Auswahl der wissenschaftlichen Literatur zum Thema „Characterization techniques for microelectroniq“
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Zeitschriftenartikel zum Thema "Characterization techniques for microelectroniq"
Klymko, N. R., J. A. Casey, L. Tai, J. A. Fitzsimmons und F. Adar. „Role of Raman Microprobe Spectroscopy in the Characterization of Microelectronic Materials“. Microscopy and Microanalysis 7, S2 (August 2001): 150–51. http://dx.doi.org/10.1017/s1431927600026829.
Der volle Inhalt der QuelleBusch, Brett W., Olivier Pluchery, Yves J. Chabal, David A. Muller, Robert L. Opila, J. Raynien Kwo und Eric Garfunkel. „Materials Characterization of Alternative Gate Dielectrics“. MRS Bulletin 27, Nr. 3 (März 2002): 206–11. http://dx.doi.org/10.1557/mrs2002.72.
Der volle Inhalt der QuelleZhou, Shenglin, Zhaohui Yang und Xiaohua Zhang. „Characterization tools of thin polymer films“. International Journal of Modern Physics B 32, Nr. 18 (15.07.2018): 1840007. http://dx.doi.org/10.1142/s0217979218400076.
Der volle Inhalt der QuelleHuang, Zhiheng, Ziyan Liao, Kaiwen Zheng, Xin Zeng, Yuezhong Meng, Hui Yan und Yang Liu. „Microstructural Hierarchy Descriptor Enabling Interpretative AI for Microelectronic Failure Analysis“. EDFA Technical Articles 26, Nr. 2 (01.05.2024): 10–18. http://dx.doi.org/10.31399/asm.edfa.2024-2.p010.
Der volle Inhalt der QuelleMouro, João, Rui Pinto, Paolo Paoletti und Bruno Tiribilli. „Microcantilever: Dynamical Response for Mass Sensing and Fluid Characterization“. Sensors 21, Nr. 1 (27.12.2020): 115. http://dx.doi.org/10.3390/s21010115.
Der volle Inhalt der QuelleMurray, Conal E., A. J. Ying, S. M. Polvino, I. C. Noyan und Z. Cai. „Nanoscale strain characterization in microelectronic materials using X-ray diffraction“. Powder Diffraction 25, Nr. 2 (Juni 2010): 108–13. http://dx.doi.org/10.1154/1.3394205.
Der volle Inhalt der QuelleJansen, K. M. B., V. Gonda, L. J. Ernst, H. J. L. Bressers und G. Q. Zhang. „State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films“. Journal of Electronic Packaging 127, Nr. 4 (22.12.2004): 530–36. http://dx.doi.org/10.1115/1.2070092.
Der volle Inhalt der QuelleGuégan, Hervé. „Use of a Nuclear Microprobe in Electronic Device Characterization“. EDFA Technical Articles 9, Nr. 4 (01.11.2007): 14–19. http://dx.doi.org/10.31399/asm.edfa.2007-4.p014.
Der volle Inhalt der QuelleRuales, Mary, und Kinzy Jones. „Characterization of silicate sensors on Low Temperature Cofire Ceramic (LTCC) substrates using DSC and XRD techniques“. International Symposium on Microelectronics 2012, Nr. 1 (01.01.2012): 000598–603. http://dx.doi.org/10.4071/isom-2012-wa31.
Der volle Inhalt der QuelleNguyen, T. K., L. M. Landsberger, V. Logiudice und C. Jean. „Electrical characterization of fluorine-implanted gate oxide structures“. Canadian Journal of Physics 74, S1 (01.12.1996): 74–78. http://dx.doi.org/10.1139/p96-836.
Der volle Inhalt der QuelleDissertationen zum Thema "Characterization techniques for microelectroniq"
Vavrille, Benjamin. „Développement d'une méthode innovante de mesures des propriétés thermomécaniques de films minces. Application à un dispositif imageur“. Electronic Thesis or Diss., Université Grenoble Alpes, 2023. http://www.theses.fr/2023GRALI126.
