Thematische Bibliographien / Ag-Sn-Sb alloy

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Auswahl der wissenschaftlichen Literatur zum Thema „Ag-Sn-Sb alloy“

Autor: Grafiati

Veröffentlicht am 28. Juni 2021

Zuletzt aktualisiert am 18. Februar 2022

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Zeitschriftenartikel zum Thema "Ag-Sn-Sb alloy"

Chen, Fang, Yun Fei Du, Rong Chang Zeng, Gui Sheng Gan und Chang Hua Du. „Thermodynamics of Oxidation on Pb-Free Solders at Elevated Temperature“. Materials Science Forum 610-613 (Januar 2009): 526–30. http://dx.doi.org/10.4028/www.scientific.net/msf.610-613.526.

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Based on the available thermodynamic and phase equilibria data, the thermodynamic criteria for oxidation in tin-based lead-free solders under soldering condition was deduced. The dependence of Gibbs free energy on temperature in Pb-free solder oxidation reaction was calculated by applying MATLAB program. The characteristics of oxidation reaction of a varity of solder alloy systems such as Sn-Ag, Sn-Cu, Sn-Sb, Sn-Zn, Sn-Ag-Cu and Sn-Pb eutectic alloys at elevated temperature were analyzed. The results suggested that zinc preferentially oxidized in Sn-Zn solder alloys in the elevated temperature state, while tin preferentially oxidized in the other alloys. The oxidation potential of the Sn-Zn eutectic alloys was higher than that of the pure tin at elevated temperature, whereas the oxidation potentials of Sn-Ag, Sn-Cu, Sn-Sb and Sn-Ag-Cu eutectic alloys were approxiately equal to that of the pure tin. All tin-based Pb-free solder alloys more easily oxidized than the Sn-Pb solder alloys. Oxidizability of these alloys followed in a decreasing order: Sn-Zn＞Sn-Sb＞Sn-Cu＞Sn-Ag＞Sn-Ag-Cu＞Sn-Pb.

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Wu, C. P., D. Q. Yi, S. Goto, C. H. Xu, W. Weng, J. M. Zhou und G. F. Xu. „Oxidation of Ag-Sn-Sb alloy powders“. Materials and Corrosion 65, Nr. 5 (11.07.2012): 522–30. http://dx.doi.org/10.1002/maco.201206542.

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Dahshan, Alaa, Horesh Kumar und Neeraj Mehta. „Role of some modifiers on the thermo-mechanical properties of Se90In10 chalcogenide glass (ChGs)“. European Physical Journal Applied Physics 94, Nr. 3 (Juni 2021): 31101. http://dx.doi.org/10.1051/epjap/2021210044.

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The studies on the micro-hardness of ChGs provide useful information regarding their straightforward involvement in the fabrication of sensors, fibers, and other optical elements for direct use in infrared optics. This work deals with the mechanical response of the glassy Se90In10 alloy under the influence of additives (Sn, Ag, Sb, and Ge). For this, we have determined the micro-hardness of all glassy alloys. Using the values of Vickers hardness (Hv), glass transition temperature (Tg), and present glasses, we have calculated the other significant thermo-mechanical parameters. The effect of Sn, Ag, Sb, and Ge additives on the micro-hardness of glassy Se90In10 alloy is also discussed.

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Li, Chaojun, Yanfu Yan, Tingting Gao und Guodong Xu. „The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder“. Materials 13, Nr. 19 (07.10.2020): 4443. http://dx.doi.org/10.3390/ma13194443.

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To obtain Sn-3.0Ag-0.5Cu-xSb (x = 0, 25, 28, and 31) high-temperature lead-free solder antimony was added to Sn-3.0Ag-0.5Cu solder. The microstructure, thermal properties, and mechanical behavior of the solder alloy prepared were studied by using JSM-5610LV scanning electron microscope, Germany STA409PC differential scanning calorimeter, AG-I250KN universal tensile testing machine, and other methods. The SEM-EDS results showed that after adding Sb, SnSb phase was formed in the β-Sn matrix phase. The newly formed SnSb phase and the existing Sb in the solder alloy can inhibit the generation of IMC and refine the IMC layer. The addition of Sb significantly increased the melting temperature of the solder alloy. Among them, the thermal performance of Sn-3.0Ag-0.5Cu-25Sb is the best. The melting temperature of Sn-3.0Ag-0.5Cu-25Sb is 332.91 °C and the solid–liquid line range of Sn-3.0Ag-0.5Cu-25Sb solder alloy is 313.28–342.02 °C. Its pasty range is 28.74 °C, lower than 30 °C, which is beneficial for soldering. The test results of the mechanical behavior of Sn-3.0Ag-0.5Cu-xSb solder alloy show that with the increase of Sb addition, the ultimate tensile strength of the solder alloy also increases. However, the change of the elongation of the solder alloy is the opposite. The ultimate tensile strength of the solder alloy increased from 29.45 MPa of Sn-3.0Ag-0.5Cu solder to 70.81 MPa of Sn-3.0Ag-0.5Cu-31Sb solder. The reason for the increase in the strength of the solder alloy is the reduction of the thickness of IMC and the solid solution hardening effect of Sb.

