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Auswahl der wissenschaftlichen Literatur zum Thema „3D Plastronics“
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Zeitschriftenartikel zum Thema "3D Plastronics"
Nguyen, Xuan Viet Linh, Tony Gerges, Pascal Bevilacqua, Jean-Marc Duchamp, Philippe Benech, Jacques Verdier, Philippe Lombard et al. „Radio-Frequency Energy Harvesting Using Rapid 3D Plastronics Protoyping Approach: A Case Study“. Journal of Low Power Electronics and Applications 13, Nr. 1 (17.02.2023): 19. http://dx.doi.org/10.3390/jlpea13010019.
Der volle Inhalt der QuelleGerges, Tony, Vincent Semet, Philippe Lombard, Bruno Allard und Michel Cabrera. „Rapid 3d-Plastronics Prototyping by Selective Metallization of 3d Printed Parts“. SSRN Electronic Journal, 2023. http://dx.doi.org/10.2139/ssrn.4329322.
Der volle Inhalt der QuelleGerges, Tony, Vincent Semet, Philippe Lombard, Bruno Allard und Michel Cabrera. „Rapid 3D-Plastronics prototyping by selective metallization of 3D printed parts“. Additive Manufacturing, Juni 2023, 103673. http://dx.doi.org/10.1016/j.addma.2023.103673.
Der volle Inhalt der QuelleGerges, Tony, Vincent Semet, Philippe Lombard, Sophie Gaillard, Michel Cabrera und Simon Auguste Lambert. „3D Plastronics for Smartly Integrated Magnetic Resonance Imaging Coils“. Frontiers in Physics 8 (28.07.2020). http://dx.doi.org/10.3389/fphy.2020.00240.
Der volle Inhalt der QuelleManderfeld, Emily, Louisa Vogler und Axel Rosenhahn. „Fouling Inhibition by Replenishable Plastrons on Microstructured, Superhydrophobic Carbon‐Silicone Composite Coatings“. Advanced Materials Interfaces, 22.01.2024. http://dx.doi.org/10.1002/admi.202300964.
Der volle Inhalt der QuelleDissertationen zum Thema "3D Plastronics"
Guérin, Thomas. „Développement d'encres fonctionnelles pour l'In-Mold Electronics“. Electronic Thesis or Diss., Lyon, INSA, 2024. http://www.theses.fr/2024ISAL0089.
Der volle Inhalt der QuelleThis thesis explores the emerging field of 3D plastronics, which merges electronics and plastics engineering to integrate electronic circuits on 3D polymer substrates. The work focuses on the development of conductive inks for the In-Mold Electronics (IME) process, a promising technique for the high-volume production of plastronic devices, particularly for human-machine interfaces (HMIs). The IME process involves several steps: printing conductive tracks on a thin polycarbonate film using conductive ink, transferring the electronic components onto the film and connecting them to the circuit by bonding, thermoforming the film in 3D, and 3D overmolding by injection of thermoplastic. After a literature review on plastronics and IME, the thesis proposes the study of different formulations of conductive inks, focusing on those composed of an organic polymer matrix containing micrometric silver fillers. A methodology was set up to characterize the inks at each stage of the process, in terms of electrical resistivity, adhesion, stretching and shear under stress during the printing, thermoforming and overmolding stages. Polycarbonate was used as a reference material for the film and the overmolding material. Several conductive inks were developed from organic materials derived from petrochemicals or bio-based materials. From petro-based materials, we obtained low-resistivity inks (26 µΩ.cm) and with a high deformation capacity by thermoforming. From bio-based materials, new organic matrices were formulated to obtain more responsible inks. The -bio- inks are distinguished by their respect for the environment thanks to a biodegradable binder, a bio-based green solvent and recyclable silver. The performances reach a low resistivity of 20 µΩ.cm and with a high deformation capacity by thermoforming. A -bio- ink was overmolded with polycarbonate, and an IME demonstrator was produced. However, some difficulties persist and limit the application potential of these formulations. Among them, critical cases of delamination and rupture of the conductive tracks during thermoforming. Also, possible washing out of the inks and the detachment of the electronic components during the injection step can occur. These limitations are linked to the geometric constraints generated by 3D and have been studied. However, due to time constraints, not all the inks could be tested until the production of a demonstrator
Konferenzberichte zum Thema "3D Plastronics"
Nguyen, Xuan Viet Linh, Tony Gerges, Jean-Marc Duchamp, Philippe Benech, Jacques Verdier, Philippe Lombard, Michel Cabrera und Bruno Allard. „3D Plastronics Radio Frequency Energy Harvester on Stereolithography Parts“. In 2022 Wireless Power Week (WPW). IEEE, 2022. http://dx.doi.org/10.1109/wpw54272.2022.9854010.
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