use several types of knowledge representations. Each of these two parts is accompanied by a description of the current state of the art in the field, a comprehensive bibliography and a glossary
Benleulmi, Zoubir. „Contribution à l'inspection automatique des cartes de circuits imprimés par vision artificielle“. Compiègne, 1986. http://www.theses.fr/1986COMPS143.
Der volle Inhalt der QuelleZhang, Xiao Hui. „Simulation avancée des circuits micro-ondes“. Paris 12, 1989. http://www.theses.fr/1989PA120040.
Der volle Inhalt der QuelleLegrand, Fabien. „Modélisation de circuits électrotechniques en vue de leur simulation : réalisation d'un simulateur“. Bordeaux 1, 2004. http://www.theses.fr/2004BOR12790.
Der volle Inhalt der QuelleDubois, Jean-Luc. „L'abstraction fonctionnelle des parties contrôles des circuits pour l'accélération de simulateurs générés : une contribution au développement d'outils de C.A.O. de l'architecture matérielle“. Lille 1, 1991. http://www.theses.fr/1991LIL10037.
Der volle Inhalt der QuelleCrastes, de Paulet Michel Saucier Gabrièle. „Spécification et simulation fonctionnelles de circuits complexes le système CADOC /“. S.l. : Université Grenoble 1, 2008. http://tel.archives-ouvertes.fr/tel-00318467.
Der volle Inhalt der QuelleBücher zum Thema "Circuits imprimés – Simulation par ordinateur"
Saeid, Moslehpour. Circuit simulation and analysis: An introduction to computer-aided circuit design using PSpice software. Newington, CT: American Radio Relay League, 2013.
Den vollen Inhalt der Quelle findenAl-Hashimi, Bashir. The art of simulation using PSpice: Analog and digital. Boca Raton: CRC Press, 1995.
Den vollen Inhalt der Quelle findenRietman, Ed. Experiments in artificial neural networks. Blue Ridge Summit, PA: Tab Books, 1988.
Den vollen Inhalt der Quelle findenAlary. Circuits imprimés en pratique. Dunod, 1999.
Den vollen Inhalt der Quelle findenOgrodzki, Jan. Circuit Simulation Methods and Algorithms. Taylor & Francis Group, 2018.
Den vollen Inhalt der Quelle findenOgrodzki, Jan. Circuit Simulation Methods and Algorithms. Taylor & Francis Group, 2018.
Den vollen Inhalt der Quelle findenOgrodzki, Jan. Circuit Simulation Methods and Algorithms. Taylor & Francis Group, 2018.
Den vollen Inhalt der Quelle findenOgrodzki, Jan. Circuit Simulation Methods and Algorithms. Taylor & Francis Group, 2018.
Den vollen Inhalt der Quelle findenMohindru, Pooja, und Pankaj Mohindru. Electronic Circuit Analysis Using LTSpice XVII Simulator: A Practical Guide for Beginners. Taylor & Francis Group, 2021.
Den vollen Inhalt der Quelle findenMohindru, Pooja, und Pankaj Mohindru. Electronic Circuit Analysis Using LTSpice XVII Simulator: A Practical Guide for Beginners. Taylor & Francis Group, 2021.
Den vollen Inhalt der Quelle findenKonferenzberichte zum Thema "Circuits imprimés – Simulation par ordinateur"
Elmoutawakkil, N., S. Bouzoubaa, S. Bellemkhannate und I. Benyahya. „Flux de travail du guidage tridimensionnel en chirurgie orale“. In 66ème Congrès de la SFCO. Les Ulis, France: EDP Sciences, 2020. http://dx.doi.org/10.1051/sfco/20206602005.
Der volle Inhalt der Quelle