Auswahl der wissenschaftlichen Literatur zum Thema „Augmented Metrology“
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Zeitschriftenartikel zum Thema "Augmented Metrology"
Poon, Ting-Chung, Yaping Zhang, Liangcai Cao und Hiroshi Yoshikawa. „Editorial on Special Issue “Holography, 3-D Imaging and 3-D Display”“. Applied Sciences 10, Nr. 20 (11.10.2020): 7057. http://dx.doi.org/10.3390/app10207057.
Der volle Inhalt der QuelleSiv, Julie, Rafael Mayer, Guillaume Beaugrand, Guillaume Tison, Rémy Juvénal und Guillaume Dovillaire. „Testing and characterization of challenging optics and optical systems with Shack Hartmann wavefront sensors“. EPJ Web of Conferences 215 (2019): 06003. http://dx.doi.org/10.1051/epjconf/201921506003.
Der volle Inhalt der QuelleNawab, Rahma, und Angela Davies Allen. „Low-Cost AR-Based Dimensional Metrology for Assembly“. Machines 10, Nr. 4 (30.03.2022): 243. http://dx.doi.org/10.3390/machines10040243.
Der volle Inhalt der QuelleKerst, Thomas, Mohammad Bitarafan, Laura Jokinen, Ilkka Alasaarela, Seppo Tillanen, David Zautasvili und Nikhil Pachhandara. „82‐3: Rapid AR/VR Device Eye‐Box Measurement Using a Wide‐FOV Lens“. SID Symposium Digest of Technical Papers 54, Nr. 1 (Juni 2023): 1155–57. http://dx.doi.org/10.1002/sdtp.16779.
Der volle Inhalt der QuelleArpaia, Pasquale, Egidio De Benedetto, Concetta Anna Dodaro, Luigi Duraccio und Giuseppe Servillo. „Metrology-Based Design of a Wearable Augmented Reality System for Monitoring Patient’s Vitals in Real Time“. IEEE Sensors Journal 21, Nr. 9 (01.05.2021): 11176–83. http://dx.doi.org/10.1109/jsen.2021.3059636.
Der volle Inhalt der QuelleGonçalves, GL, JU Delgado und FB Razuck. „The use of Augmented Reality for the teaching of dosimetry and metrology of ionizing radiation at IRD“. Journal of Physics: Conference Series 1826, Nr. 1 (01.03.2021): 012041. http://dx.doi.org/10.1088/1742-6596/1826/1/012041.
Der volle Inhalt der QuelleHo, P. T., J. A. Albajez, J. A. Yagüe und J. Santolaria. „Preliminary study of Augmented Reality based manufacturing for further integration of Quality Control 4.0 supported by metrology“. IOP Conference Series: Materials Science and Engineering 1193, Nr. 1 (01.10.2021): 012105. http://dx.doi.org/10.1088/1757-899x/1193/1/012105.
Der volle Inhalt der QuelleZhao, Lei, und Chaohao Wang. „50.2: Invited Paper: A Closer Look: Advancements in Near‐Eye Display Testing and Metrology“. SID Symposium Digest of Technical Papers 54, S1 (April 2023): 354–60. http://dx.doi.org/10.1002/sdtp.16303.
Der volle Inhalt der QuellePrusakov, A. N., V. V. Popadyev und V. F. Pankin. „The Working Week of the International Federation of Surveyors under the motto “From digitalization to augmented reality”“. Geodesy and Cartography 926, Nr. 8 (20.09.2017): 25–38. http://dx.doi.org/10.22389/0016-7126-2017-926-8-25-38.
Der volle Inhalt der QuelleĆirić, Ivan, Milan Banić, Miloš Simonović, Aleksandar Miltenović, Dušan Stamenković und Vlastimir Nikolić. „TOWARDS MACHINE VISION BASED RAILWAY ASSETS PREDICTIVE MAINTENANCE“. Facta Universitatis, Series: Automatic Control and Robotics 19, Nr. 2 (08.12.2020): 125. http://dx.doi.org/10.22190/fuacr2002125c.
Der volle Inhalt der QuelleDissertationen zum Thema "Augmented Metrology"
Bourguignon, Thibaut. „Implémentation et évaluation de la mesure Overlay in-situ par microscopie électronique pour la production de puces électroniques“. Electronic Thesis or Diss., Université Grenoble Alpes, 2024. http://www.theses.fr/2024GRALT001.