Der volle Inhalt der QuellePolymers are very widespread in microelectronics. In addition to their relevant electrical and optical properties for integration, their thermomechanical properties generally exhibit a high contrast with semiconductor substrates, but also with other materials also integrated into microchips, like oxides or metals. This mismatch between materials generally leads to a sharp increase of stresses in the various layers under consideration, which in returns results of a sharp increase in the wafer curvature. Excessive stresses can lead to cracking or delamination, threatening the mechanical integrity of the structure. Knowing the properties of each layer, especially polymer films, enables designers to verify the compatibility of integrated materials and guarantee component reliability. However, to achieve this goal, it is mandatory to develop characterization techniques, especially for thin films deposited on substrates.Thus, the aim of this work is to develop an experimental method to determine the thermomechanical properties of integrated layers, and then to verify the mechanical integrity of microelectronic devices using analytical or numerical simulation tools. This method is based on measuring the variation of curvature during thermal cycles. Then the completion of the polymer cross-linking process can be checked and its temperature of glass transition can be determined. By measuring the thermally induced curvature of two distinct substrates with the same deposited polymer material, the biaxial modulus and the coefficient of thermal expansion of the film are determined. By characterizing a large number of polymers using this technique, we can build up a materials database that can be supplemented with other integrated materials. These data are used in modeling to predict the strain and stress levels of several devices used in microelectronics.In particular, we will study the case of image sensors by performing a predictive calculation of strain and stress distributions of stacks in order to examine the compatibility of different materials. We will also work on the mechanical integrity of these devices, to guarantee their manufacture and reliability over time. We will show that the material selection is eased by structural modeling and a method to study crack initiation and propagation using numerical models
Py, Matthieu. „A study of interfaces and nanostructures by time of flight mass spectrometry : towards a spatially resolved quantitative analysis“. Phd thesis, Université de Grenoble, 2011. http://tel.archives-ouvertes.fr/tel-00721832.
Der volle Inhalt der QuelleNeelamraju, Bharati. „Characterization Techniques for Photonic Materials“. Thesis, The University of Arizona, 2016. http://hdl.handle.net/10150/613403.
Der volle Inhalt der QuelleBosley, Amber L. „Algae Characterization and Processing Techniques“. University of Toledo / OhioLINK, 2011. http://rave.ohiolink.edu/etdc/view?acc_num=toledo1321538296.
Der volle Inhalt der QuelleFRANCO, CAROLINE SOUSA. „GLASS ELECTROTHERMAL POLING AND CHARACTERIZATION TECHNIQUES“. PONTIFÍCIA UNIVERSIDADE CATÓLICA DO RIO DE JANEIRO, 2004. http://www.maxwell.vrac.puc-rio.br/Busca_etds.php?strSecao=resultado&nrSeq=5435@1.
Der volle Inhalt der QuelleERICSSON DO BRASIL
É possível criar uma não-linearidade de segunda ordem em amostras de sílica a partir do processo de polarização. Essas amostras vítreas com o X(2) induzido potencialmente podem ser utilizadas na fabricação de componentes como moduladores ópticos e dobradores de freqüência. O processo de polarização eletrotérmica utiliza alta tensão e alta temperatura e forma uma região de depleção de íons (camada de depleção) onde um campo elétrico intenso é gravado de forma permanente dentro da amostra. Neste trabalho, foram utilizadas diferentes técnicas de caracterização para medir a extensão dessa camada e os resultados foram comparados. As técnicas escolhidas foram: Ataque Químico Interferométrico (com ácido fluorídrico), Maker Fringe, Microscopia Óptica e de Força Atômica e Ataque Interferométrico com Medida de Segundo Harmônico em Tempo Real. Além disso, foram feitos alguns estudos paralelos visando à otimização e a reprodutibilidade do processo de polarização. Foram realizadas dessa forma análises sobre o material dos eletrodos utilizados e sobre a influência da condição inicial da superfície da amostra antes da polarização.
It is possible to create a second order non linearity in silica samples with the poling process. The glass samples with an induced X(2) have a potential application on the fabrication of optical devices such as modulators and frequency converters. In the electrothermal poling process, high voltage and high temperature are applied to the samples forming an ion depleted region (depletion layer), where an intense electric field is permanently recorded. In this work, several characterization techniques have been utilized to measure the width of the depletion layer and compared the obtained results. The chosen techniques were: Interferometric Etching, Maker Fringe, Optical and Atomic Force Microscopy and the Interferometric Etching with Real Time Second Harmonic Measurement. In addition to this, we performed other studies aiming the optimization and reproducibility of the poling process. In this way, we analyzed the material used for the electrodes and the influence of the initial condition of the sample surface before poling.
Damianou, Christakis 1964. „Characterization techniques for contaminated gate oxide“. Thesis, The University of Arizona, 1990. http://hdl.handle.net/10150/278760.