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Wang, Fu Li, Jing Chao Chen und Jie Yu. „First-Principles Calculations for Electrical Proterties of the Lead Anode Plate“. Advanced Materials Research 634-638 (Januar 2013): 1817–20. http://dx.doi.org/10.4028/www.scientific.net/amr.634-638.1817.

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Four kinds of fermi energy of lead anode plate were calculated by using first-principles. Different metals and different alloy elements of the fermi energy level were compared, the minimum electrode potential lead base alloy anode materials is known. The results calculations show that the adding alloy elements can reduce the electrode potential of the lead anode plate, four kinds of alloy systems Pb-Ag, Pb-Sb, Pb-Sr, Pb-Sn were calculated, the highest of fermi energy was Pb-Sb alloy. So the Pb-Sb alloy is expected to become the electrode potential minimum lead base alloy anode materials.

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Liu, G. X., Z. M. Guan, D. B. Williams und M. R. Notis. „A Study of DIGM in Ag/Cu system by AEM“. Proceedings, annual meeting, Electron Microscopy Society of America 48, Nr. 2 (12.08.1990): 416–17. http://dx.doi.org/10.1017/s042482010013568x.

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DIGM phenomenon is very similar to the diffusion process and the coupled migration of the reaction front occured in discontinuous precipitation. It is likely to postulate that DIGM may occur in the system where discontinuous precipitation appears. W. Kim and co-author have Investigated DIGM In six copper alloy systems (Ag/Cu, Mg/Cu, Sb/Cu, In/Cu, Cd/Cu and Sn/Cu) in which discontinuous precipitation has been found. In Kim s experiment, the diffusion treatments were conducted at 400 °C and 450 °C for 4 days, Kim found DIGM occurred in 4 systems, i. e. Sb/Cu, In/Cu, Cd/Cu and Sn/Cu, but in Ag/Cu and Mg/Cu systems no DIGM was found.In order to test whether there is DIGM or not in Ag/Cu system, we reexamlned the DIGM phenomenon in Ag/Cu under 400 °C and 480 °C for 5 days diffusion, finally DIGM was found in this system. In different segments of a same boundary the bulging directions and the migration distances may be different as indicated in Fig. 1.

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Nur, Monika, Naoya Yamaguchi und Fumiyuki Ishii. „Simple Model for Corrugation in Surface Alloys Based on First-Principles Calculations“. Materials 13, Nr. 19 (07.10.2020): 4444. http://dx.doi.org/10.3390/ma13194444.

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The structural stability of M/Ag(111)–3×3R30° surface alloys is systematically investigated by using first-principles calculations, where M is a member of group III (B, Al, Ga, In, Tl), IV (C, Si, Ge, Sn, Pb), and V (N, P, As, Sb, Bi) elements. We focus on the corrugation parameter d which is determined by the height of the M atom from the Ag atom in the plane of the top-most atom, and the relation between atomic radii and corrugations in M/Ag(111) is obtained. The tendencies of the corrugation parameter d can be understood by using a simple hard spherical atomic model. We introduce a new type of atomic radii determined by the corrugation in surface alloys, surface alloy atomic radii, which can be useful for rapid predictions of the structures of surface alloys, not only for M/Ag (111)–3×3R30° systems but also for other surface alloys.

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Chen, Zhiwen, Kun Ma, Li Liu, Ning-Cheng Lee, Guoyou Liu, Jiasheng Yan, Hui Li et al. „Mechanical Performance and Reliability of a Sn–Ag–Cu–Sb Alloy at Elevated Temperatures“. IEEE Transactions on Components, Packaging and Manufacturing Technology 11, Nr. 7 (Juli 2021): 1081–87. http://dx.doi.org/10.1109/tcpmt.2021.3093562.

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Musa, Sayyidah Amnah, Mohd Arif Anuar Mohd Salleh und Saud Norainiza. „Zn-Sn Based High Temperature Solder - A Short Review“. Advanced Materials Research 795 (September 2013): 518–21. http://dx.doi.org/10.4028/www.scientific.net/amr.795.518.

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The developments of lead-free solders have become a major concern to the researchers in electronic industry to replace the lead-containing materials. The concern is not just for low temperature solders but also for high temperature solders. The lead and lead-based compound are highly toxic which is dangerous to human health and environment. The highly suitable lead-free solder candidates for replacing high Pb high temperature solder are Au-Sn, Al-Zn, Zn-Sn, Sn-Sb, and Bi-Ag solders. However, Zn-Sn based solder has highly recommended as the best candidates in replacing high lead high temperature solder. This paper provides a short review of recent research on Zn-Sn based lead free high temperature solders with different additional alloying elements. The new novel alloy of Zn-Sn based for high temperature solder applications will be proposed in this paper.