Der volle Inhalt der QuelleIntegrated circuits are manufactured via a stack of various layers. The precise alignment of these layers, known as "overlay" (OVL), is critical to chip reliability. The specifications are very strict: on a 300mm-diameter wafer, each pattern must be aligned to within a few nanometres. Current methods, based on optical observation of dedicated test patterns, show their limitations in terms of representativeness and assessment of local variability.This thesis proposes an innovative approach, using scanning electron microscopy (SEM), to accurately measure these local variations and to understand the biases induced by the test patterns. To this end, an algorithm for measuring the overlay from SEM contours has been developed. By registering reference contours on the extracted contours, the overlay is measured directly on the product, without the need for a specific test pattern, even in the presence of partially masked levels.Following the evaluation of this method on synthetic images, its application to production wafers enabled us to quantify the local variability of the overlay on the product, highlighting deviations from on-line measurements, while revealing the limits of SEM-OVL metrology
Konferenzberichte zum Thema "Augmented Metrology"
Schmid, Stephan, und Dieter Fritsch. „Precision analysis of triangulations using forward-facing vehicle-mounted cameras for augmented reality applications“. In SPIE Optical Metrology, herausgegeben von Fabio Remondino und Mark R. Shortis. SPIE, 2017. http://dx.doi.org/10.1117/12.2269716.
Der volle Inhalt der QuelleMigukin, Artem, Vladimir Katkovnik und Jaakko Astola. „Optimal phase retrieval from multiple observations with Gaussian noise: augmented Lagrangian algorithm for phase objects“. In SPIE Optical Metrology, herausgegeben von Peter H. Lehmann, Wolfgang Osten und Kay Gastinger. SPIE, 2011. http://dx.doi.org/10.1117/12.889118.
Der volle Inhalt der QuelleGaglione, S., A. Angrisano, G. Castaldo, C. Gioia, A. Innac, L. Perrotta, G. Del Core und S. Troisi. „GPS/Barometer augmented navigation system: Integration and integrity monitoring“. In 2015 IEEE Metrology for Aerospace (MetroAeroSpace). IEEE, 2015. http://dx.doi.org/10.1109/metroaerospace.2015.7180647.
Der volle Inhalt der QuelleWinters, Daniel, Masashi Mitsui, Masamichi Ueda, Sven Sassning, Mohit Yadav, Patrik Langehanenberg und Jan-Hinrich Eggers. „High-precision 3D metrology for stacked diffractive augmented reality waveguides“. In Optifab 2023, herausgegeben von Jessica DeGroote Nelson und Blair L. Unger. SPIE, 2023. http://dx.doi.org/10.1117/12.2688509.
Der volle Inhalt der QuellePlopski, Alexander, Varunyu Fuvattanasilp, Jarkko Poldi, Takafumi Taketomi, Christian Sandor und Hirokazu Kato. „Efficient In-Situ Creation of Augmented Reality Tutorials“. In 2018 Workshop on Metrology for Industry 4.0 and IoT. IEEE, 2018. http://dx.doi.org/10.1109/metroi4.2018.8428320.
Der volle Inhalt der QuelleHua, Hong. „Lightweight, Low-cost Augmented Reality Displays Enabled by Freeform Optical Technology“. In Applied Industrial Optics: Spectroscopy, Imaging and Metrology. Washington, D.C.: OSA, 2013. http://dx.doi.org/10.1364/aio.2013.aw1b.4.
Der volle Inhalt der QuelleNotaros, Jelena, Milica Notaros, Manan Raval, Christopher V. Poulton, Matthew J. Byrd, Nanxi Li, Zhan Su et al. „Integrated Optical Phased Arrays for LiDAR, Communications, Augmented Reality, and Beyond“. In Applied Industrial Optics: Spectroscopy, Imaging and Metrology. Washington, D.C.: OSA, 2021. http://dx.doi.org/10.1364/aio.2021.m2a.3.
Der volle Inhalt der QuelleMacmahon, Nelson Sosa, Juan Manuel Ramírez Cortés und Leopoldo Altamirano Robles. „Simulator in Augmented Reality Environment for Natural Interaction for Assembling Electrical Equipment“. In Applied Industrial Optics: Spectroscopy, Imaging and Metrology. Washington, D.C.: OSA, 2012. http://dx.doi.org/10.1364/aio.2012.jtu5a.22.
Der volle Inhalt der QuelleKellogg, James, Kathleen Andrea-Liner, Jennifer Jennings, Steven Timms, Robert C. Keramidas, Johnnie Berry, Tony DeLaCruz et al. „Augmented reality assisted astronaut operations in space to upgrade the cold atom lab instrument“. In Quantum Sensing, Imaging, and Precision Metrology, herausgegeben von Selim M. Shahriar und Jacob Scheuer. SPIE, 2023. http://dx.doi.org/10.1117/12.2650750.
Der volle Inhalt der QuelleNeagu, Carina Sonia, Andreea Codruta Cojocariu, Cristian Zaharia, Mihai Rominu, Meda-Lavinia Negrutiu, Virgil-Florin Duma und Cosmin Sinescu. „The evaluation of dental adhesives augmented with magnetic nanoparticles“. In Advances in 3OM: Opto-Mechatronics, Opto-Mechanics, and Optical Metrology, herausgegeben von Jannick P. Rolland, Virgil-Florin Duma und Adrian G. H. Podoleanu. SPIE, 2022. http://dx.doi.org/10.1117/12.2613382.
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