Der volle Inhalt der QuelleStangoni, Maria Virginia. „Scanning probe techniques for dopant profile characterization /“. [S.l.] : [s.n.], 2005. http://e-collection.ethbib.ethz.ch/show?type=diss&nr=16024.
Der volle Inhalt der QuelleXia, Huiyong. „Materials characterization using novel ion beam techniques“. Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1997. http://www.collectionscanada.ca/obj/s4/f2/dsk2/ftp03/NQ28531.pdf.
Der volle Inhalt der QuelleWisell, David. „Measurement Techniques for Characterization of Power Amplifiers“. Doctoral thesis, Stockholm : KTH School of Electrical Engineering, 2007. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-4566.
Der volle Inhalt der QuelleGeorge, Lindsay. „Characterization of Unsaturated Soils Using Acoustic Techniques“. ScholarWorks @ UVM, 2009. http://scholarworks.uvm.edu/graddis/91.
Der volle Inhalt der QuelleBücher zum Thema "Characterization techniques for microelectroniq"
John, Lowell, Chen Ray T, Mathur Jagdish P und Society of Photo-optical Instrumentation Engineers., Hrsg. Optical characterization techniques for high-performance microelectronic device manufacturing II: 25-26 October 1995, Austin, Texas. Bellingham, Wash: SPIE, 1995.
Den vollen Inhalt der Quelle findenDamon, DeBusk, Ajuria Sergio, Society of Photo-optical Instrumentation Engineers., Semiconductor Equipment and Materials International., Solid State Technology (Organization) und Electrochemical Society, Hrsg. In-line characterization techniques for performance and yield enhancement in microelectronic manufacturing: 1-2 October 1997, Austin, Texas. Bellingham, Wash., USA: SPIE, 1997.
Den vollen Inhalt der Quelle findenSergio, Ajuria, Hossain Tim Z, Society of Photo-optical Instrumentation Engineers. und Solid State Technology (Organization), Hrsg. In-line characterization techniques for performance and yield enhancement in microelectronic manufacturing II: 23-24 September, 1998, Santa Clara, California. Bellingham, Washington: SPIE, 1998.
Den vollen Inhalt der Quelle findenMaliva, Robert G. Aquifer Characterization Techniques. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-32137-0.
Der volle Inhalt der QuelleCampbell, D. Polymer characterization: Physical techniques. London: Chapman and Hall, 1989.
Den vollen Inhalt der Quelle findenMike, Resso, und Bogatin Eric, Hrsg. Signal integrity characterization techniques. Chicago, Ill: International Engineering Consortium, 2008.
Den vollen Inhalt der Quelle findenD, Campbell. Polymer characterization: Physical techniques. London: Chapman and Hall, 1989.
Den vollen Inhalt der Quelle findenD, Campbell. Polymer characterization: Physical techniques. 2. Aufl. Cheltenham, Glos., U.K: S. Thornes, 2000.
Den vollen Inhalt der Quelle findenOrtiz Ortega, Euth, Hamed Hosseinian, Ingrid Berenice Aguilar Meza, María José Rosales López, Andrea Rodríguez Vera und Samira Hosseini. Material Characterization Techniques and Applications. Singapore: Springer Singapore, 2022. http://dx.doi.org/10.1007/978-981-16-9569-8.
Der volle Inhalt der QuelleProvder, Theodore, Marek W. Urban und Howard G. Barth, Hrsg. Hyphenated Techniques in Polymer Characterization. Washington, DC: American Chemical Society, 1994. http://dx.doi.org/10.1021/bk-1994-0581.
Der volle Inhalt der QuelleBuchteile zum Thema "Characterization techniques for microelectroniq"
Herrera Ramirez, Jose Martin, Raul Perez Bustamante, Cesar Augusto Isaza Merino und Ana Maria Arizmendi Morquecho. „Characterization Techniques“. In Unconventional Techniques for the Production of Light Alloys and Composites, 129–65. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-48122-3_8.
Der volle Inhalt der QuelleMeredith, G. R. „Characterization Techniques“. In Nonlinear Optical Effects in Organic Polymers, 385–87. Dordrecht: Springer Netherlands, 1989. http://dx.doi.org/10.1007/978-94-009-2295-2_34.
Der volle Inhalt der QuelleHernández Hernández, Marla Berenice, Mario Alberto García-Ramírez, Yaping Dan, Josué A. Aguilar-Martínez, Bindu Krishnan und Sadasivan Shaji. „Characterization Techniques“. In Semiconductors, 95–126. Cham: Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-02171-9_3.