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Wang, Yufei, Min Li, Haiyan Gao, Jun Wang und Baode Sun. „First-Principles Study on the Cu/Fe Interface Properties of Ternary Cu-Fe-X Alloys“. Materials 13, Nr. 14 (13.07.2020): 3112. http://dx.doi.org/10.3390/ma13143112.

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The supersaturated Fe in Cu is known to reduce the electrical conductivity of Cu severely. However, the precipitation kinetics of Fe from Cu are sluggish. Alloying is one of the effective ways to accelerate the aging precipitation of Cu-Fe alloys. Nucleation plays an important role in the early stage of aging. The interface property of Cu/γ–Fe is a key parameter in understanding the nucleation mechanism of γ-Fe, which can be obviously affected with the addition of alloying elements. In this paper, first principles calculations were carried out to investigate the influence of alloying elements on the interface properties, including the geometric optimizations, interfacial energy, work of adhesion and electronic structure. Based on the previous research, 14 elements including B, Si, P, Al, Ge, S, Mg, Ag, Cd, Sn, In, Sb, Zr and Bi were selected for investigation. Results showed that all these alloying elements tend to concentrate in the Cu matrix with the specific substitution position of the atoms determined by the binding energy between Fe and alloy element (X). The bonding strength of the Cu/γ-Fe interface will decrease obviously after adding Ag, Mg and Cd, while a drop in interfacial energy of Cu/γ–Fe will happen when alloyed with Al, B, S, P, Si, Ge, Sn, Zr, Bi, Sb and In. Further study of the electronic structure found that Al and Zr were not effective alloying elements.

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Dissertationen zum Thema "Ag-Sn-Sb alloy"

Klepárníková, Eliška. „Interakce poloroztavené slitiny s pevným materiálem při vzájemném pohybu“. Master's thesis, Vysoké učení technické v Brně. Fakulta strojního inženýrství, 2019. http://www.nusl.cz/ntk/nusl-442481.

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This thesis is deals with the suitability of Ag-Sn-Sb alloy for extrusion and selection of suitable materiál for the extruder nozzle. The theoretical part of this thesis deals with the general possibilities of 3D metal printing, especially the metal printing in the semi-solid phase and with it‘s problems. The experimental part describes the development of semi-solid alloys testing device and the research od the alloy and its interactions with solid materials in mutual motion. Analyzis of mechanical and chemical influence between alloy and solid material were performed by visual investigation and analysis of elements by EDS detector. The results of these analyzes led to the choise of nozzle material suitable for extrusion of Ag-Sn-Sb alloy.

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Stang, Eric Thomas. „Constitutive Modeling of Creep in Leaded and Lead-Free Solder Alloys Using Constant Strain Rate Tensile Testing“. Wright State University / OhioLINK, 2018. http://rave.ohiolink.edu/etdc/view?acc_num=wright1548338008633472.

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Konferenzberichte zum Thema "Ag-Sn-Sb alloy"

Lall, Pradeep, Geeta Limaye, Sandeep Shantaram und Jeff Suhling. „Effect of Isothermal Aging and High Strain Rate on Material Properties of Innolot“. In ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/ipack2013-73246.

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Industry migration to lead-free solders has resulted in a proliferation of a wide variety of solder alloy compositions. The most popular amongst these are the Tin-Silver-Copper (Sn-Ag-Cu or SAC) family of alloys like SAC105, SAC305 etc. Recent studies have highlighted the detrimental effects of isothermal aging on the material properties of these alloys. SAC alloys have shown up to 50% reduction in their initial elastic modulus and ultimate tensile strength within a few months of elevated temperature aging. This phenomenon has posed a severe design challenge across the industry and remains a road-block in the migration to Pb-free. Multiple compositions with additives to SAC have been proposed to minimize the effect of aging and creep while maintaining the melting temperatures, strength and cost at par with SAC. Innolot is a newly developed high-temperature, high-performance lead-free substitute by InnoRel™ targeting the automotive electronics segment. Innolot contains Nickel (Ni), Antimony (Sb) and Bismuth (Bi) in small proportions in addition to Sn, Ag and Cu. The alloy has demonstrated enhanced reliability under thermal cycling as compared to SAC alloys. In this paper, the high strain rate material properties of Innolot have been evaluated as the alloy ages at an elevated temperature of 50°C. The strain rates chosen are in the range of 1–100 per-second which are typical at second level interconnects subjected to drop-shock environments. The strain rates and elevated aging temperature have been chosen also to correspond to prior tests conducted on SAC105 and SAC305 alloys at this research center. This paper presents a comparison of material properties and their degradation in the three alloys — SAC105, SAC305 and Innolot. Full field strain measurements have been accomplished with the use of high speed imaging in conjunction with Digital Image Correlation (DIC). Ramberg-Osgood non-linear model parameters have been determined to curve-fit through the experimental data. The parameters have been implemented in Abaqus FE model to obtain full-field stresses which correlates with contours obtained experimentally by DIC.

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