Der volle Inhalt der QuelleEigler, Siegfried, und Ayrat M. Dimiev. „Characterization Techniques“. In Graphene Oxide, 85–120. Chichester, UK: John Wiley & Sons, Ltd, 2016. http://dx.doi.org/10.1002/9781119069447.ch3.
Der volle Inhalt der QuelleHerman, Marian A., und Helmut Sitter. „Characterization Techniques“. In Molecular Beam Epitaxy, 135–227. Berlin, Heidelberg: Springer Berlin Heidelberg, 1996. http://dx.doi.org/10.1007/978-3-642-80060-3_4.
Der volle Inhalt der QuellePampillón Arce, María Ángela. „Characterization Techniques“. In Growth of High Permittivity Dielectrics by High Pressure Sputtering from Metallic Targets, 41–62. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-66607-5_3.
Der volle Inhalt der QuelleArya, Sandeep, und Prerna Mahajan. „Characterization Techniques“. In Solar Cells, 211–35. Singapore: Springer Nature Singapore, 2023. http://dx.doi.org/10.1007/978-981-99-7333-0_8.
Der volle Inhalt der QuellePurkait, Mihir Kumar, und Randeep Singh. „Characterization Techniques“. In Membrane Technology in Separation Science, 101–29. Boca Raton : Taylor & Francis, [2018]: CRC Press, 2018. http://dx.doi.org/10.1201/9781315229263-4.
Der volle Inhalt der QuellePanoth, Deepthi, Kunnambeth M. Thulasi, Fabeena Jahan, Sindhu Thalappan Manikkoth, Divya Puthussery, Baiju Kizhakkekilikoodayil Vijayan und Anjali Paravannoor. „Characterization Techniques“. In Supercapacitors and Their Applications, 87–104. Boca Raton: CRC Press, 2023. http://dx.doi.org/10.1201/9781003258384-6.
Der volle Inhalt der QuelleBolokang, A. S., und M. N. Mathabathe. „Characterization Techniques“. In Advanced Materials Processing and Manufacturing, 113–75. New York: CRC Press, 2023. http://dx.doi.org/10.1201/9781003356714-6.
Der volle Inhalt der QuelleKonferenzberichte zum Thema "Characterization techniques for microelectroniq"
Motooka, Teruaki, T. Iwanaga und M. Koutani. „Ellipsometric characterization techniques for Si processing technologies“. In Microelectronic Manufacturing '95, herausgegeben von John K. Lowell, Ray T. Chen und Jagdish P. Mathur. SPIE, 1995. http://dx.doi.org/10.1117/12.221191.
Der volle Inhalt der QuelleCarpio, Ronald A., und Jon Taylor. „Advanced optical characterization techniques for borophosphosilicate films“. In Microelectronic Manufacturing '95, herausgegeben von John K. Lowell, Ray T. Chen und Jagdish P. Mathur. SPIE, 1995. http://dx.doi.org/10.1117/12.221205.
Der volle Inhalt der QuelleDržík, Milan. „Laser and optical measurement techniques for characterization of microelectronic components“. In SPIE Proceedings, herausgegeben von Anton Štrba, Dagmar Senderákova und Miroslav Hrabovský. SPIE, 2005. http://dx.doi.org/10.1117/12.638919.
Der volle Inhalt der QuellePaniez, Patrick J., Benedicte P. Mortini, Severine Gally, Alain Prola, Charles Rosilio und Pierre-Olivier Sassoulas. „Understanding advanced lithographic materials: challenges and new characterization techniques“. In Microelectronic Manufacturing Technologies, herausgegeben von Chris A. Mack und Tom Stevenson. SPIE, 1999. http://dx.doi.org/10.1117/12.346879.
Der volle Inhalt der QuelleDrzik, Milan, und Juraj Chlpik. „Mechanical characterization of microelectronic structures by optical vibrational measurements“. In Sixth International Conference on Vibration Measurements by Laser Techniques: Advances and Applications. SPIE, 2004. http://dx.doi.org/10.1117/12.579566.
Der volle Inhalt der QuelleCristoloveanu, S., M. Bawedin und I. Ionica. „Special characterization techniques for advanced FDSOI process“. In 2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S). IEEE, 2015. http://dx.doi.org/10.1109/s3s.2015.7333543.
Der volle Inhalt der QuelleBoostandoost, M., X. Ycaza, R. Leihkauf, U. Kerst und C. Boit. „Challenges for Parametric Analysis of the Solar Cells Using Failure Analysis Technique Developed for the Microelectronics“. In ISTFA 2012. ASM International, 2012. http://dx.doi.org/10.31399/asm.cp.istfa2012p0255.
Der volle Inhalt der QuelleFurlong, Cosme, und Ryszard J. Pryputniewicz. „Advanced OEH Methodology for Evaluation of Microelectronics and Packaging“. In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-39508.
Der volle Inhalt der QuelleOgita, Yoh-Ichiro, Hiroshi Shinohara, Tsuyoshi Sawanobori und Masaki Kurokawa. „Silicon wafer subsurface characterization with blue-laser/microwave and UV-laser/millimeter-wave photoconductivity techniques“. In Microelectronic Manufacturing, herausgegeben von Sergio A. Ajuria und Tim Z. Hossain. SPIE, 1998. http://dx.doi.org/10.1117/12.324421.
Der volle Inhalt der QuelleWise, Michael L., und Stephen W. Downey. „Characterization of Semiconductor Materials by the Photoionization of Sputtered Neutrals Using Ultra-High Laser Intensities“. In Laser Applications to Chemical and Environmental Analysis. Washington, D.C.: Optica Publishing Group, 1996. http://dx.doi.org/10.1364/lacea.1996.lfb.6.
Der volle Inhalt der QuelleBerichte der Organisationen zum Thema "Characterization techniques for microelectroniq"
Rossabi, J., und S. E. Nave. Characterization of DNAPL Using Fluorescence Techniques. Office of Scientific and Technical Information (OSTI), März 1998. http://dx.doi.org/10.2172/633949.
Der volle Inhalt der QuelleSiderius, Martin. Acoustic Characterization Techniques for Shallow Water. Fort Belvoir, VA: Defense Technical Information Center, September 2003. http://dx.doi.org/10.21236/ada629541.
Der volle Inhalt der QuelleAbraham, M. M. (Optical characterization techniques applied to ceramic oxides). Office of Scientific and Technical Information (OSTI), Oktober 1990. http://dx.doi.org/10.2172/6493049.
Der volle Inhalt der QuelleRagland, William. Evaluation of Characterization Techniques for Carbon-Carbon Composites. Fort Belvoir, VA: Defense Technical Information Center, Mai 1992. http://dx.doi.org/10.21236/ada252693.
Der volle Inhalt der QuelleCleaver, A. E., P. Huntsman, C. J. Rickwood, E. Berryman, J. Cole, H. P. White, L. He und P. Unger. Fugitive dust monitoring and characterization techniques: challenges and opportunities. Natural Resources Canada/CMSS/Information Management, 2022. http://dx.doi.org/10.4095/g274826.
Der volle Inhalt der QuelleGlen, Crystal Chanea, Andres L. Sanchez, Gabriel Anthony Lucero, Randal L. Schmitt, Mark S. Johnson, Matthew S. Tezak und Brandon Lee Servantes. Aerosol characterization study using multi-spectrum remote sensing measurement techniques. Office of Scientific and Technical Information (OSTI), September 2013. http://dx.doi.org/10.2172/1096516.
Der volle Inhalt der QuelleBeechem, Iii, Thomas Edwin, Justin Raymond Serrano und Patrick E. Hopkins. Simultaneous electronic and lattice characterization using coupled femtosecond spectroscopic techniques. Office of Scientific and Technical Information (OSTI), September 2009. http://dx.doi.org/10.2172/1097197.
Der volle Inhalt der QuelleMeeks, A. M., J. M. Keller, J. M. Giaquinto und T. Ross. Improved separation techniques for the characterization of radioactive waste samples. Office of Scientific and Technical Information (OSTI), Dezember 1994. http://dx.doi.org/10.2172/28208.
Der volle Inhalt der QuelleGala, H., und R. Hucko. Application of surface and bulk characterization techniques for coal preparation. Office of Scientific and Technical Information (OSTI), Januar 1990. http://dx.doi.org/10.2172/6994530.
Der volle Inhalt der QuelleTaylor, L. T., J. W. Hellgeth und A. Sequeira. Coal liquefaction process streams characterization and evaluation. Chromatographic and spectroscopic techniques. Office of Scientific and Technical Information (OSTI), Januar 1992. http://dx.doi.org/10.2172/10148085.
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